Inventor · disambiguated record
Arul N. Dhas
Also filed as: DHAS ARUL · DHAS ARUL N
9 granted patents·2 pending applications·129 citations·filing 2006–2021
87Inventor score
Top patents by PatentIndex Score
11 records- 0195US7704894B1Method of eliminating small bin defects in high throughput TEOS filmsNOVELLUS SYSTEMS INC·Filed 2006·Granted Apr 27, 2010·50 cites·21 claims
- 0293US9328416B2Method for the reduction of defectivity in vapor deposited filmsLAM RES CORP·Filed 2014·Granted May 3, 2016·17 cites·22 claims
- 0393US8017527B1Method and apparatus to reduce defects in liquid based PECVD filmsNOVELLUS SYSTEMS INC·Filed 2008·Granted Sep 13, 2011·50 cites·27 claims
- 0481US8034725B1Method of eliminating small bin defects in high throughput TEOS filmsNOVELLUS SYSTEMS INC·Filed 2010·Granted Oct 11, 2011·5 cites·13 claims
- 0577US10704149B2Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gasLAM RES CORP·Filed 2018·Granted Jul 7, 2020·2 cites·13 claims
- 0675US10047438B2Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gasLAM RES CORP·Filed 2014·Granted Aug 14, 2018·3 cites·16 claims
- 0774US9570289B2Method and apparatus to minimize seam effect during TEOS oxide film depositionLAM RES CORP·Filed 2015·Granted Feb 14, 2017·2 cites·19 claims
- 0848US12014921B2Plasma enhanced wafer soak for thin film depositionLAM RES CORP·Filed 2019·Granted Jun 18, 2024·0 cites·18 claims
- 0948US2023352279A1Multi-station processing tools with station-varying support features for backside processingLAM RES CORP·Filed 2021·Application pending·0 cites
- 1040US2021335606A1Continuous plasma for film deposition and surface treatmentLAM RES CORP·Filed 2019·Application pending·0 cites
- 1132US9617637B2Systems and methods for improving deposition rate uniformity and reducing defects in substrate processing systemsLAM RES CORP·Filed 2014·Granted Apr 11, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →