Inventor · disambiguated record
An-Hong Liu
Also filed as: LIU AN-HONG
32 granted patents·24 pending applications·555 citations·filing 2001–2013
97Inventor score
Files withCHIPMOS TECHNOLOGIES INC25CHIPMOS TECHNOLOGIES BERMUDA12LIU AN HONG5WANG DAVID WEI5HUANG HSIANG-MING2
Top patents by PatentIndex Score
56 records- 0195US6534853B2Semiconductor wafer designed to avoid probed marks while testingCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted Mar 18, 2003·141 cites·14 claims
- 0292US6946860B2Modularized probe headCHIPMOS TECHNOLOGIES INC·Filed 2003·Granted Sep 20, 2005·57 cites·7 claims
- 0391US7973310B2Semiconductor package structure and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Jul 5, 2011·37 cites·44 claims
- 0491US7088118B2Modularized probe card for high frequency probingCHIPMOS TECHNOLOGIES INC·Filed 2004·Granted Aug 8, 2006·55 cites·2 claims
- 0588US8269352B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·10 cites·13 claims
- 0688US7372286B2Modular probe cardCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted May 13, 2008·17 cites·6 claims
- 0788US6853205B1Probe card assemblyCHIPMOS TECHNOLOGIES BERMUDA·Filed 2003·Granted Feb 8, 2005·41 cites·9 claims
- 0886US7129730B2Probe card assemblyCHIPMOS TECHNOLOGIES INC·Filed 2004·Granted Oct 31, 2006·35 cites·6 claims
- 0985US7554197B2High frequency IC package and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jun 30, 2009·14 cites·12 claims
- 1085US7420267B2Image sensor assembly and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Sep 2, 2008·9 cites·7 claims
- 1179US6686615B1Flip-chip type semiconductor device for reducing signal skewCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Feb 3, 2004·35 cites·5 claims
- 1279US6621710B1Modular probe card assemblyCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Sep 16, 2003·29 cites·1 claims
- 1373US6395622B1Manufacturing process of semiconductor devicesCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted May 28, 2002·16 cites·6 claims
- 1468US8269351B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·2 cites·11 claims
- 1568US8264068B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 11, 2012·2 cites·9 claims
- 1668US7372135B2Multi-chip image sensor moduleCHIPMOS TECHNOLOGIES BERMEDA L·Filed 2005·Granted May 13, 2008·6 cites·10 claims
- 1768US7368809B2Pillar grid array packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted May 6, 2008·4 cites·7 claims
- 1866US7642639B2COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the sameCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 5, 2010·3 cites·24 claims
- 1966US7316065B2Method for fabricating a plurality of elastic probes in a rowCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jan 8, 2008·4 cites·5 claims
- 2065US6781392B1Modularized probe card with compressible electrical connection deviceCHIPMOS TECHNOLOGIES LTD·Filed 2003·Granted Aug 24, 2004·14 cites·18 claims
- 2164US6812720B1Modularized probe card with coaxial transmittersCHIPMOS TECHNOLOGIES BERMUDA·Filed 2003·Granted Nov 2, 2004·11 cites·11 claims
- 2252US7140101B2Method for fabricating anisotropic conductive substrateCHIPMOS TECHNOLOGIES INC·Filed 2003·Granted Nov 28, 2006·4 cites·10 claims
- 2348US6605480B2Wafer level packaging for making flip-chipsCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted Aug 12, 2003·4 cites·8 claims
- 2448US2007152148A1Package structure of image sensor deviceCHIPMOS TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
- 2547US8338935B2Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the sameLIU AN HONG·Filed 2011·Granted Dec 25, 2012·0 cites·19 claims
- 2646US8564954B2Thermally enhanced electronic packageHUANG TZU HSIN·Filed 2010·Granted Oct 22, 2013·1 cites·5 claims
- 2746US2006087017A1Image sensor packageCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 2846US2007080452A1Bump structure and its forming methodCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2946US2006086890A1Package structure of image sensor deviceCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 3045US7477065B2Method for fabricating a plurality of elastic probes in a rowCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 13, 2009·1 cites·6 claims
- 3144US2011291268A1Semiconductor wafer structure and multi-chip stack structureWANG DAVID WEI·Filed 2010·Application pending·0 cites
- 3244US2006091510A1Probe card interposerCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 3344US2011291267A1Semiconductor wafer structure and multi-chip stack structureWANG DAVID WEI·Filed 2010·Application pending·0 cites
- 3443US9307676B2Thermally enhanced electronic packageCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Apr 5, 2016·0 cites·20 claims
- 3543US8550345B2RFID real-time information system accommodated to semiconductor supply chainHUANG CHENG-FANG·Filed 2008·Granted Oct 8, 2013·0 cites·16 claims
- 3643US7696443B2Electronic device with a warped spring connectorCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Apr 13, 2010·0 cites·17 claims
- 3742US7005054B2Method for manufacturing probes of a probe cardCHIPMOS TECHNOLOGIES INC·Filed 2002·Granted Feb 28, 2006·0 cites·6 claims
- 3841US2006231750A1Image sensor module packageCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 3941US2009236741A1Conductive structure of a chip and method for manufacturing the sameHUANG HSIANG-MING·Filed 2008·Application pending·0 cites
- 4041US2006086899A1Structure of image sensor packageCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 4141US2009283905A1Conductive structure of a chipHUANG HSIANG-MING·Filed 2008·Application pending·0 cites
- 4240US7370416B2Method of manufacturing an injector plateCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted May 13, 2008·0 cites·9 claims
- 4340US2006043538A1Bump structure of an opto-electronic chipCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 4438US2007222465A1Probe head with vertical probes, method for manufacturing the probe head and probe card using the probe headCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 4537US6751760B2Method and system for performing memory repair analysisCHIPMOS TECHNOLOGIES INC·Filed 2001·Granted Jun 15, 2004·3 cites·8 claims
- 4637US2008124828A1Fabrication processes of a MEMS alloy probeCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 4737US2007085554A1Replaceable modular probe headCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 4834US2006022317A1Chip-under-tape package structure and manufacture thereofLIU AN-HONG·Filed 2005·Application pending·0 cites
- 4934US2013119530A1Thermally enhanced packaging structureLIU AN HONG·Filed 2012·Application pending·0 cites
- 5033US2013049787A1Method of testing stacked semiconductor device structureYI CHI-MING·Filed 2012·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when An-Hong Liu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →