ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS

Abstract

A solution for electroless deposition of nickel is provided. A reducing agent of Ti 3+ ion is provided to the solution. Ni 2+ ions are provided to the solution.

What is claimed is: 
     
         1 . A solution for electroless deposition of nickel, comprising:
 a reducing agent of Ti 3+  ions; and   Ni 2+  ions.   
     
     
         2 . The solution, as recited in  claim 1 , further comprising amine ligands. 
     
     
         3 . The solution, as recited in  claim 2 , further comprising at least one of gluconate or tartrate ions. 
     
     
         4 . The solution, as recited in  claim 3 , wherein the solution has a pH between 5 and 5.5, inclusive. 
     
     
         5 . The solution, as recited in  claim 4 , further comprising Cl −  ions. 
     
     
         6 . The solution, as recited in  claim 5 , wherein a ratio of Ti 3+  to Ni 2+  ion is between 100:1 to 2:1. 
     
     
         7 . The method, as recited in  claim 6 , wherein the solution is boron, phosphorus, hydrazine, and formaldehyde free. 
     
     
         8 . A method for providing an electroless plating of a nickel containing layer, comprising:
 providing a Ti 3+  concentrated stock solution;   providing a Ni 2+  concentrated stock solution;   combining a flow from the Ti 3+  concentrated stock solution with a flow from the Ni 2+  concentrated stock solution and water to provide a mixed electrolyte for electrolessly depositing Ni; and   exposing a substrate to the mixed electrolyte for electrolessly depositing Ni.   
     
     
         9 . The method, as recited in  claim 8 , wherein exposing the wafer to the mixed electrolyte for electrolessly depositing Ni, comprises:
 providing a solution temperature between 20° to 25° C., inclusive; and   providing a pH of between 5 and 5.5, inclusive.   
     
     
         10 . The method, as recited in  claim 9 , further comprising disposing the mixed electrolyte solution. 
     
     
         11 . The method, as recited in  claim 10 , wherein the nickel containing layer is 99.9% pure nickel. 
     
     
         12 . The method, as recited in  claim 9 , further comprising reactivating the mixed electrolyte solution. 
     
     
         13 . The method, as recited in  claim 8 , wherein the Ti 3+  concentrated stock solution comprises a solution comprising TiCl 3 . 
     
     
         14 . The method, as recited in  claim 13 , wherein the Ni 2+  concentrated stock solution comprises a solution of NiSO 4  and ammonium hydroxide and sodium gluconate or gluconic acid. 
     
     
         15 . The method, as recited in  claim 14 , wherein the Ni 2+  concentrated stock solution has a shelf life of over a month. 
     
     
         16 . The method, as recited in  claim 15 , wherein the Ti 3+  concentrated stock solution has a shelf life of over a month. 
     
     
         17 . The method, as recited in  claim 14 , wherein the mixed electrolyte solution is boron, phosphorus, hydrazine, and formaldehyde free. 
     
     
         18 . The method, as recited in  claim 8 , wherein the mixed electrolyte solution is boron, phosphorus, hydrazine, and formaldehyde free. 
     
     
         19 . A method for providing an electroless plating of a nickel layer, comprising:
 providing a solution for electroless deposition of nickel, comprising:
 Ti 3+  ions; and 
 Ni 2+  ions, wherein a ratio of Ti 3+  ions to Ni 2+  ions is between 100:1 to 2:1; and 
   exposing a substrate to the solution for electroless deposition of nickel.   
     
     
         20 . The method, as recited in  claim 19 , wherein the providing the solution, provides the solution at a pH of between 5 and 5.5, inclusive, and at a temperature between 20° to 25° C., inclusive.