Inventor · disambiguated record
Eugenijus Norkus
Also filed as: NORKUS EUGENIJUS
12 granted patents·4 pending applications·96 citations·filing 2006–2023
89Inventor score
Files withLAM RES CORP11VALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOKSLU CENTRAS3NORKUS EUGENIJUS1VALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOSKLU CENTRAS1
Top patents by PatentIndex Score
16 records- 0192US9469902B2Electroless deposition of continuous platinum layerLAM RES CORP·Filed 2014·Granted Oct 18, 2016·13 cites·26 claims
- 0292US7306662B2Plating solution for electroless deposition of copperLAM RES CORP·Filed 2006·Granted Dec 11, 2007·22 cites·20 claims
- 0392US7297190B1Plating solutions for electroless deposition of copperLAM RES CORP·Filed 2006·Granted Nov 20, 2007·36 cites·25 claims
- 0488US7794530B2Electroless deposition of cobalt alloysLAM RES CORP·Filed 2006·Granted Sep 14, 2010·10 cites·13 claims
- 0578US8298325B2Electroless deposition from non-aqueous solutionsNORKUS EUGENIJUS·Filed 2010·Granted Oct 30, 2012·3 cites·17 claims
- 0676US7682431B1Plating solutions for electroless deposition of rutheniumLAM RES CORP·Filed 2008·Granted Mar 23, 2010·3 cites·18 claims
- 0773US9428836B2Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agentsLAM RES CORP·Filed 2014·Granted Aug 30, 2016·3 cites·20 claims
- 0869US7686875B2Electroless deposition from non-aqueous solutionsLAM RES CORP·Filed 2008·Granted Mar 30, 2010·4 cites·18 claims
- 0963US9499913B2Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agentLAM RES CORP·Filed 2014·Granted Nov 22, 2016·1 cites·20 claims
- 1063US2025075330A1Plating solution for high rate electroless deposition of copperVALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOSKLU CENTRAS·Filed 2023·Application pending·0 cites
- 1160US10982328B2Method for formation of electro-conductive traces on polymeric article surfaceVALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOKSLU CENTRAS·Filed 2017·Granted Apr 20, 2021·1 cites·11 claims
- 1259US12336114B2Method for selective metallisation of inorganic dielectrics or semiconductorsVALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOKSLU CENTRAS·Filed 2023·Granted Jun 17, 2025·0 cites·21 claims
- 1359US7988774B2Electroless deposition of cobalt alloysLAM RES CORP·Filed 2010·Granted Aug 2, 2011·0 cites·17 claims
- 1454US2015307994A1ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTSLAM RES CORP·Filed 2014·Application pending·0 cites
- 1547US2022064801A1Method for electroless nickel deposition onto copper without activation with palladiumVALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECH MOKSLU CENTRAS·Filed 2020·Application pending·0 cites
- 1642US2015307995A1ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTSLAM RES CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →