Inventor · disambiguated record
Andrew W. Yeoh
Also filed as: YEOH ANDREW · YEOH ANDREW W · YEOH ANDREW W H
31 granted patents·12 pending applications·153 citations·filing 2000–2025
96Inventor score
Top patents by PatentIndex Score
43 records- 0197US11031487B2Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2019·Granted Jun 8, 2021·7 cites·20 claims
- 0296US10541316B2Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Jan 21, 2020·9 cites·25 claims
- 0394US9129958B23D integrated circuit package with window interposerMALLIK DEBENDRA·Filed 2011·Granted Sep 8, 2015·17 cites·24 claims
- 0493US11581419B2Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Feb 14, 2023·2 cites·21 claims
- 0592US11955534B2Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Apr 9, 2024·1 cites·20 claims
- 0692US9142510B23D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approachLEE KEVIN J·Filed 2011·Granted Sep 22, 2015·17 cites·19 claims
- 0791US10777655B2Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Sep 15, 2020·3 cites·22 claims
- 0891US9449913B23D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon viasLEE KEVIN J·Filed 2011·Granted Sep 20, 2016·18 cites·22 claims
- 0986US10854731B2Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2019·Granted Dec 1, 2020·1 cites·20 claims
- 1084US10943817B2Etch-stop layer topography for advanced integrated circuit structure fabricationINTEL CORP·Filed 2019·Granted Mar 9, 2021·3 cites·18 claims
- 1184US9496173B2Thickened stress relief and power distribution layerINTEL CORP·Filed 2013·Granted Nov 15, 2016·6 cites·25 claims
- 1284US8827550B2Thermal sensor using a vibrating MEMS resonator of a chip interconnect layerABDELMONEUM MOHAMED A·Filed 2009·Granted Sep 9, 2014·17 cites·18 claims
- 1383US10818774B2Plugs for interconnect lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Oct 27, 2020·1 cites·12 claims
- 1483US10796951B2Etch-stop layer topography for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Oct 6, 2020·3 cites·17 claims
- 1581US2024362391A1Multi version library cell handling and integrated circuit structures fabricated therefromINTEL CORP·Filed 2024·Application pending·0 cites
- 1680US11271010B2Multi version library cell handling and integrated circuit structures fabricated therefromINTEL CORP·Filed 2017·Granted Mar 8, 2022·2 cites·7 claims
- 1780US2025072078A1Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 1879US7064446B2Under bump metallization layer to enable use of high tin content solder bumpsINTEL CORP·Filed 2004·Granted Jun 20, 2006·29 cites·6 claims
- 1979US2025225306A1Multi version library cell handling and integrated circuit structures fabricated therefromINTEL CORP·Filed 2025·Application pending·0 cites
- 2076US11404559B2Plugs for interconnect lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Aug 2, 2022·0 cites·21 claims
- 2176US9391013B23D integrated circuit package with window interposerINTEL CORP·Filed 2015·Granted Jul 12, 2016·2 cites·22 claims
- 2276US2025022939A1Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 2375US2025098258A1Plugs for interconnect lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 2475US2024047556A1Heterogeneous metal line compositions for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Application pending·0 cites
- 2574US12142667B2Contact over active gate structures for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·21 claims
- 2674US12067338B2Multi version library cell handling and integrated circuit structures fabricated therefromINTEL CORP·Filed 2022·Granted Aug 20, 2024·0 cites·8 claims
- 2772US7145244B2Hardening of copper to improve copper CMP performanceINTEL CORP·Filed 2005·Granted Dec 5, 2006·3 cites·4 claims
- 2868US12199168B2Plugs for interconnect lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Jan 14, 2025·0 cites·18 claims
- 2966US12495582B2Self-aligned wide backside power rail contacts to multiple transistor sourcesAPPLIED MATERIALS INC·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 3064US9818710B2Anchored interconnectINTEL CORP·Filed 2014·Granted Nov 14, 2017·2 cites·23 claims
- 3163US12315735B2Methods for removing etch stop layersAPPLIED MATERIALS INC·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 3263US7285496B2Hardening of copper to improve copper CMP performanceINTEL CORP·Filed 2005·Granted Oct 23, 2007·3 cites·4 claims
- 3361US9679845B2Necked interconnect fuse structure for integrated circuitsINTEL CORP·Filed 2014·Granted Jun 13, 2017·1 cites·20 claims
- 3458US2025063797A1Isolation module for backside power deliveryAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3556US2024387458A1Three-Dimensional Vertical Interconnect Architecture and Methods For FormingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3654US2020043850A1Pitch-divided interconnects for advanced integrated circuit structure fabricationINTEL CORP·Filed 2019·Application pending·0 cites
- 3754US2023260909A1Gate all around backside power rail with diffusion breakAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3852US6909192B2Hardening of copper to improve copper CMP performanceINTEL CORP·Filed 2002·Granted Jun 21, 2005·3 cites·4 claims
- 3951US6979646B2Hardening of copper to improve copper CMP performanceINTEL CORP·Filed 2000·Granted Dec 27, 2005·3 cites·3 claims
- 4049US2019164890A1Pitch-divided interconnects for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Application pending·0 cites
- 4148US10229879B2Thickened stress relief and power distribution layerINTEL CORP·Filed 2016·Granted Mar 12, 2019·0 cites·18 claims
- 4248US9530740B23D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approachINTEL CORP·Filed 2015·Granted Dec 27, 2016·0 cites·20 claims
- 4340US2005250323A1Under bump metallization layer to enable use of high tin content solder bumpsBARNAK JOHN P·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →