Inventor · disambiguated record
Aniket Patil
Also filed as: PATIL ANIKET · PATIL ANIKET NITIN
47 granted patents·69 pending applications·26 citations·filing 2018–2024
95Inventor score
Top patents by PatentIndex Score
116 records- 0196US11682607B2Package having a substrate comprising surface interconnects aligned with a surface of the substrateQUALCOMM INC·Filed 2021·Granted Jun 20, 2023·8 cites·16 claims
- 0286US11444019B2Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the packageQUALCOMM INC·Filed 2020·Granted Sep 13, 2022·2 cites·28 claims
- 0379US11289453B2Package comprising a substrate and a high-density interconnect structure coupled to the substrateQUALCOMM INC·Filed 2020·Granted Mar 29, 2022·1 cites·27 claims
- 0474US2024421105A1Inkjet printing dedicated test pinsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0572US2024363514A1Package comprising a package substrate that includes an encapsulated portion with interconnection portion blocksQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0671US2024218508A1Runout and wobble measurement fixturesASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 0769US11946137B2Runout and wobble measurement fixturesASM IP HOLDING BV·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
- 0869US2024363513A1Package comprising a package substrate that includes an encapsulated portion with interconnection portion blocksQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0962US2025379135A1Package comprising an integrated device and an offset memory deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1061US12381174B2Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methodsQUALCOMM INC·Filed 2022·Granted Aug 5, 2025·0 cites·23 claims
- 1161US2025357308A1Deep trench capacitor (dtc) pad on solder resist (sr) layerQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1261US2025316575A1Die-first metallization structure and substrate interposer hybrid packageQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1361US2025379129A1Conductive structure and interconnects for electrically connecting a substrate and an interposerQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1461US2025372543A1Package comprising a trench capacitor device with a metallization portion comprising bar metallization interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1560US12512412B2Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methodsQUALCOMM INC·Filed 2023·Granted Dec 30, 2025·0 cites·29 claims
- 1660US2025273626A1Package comprising integrated devices and an interconnection deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1760US2025293197A1Package comprising integrated devices and wire bonds coupled to integrated devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1860US2024319455A1Package comprising an optical integrated deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1960US2025323136A1Integrated circuit (ic) package including two substrates and vertical interconnects coupling the two substrates, the vertical interconnects comprising a metal ball and metal pin combination to address an increased distance between substratesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2060US2022320016A1Inkjet printing dedicated test pinsQUALCOMM INC·Filed 2021·Application pending·0 cites
- 2160US2025273522A1Package comprising a substrate including a via interconnect with a partial concentric planar cross sectionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2260US2025259919A1Package comprising a substrate and a passive deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2359USD947913SSusceptor shaftASM IP HOLDING BV·Filed 2019·Granted Apr 5, 2022·7 cites·1 claims
- 2459US2025293130A1Die package with entangled vertical interconnects coupled to a routing substrate for reduced routing substrate layers, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2559US2025246532A1Substrates including raised interconnects disposed on a die-side surface to support increased interconnect density and related methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2659US2025239518A1PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBUTION LAYER(S) (RDL(s)) FOR ALIGNING CAPACITOR TERMINALS CONNECTIONS TO SEMICONDUCTOR DIE IN AN INTEGRATED CIRCUIT (IC) PACKAGE, AND RELATED FABRICATION METHODSQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2759US2025246531A1Integrated circuit (ic) package with die interconnects terminating at multiple metallization layers in a substrate to reduce spacing requirements between die interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2859US2025300112A1Integrated device comprising extended metallization region for pillar interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2959US2025357238A1Package including substrates, integrated devices, and heat slugQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3059US2025273612A1Package comprising a substrate including an inter substrate interconnect structure comprising an inner interconnectQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3159US2025125244A1Interposer connection structures based on wire bondingQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3258US11749611B2Package with a substrate comprising periphery interconnectsQUALCOMM INC·Filed 2021·Granted Sep 5, 2023·0 cites·23 claims
- 3358US2025079277A1Integrated circuit device having a substrate with a stepped configuration to accommodate at least two different solder ball sizesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3458US2025218966A1Substrate having asymmetric metallization structures disposed on opposite sides of a central coreQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3558US2025192010A1Interposer substrate including offset core layerQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3658US2025385169A1Device comprising wall pillar interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3757US11804645B2Multi-sided antenna module employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Oct 31, 2023·0 cites·32 claims
- 3857US2025140700A1Substrate including conductive stud on pad structureQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3957US2024429141A1Package comprising sidewall interconnects configured for power routingQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4057US2025300035A1Package comprising an embedded heat pipeQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4157US2025357288A1Package comprising a substrate, an integrated device and an interconnect over the integrated deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4257US2025329648A1Conductive paste vss shorting for ground bumpsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4357US2025191989A1Package comprising a substrate with cavity and an integrated device with a step back sideQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4457US2025125234A1Interposer connection structures based on wire bondingQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4557US2025096094A1Io interconnect cage structure for package form reductionQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4657US2025379134A1Integrated circuit package comprising a substrate and a solder joint coupled to a corner interconnect structure of the substrate to improve the reliability of the packageQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4757US2025132292A1Device with side-by-side integrated circuit devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4856US12230552B2Recess structure for padless stack viaQUALCOMM INC·Filed 2021·Granted Feb 18, 2025·0 cites·30 claims
- 4956US11769732B2Integrated circuit (IC) with reconstituted die interposer for improved connectivity, and related methods of fabricationQUALCOMM INC·Filed 2020·Granted Sep 26, 2023·0 cites·20 claims
- 5056US11296024B2Nested interconnect structure in concentric arrangement for improved package architectureQUALCOMM INC·Filed 2020·Granted Apr 5, 2022·0 cites·17 claims
Showing the top 50 of 116 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →