Inventor · disambiguated record
Anandan Ramasamy
Also filed as: RAMASAMY ANANDAN
5 granted patents·3 pending applications·15 citations·filing 2010–2017
72Inventor score
Top patents by PatentIndex Score
8 records- 0178US8492181B2Embedded wafer level optical package structure and manufacturing methodRAMASAMY ANANDAN·Filed 2011·Granted Jul 23, 2013·9 cites·21 claims
- 0277US9831357B2Semiconductor optical package and methodST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 28, 2017·4 cites·17 claims
- 0364US8796139B2Embedded wafer level ball grid array bar systems and methodsST MICROELECTRONICS PTE LTD·Filed 2012·Granted Aug 5, 2014·2 cites·18 claims
- 0451US10115842B2Semiconductor optical package and methodST MICROELECTRONICS PTE LTD·Filed 2017·Granted Oct 30, 2018·0 cites·17 claims
- 0538US8912653B2Plasma treatment on semiconductor wafersGAN KAH WEE·Filed 2011·Granted Dec 16, 2014·0 cites·13 claims
- 0635US2012168943A1Plasma treatment on semiconductor wafersGAN KAH WEE·Filed 2010·Application pending·0 cites
- 0735US2012282767A1Method for producing a two-sided fan-out wafer level package with electrically conductive interconnects, and a corresponding semiconductor packageJIN YONGGANG·Filed 2011·Application pending·0 cites
- 0834US2014057394A1Method for making a double-sided fanout semiconductor package with embedded surface mount devices, and product madeRAMASAMY ANANDAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →