Inventor · disambiguated record
Arata Kishi
Also filed as: KISHI ARATA
18 granted patents·3 pending applications·35 citations·filing 2007–2019
90Inventor score
Top patents by PatentIndex Score
21 records- 0184US9331047B2Mounting method and mounting structure for semiconductor package componentOHASHI NAOMICHI·Filed 2013·Granted May 3, 2016·9 cites·3 claims
- 0283US7780057B2Soldering apparatus and soldering methodPANASONIC CORP·Filed 2008·Granted Aug 24, 2010·8 cites·10 claims
- 0377US9237686B2Method and system for producing component mounting boardPANASONIC CORP·Filed 2013·Granted Jan 12, 2016·5 cites·6 claims
- 0471US9603295B2Mounted structure and manufacturing method of mounted structureYAMAGUCHI ATSUSHI·Filed 2012·Granted Mar 21, 2017·3 cites·13 claims
- 0570US8450859B2Semiconductor device mounted structure and its manufacturing methodOHASHI NAOMICHI·Filed 2009·Granted May 28, 2013·5 cites·12 claims
- 0666US9999123B2Connection structure of circuit member, connection method, and connection materialPANASONIC IP MAN CO LTD·Filed 2016·Granted Jun 12, 2018·1 cites·28 claims
- 0762US8540903B2Electrically conductive paste, and electrical and electronic device comprising the sameHIGUCHI TAKAYUKI·Filed 2008·Granted Sep 24, 2013·3 cites·6 claims
- 0857US8182923B2Conductive paste and mounting structure using the sameOHASHI NAOMICHI·Filed 2009·Granted May 22, 2012·1 cites·17 claims
- 0956US11028262B2Resin composition, anisotropic conductive film including the same, and electronic devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·9 claims
- 1053US10407604B2Heat-dissipating resin composition, and component and electronic device including the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 10, 2019·0 cites·16 claims
- 1152US9322541B2Cooling structurePANASONIC IP MAN CO LTD·Filed 2014·Granted Apr 26, 2016·0 cites·17 claims
- 1250US9795036B2Mounting structure and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Oct 17, 2017·0 cites·10 claims
- 1349US10412834B2Mounting structure and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·8 claims
- 1444US10037960B2Connection structure and connecting method of circuit memberPANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 31, 2018·0 cites·14 claims
- 1544US8132707B2Flow soldering apparatus and flow soldering method using a water content sensorNAKAYA KIMIAKI·Filed 2009·Granted Mar 13, 2012·0 cites·16 claims
- 1643US2009236036A1Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable compositionMIYAKAWA HIDENORI·Filed 2007·Application pending·0 cites
- 1741US2011108997A1Mounting method and mounting structure for semiconductor package componentPANASONIC CORP·Filed 2010·Application pending·0 cites
- 1839US10464153B2Connecting method of circuit memberPANASONIC IP MAN CO LTD·Filed 2017·Granted Nov 5, 2019·0 cites·8 claims
- 1937US2010101845A1Electronic Device and Manufacturing Method for Electronic DeviceKISHI ARATA·Filed 2009·Application pending·0 cites
- 2036US10412838B2Conductive particle, and connection material, connection structure, and connecting method of circuit memberPANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·6 claims
- 2133US8940198B2Conductive adhesive, and circuit board and electronic component module using the sameKISHI ARATA·Filed 2011·Granted Jan 27, 2015·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →