Inventor · disambiguated record
Anindya Poddar
Also filed as: PODDAR ANINDYA
65 granted patents·36 pending applications·719 citations·filing 1999–2025
98Inventor score
Top patents by PatentIndex Score
101 records- 0196US6607941B2Process and structure improvements to shellcase style packaging technologyNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 19, 2003·141 cites·17 claims
- 0295US9035422B2Multilayer high voltage isolation barrier in an integrated circuitTEXAS INSTRUMENTS INC·Filed 2013·Granted May 19, 2015·42 cites·15 claims
- 0393US9663357B2Open cavity package using chip-embedding technologyTEXAS INSTRUMENTS INC·Filed 2015·Granted May 30, 2017·12 cites·20 claims
- 0493US7015587B1Stacked die package for semiconductor devicesNAT SEMICONDUCTOR CORP·Filed 2004·Granted Mar 21, 2006·89 cites·10 claims
- 0592US8674418B2Method and apparatus for achieving galvanic isolation in package having integral isolation mediumPODDAR ANINDYA·Filed 2011·Granted Mar 18, 2014·14 cites·15 claims
- 0691US12021019B2Semiconductor device package with thermal padTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 25, 2024·2 cites·20 claims
- 0791US7705476B2Integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2007·Granted Apr 27, 2010·23 cites·23 claims
- 0891US6664615B1Method and apparatus for lead-frame based grid array IC packagingNAT SEMICONDUCTOR CORP·Filed 2001·Granted Dec 16, 2003·68 cites·22 claims
- 0990US12160219B2Metal ribs in electromechanical devicesTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 3, 2024·1 cites·28 claims
- 1090US8716830B2Thermally efficient integrated circuit packagePODDAR ANINDYA·Filed 2011·Granted May 6, 2014·14 cites·11 claims
- 1190US7703993B1Wafer level optoelectronic package with fiber side insertionNAT SEMICONDUCTOR CORP·Filed 2008·Granted Apr 27, 2010·26 cites·17 claims
- 1289US12009336B2Packages with electrical fusesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 11, 2024·3 cites·19 claims
- 1389US8450151B1Micro surface mount device packagingPODDAR ANINDYA·Filed 2011·Granted May 28, 2013·13 cites·12 claims
- 1489US7354802B1Thermal release wafer mount tape with B-stage adhesiveNAT SEMICONDUCTOR CORP·Filed 2006·Granted Apr 8, 2008·16 cites·8 claims
- 1588US7615407B1Methods and systems for packaging integrated circuits with integrated passive componentsNAT SEMICONDUCTOR CORP·Filed 2008·Granted Nov 10, 2009·17 cites·20 claims
- 1687US11736085B2Metal ribs in electromechanical devicesTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 22, 2023·2 cites·25 claims
- 1787US7101620B1Thermal release wafer mount tape with B-stage adhesiveNAT SEMICONDUCTOR CORP·Filed 2004·Granted Sep 5, 2006·40 cites·11 claims
- 1886US7838974B2Intergrated circuit packaging with improved die bondingNAT SEMICONDUCTOR CORP·Filed 2008·Granted Nov 23, 2010·28 cites·16 claims
- 1985US7824963B2Inkjet printed leadframeNAT SEMICONDUCTOR CORP·Filed 2009·Granted Nov 2, 2010·9 cites·13 claims
- 2084US10541220B1Printed repassivation for wafer chip scale packagingTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 21, 2020·4 cites·26 claims
- 2182US7385297B1Under-bond pad structures for integrated circuit devicesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Jun 10, 2008·15 cites·19 claims
- 2282US6933597B1Spacer with passive components for use in multi-chip modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 23, 2005·33 cites·9 claims
- 2380US2025096768A1Metal ribs in electromechanical devicesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2479US11430722B2Integration of a passive component in a cavity of an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 30, 2022·2 cites·13 claims
- 2579US7491625B2Gang flipping for IC packagingNAT SEMICONDUCTOR CORP·Filed 2007·Granted Feb 17, 2009·9 cites·13 claims
- 2677US7652379B2Bond pad stacks for ESD under pad and active under pad bondingNAT SEMICONDUCTOR CORP·Filed 2007·Granted Jan 26, 2010·8 cites·8 claims
- 2776US11021786B2Copper passivationTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 1, 2021·2 cites·38 claims
- 2876US10763231B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·2 cites·12 claims
- 2976US10312184B2Semiconductor systems having premolded dual leadframesTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 4, 2019·2 cites·20 claims
- 3075US8101470B2Foil based semiconductor packagePODDAR ANINDYA·Filed 2009·Granted Jan 24, 2012·7 cites·19 claims
- 3174US2024421120A1Package for stress sensitive component and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 3274US2025285949A1Integration of a passive component in a cavity of an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 3373US2025087591A1Frame design in embedded die packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 3472US10580715B2Stress buffer layer in embedded packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 3, 2020·1 cites·20 claims
- 3572US10580722B1High voltage flip-chip on lead (FOL) packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 3, 2020·1 cites·20 claims
- 3672US7923825B2Integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2009·Granted Apr 12, 2011·4 cites·15 claims
- 3771US2024347441A1Semiconductor device package with thermal padTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 3870US12463158B2Microelectronic device package with integral antenna module and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 4, 2025·0 cites·19 claims
- 3970US11538717B2Electronic package for integrated circuits and related methodsTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 27, 2022·0 cites·14 claims
- 4070US10763230B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·1 cites·8 claims
- 4170US10748827B2Packaged semiconductor devices for high voltage with die edge protectionTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 18, 2020·1 cites·15 claims
- 4270US10734313B2Integration of a passive component in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 4, 2020·1 cites·7 claims
- 4370US6465890B1Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Oct 15, 2002·20 cites·9 claims
- 4469US12272626B2Conductive members atop semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2022·Granted Apr 8, 2025·0 cites·18 claims
- 4569US12125799B2Embedded die packaging with integrated ceramic substrateTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 22, 2024·0 cites·15 claims
- 4669US11923281B2Semiconductor package with isolated heat spreaderTEXAS INSTRUMENTS INC·Filed 2022·Granted Mar 5, 2024·0 cites·18 claims
- 4769US6603199B1Integrated circuit package having die with staggered bond pads and die pad assignment methodology for assembly of staggered die in single-tier ebga packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Aug 5, 2003·16 cites·11 claims
- 4868US2025201677A1Conductive members atop semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 4967US2022415768A1Integration of a passive component in a cavity of an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 5065US12476170B2High voltage flip-chip on lead (FOL) packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 18, 2025·0 cites·18 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →