Inventor · disambiguated record
Bang-Chein Ho
Also filed as: HO BANG C · HO BANG-CHEIN
18 granted patents·1 pending application·327 citations·filing 1994–2007
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG10IND TECH RES INST4CHANG CHING-YU1IND TECHNOLOGY RES INST EVERLI1TAIWAN SEMICONDUCTOR MAUNFACTU1
Top patents by PatentIndex Score
19 records- 0190US7235348B2Water soluble negative tone photoresistTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 26, 2007·38 cites·33 claims
- 0290US6905621B2Method for preventing the etch transfer of sidelobes in contact hole patternsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 14, 2005·52 cites·36 claims
- 0390US6664011B2Hole printing by packing and unpacking using alternating phase-shifting masksTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 16, 2003·55 cites·61 claims
- 0489US6488509B1Plug filling for dual-damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 3, 2002·49 cites·45 claims
- 0583US6900134B1Method for forming openings in a substrate using bottom antireflective coatingsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 31, 2005·28 cites·21 claims
- 0682US7419771B2Method for forming a finely patterned resistTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 2, 2008·6 cites·21 claims
- 0776US7341939B2Method for patterning micro features by using developable bottom anti-reflection coatingTAIWAN SEMICONDUCTOR MAUNFACTU·Filed 2005·Granted Mar 11, 2008·10 cites·13 claims
- 0873US6303725B1Cyclic dione polymerIND TECH RES INST·Filed 2000·Granted Oct 16, 2001·11 cites·14 claims
- 0970US5555525AMethod of making graded refractive index polymeric optical fibers and optical fibers made by the methodIND TECH RES INST·Filed 1994·Granted Sep 10, 1996·31 cites·18 claims
- 1068US7749904B2Method of forming a dual damascene structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 6, 2010·4 cites·6 claims
- 1165US7972957B2Method of making openings in a layer of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 5, 2011·2 cites·15 claims
- 1263US7241682B2Method of forming a dual damascene structureTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2004·Granted Jul 10, 2007·11 cites·15 claims
- 1359US6207779B1Ring-opened polymerIND TECH RES INST·Filed 1998·Granted Mar 27, 2001·17 cites·44 claims
- 1454US6998198B2Contact hole printing by packing and unpackingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 14, 2006·6 cites·69 claims
- 1552US6538086B1Polymer with a pericyclic protective group and resist composition containing the sameIND TECH RES INST·Filed 2000·Granted Mar 25, 2003·2 cites·2 claims
- 1648US8101340B2Method of inhibiting photoresist pattern collapseCHANG CHING-YU·Filed 2007·Granted Jan 24, 2012·0 cites·20 claims
- 1743US7094686B2Contact hole printing by packing and unpackingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 22, 2006·2 cites·15 claims
- 1838US2005181313A1Method for forming openings in a substrate using a packing and unpacking processFiled 2004·Application pending·0 cites
- 1927US6197476B1Photosensitive composition containing a cyclic dione polymerIND TECHNOLOGY RES INST EVERLI·Filed 1998·Granted Mar 6, 2001·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →