Inventor · disambiguated record
Baozhen Li
Also filed as: LI BAOZHEN
160 granted patents·24 pending applications·547 citations·filing 1992–2024
99Inventor score
Top patents by PatentIndex Score
184 records- 0199US7397260B2Structure and method for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2005·Granted Jul 8, 2008·169 cites·12 claims
- 0294US10490513B2Advanced crack stop structureIBM·Filed 2018·Granted Nov 26, 2019·8 cites·12 claims
- 0394US9472477B1Electromigration test structure for Cu barrier integrity and blech effect evaluationsIBM·Filed 2015·Granted Oct 18, 2016·6 cites·9 claims
- 0494US7745324B1Interconnect with recessed dielectric adjacent a noble metal capIBM·Filed 2009·Granted Jun 29, 2010·24 cites·18 claims
- 0593US8421186B2Electrically programmable metal fuseLI BAOZHEN·Filed 2011·Granted Apr 16, 2013·23 cites·20 claims
- 0693US8405135B23D via capacitor with a floating conductive plate for improved reliabilityYANG CHIH-CHAO·Filed 2010·Granted Mar 26, 2013·14 cites·16 claims
- 0792US11257750B2E-fuse co-processed with MIM capacitorIBM·Filed 2020·Granted Feb 22, 2022·3 cites·20 claims
- 0892US10615112B2MIM capacitor for improved process defect toleranceIBM·Filed 2018·Granted Apr 7, 2020·8 cites·11 claims
- 0992US10229873B2Three plate MIM capacitor via integrity verificationIBM·Filed 2017·Granted Mar 12, 2019·4 cites·20 claims
- 1092US8802559B2Interconnect structure with an electromigration and stress migration enhancement linerIBM·Filed 2014·Granted Aug 12, 2014·12 cites·15 claims
- 1191US10475753B2Advanced crack stop structureIBM·Filed 2018·Granted Nov 12, 2019·5 cites·18 claims
- 1291US9837309B2Semiconductor via structure with lower electrical resistanceIBM·Filed 2015·Granted Dec 5, 2017·6 cites·3 claims
- 1391US9514981B1Interconnect structureIBM·Filed 2015·Granted Dec 6, 2016·9 cites·1 claims
- 1491US9406617B1Structure and process for W contactsIBM·Filed 2015·Granted Aug 2, 2016·6 cites·7 claims
- 1590US11062993B2Contacts having a geometry to reduce resistanceIBM·Filed 2020·Granted Jul 13, 2021·2 cites·20 claims
- 1689US10998263B2Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) deviceIBM·Filed 2019·Granted May 4, 2021·6 cites·12 claims
- 1788US8659156B2Interconnect structure with an electromigration and stress migration enhancement linerYANG CHIH-CHAO·Filed 2011·Granted Feb 25, 2014·8 cites·19 claims
- 1887US11244850B2On integrated circuit (IC) device simultaneously formed capacitor and resistorIBM·Filed 2019·Granted Feb 8, 2022·4 cites·6 claims
- 1987US9711452B2Optimized wires for resistance or electromigrationIBM·Filed 2014·Granted Jul 18, 2017·5 cites·20 claims
- 2086US9064087B2Semiconductor device reliability model and methodologies for use thereofIBM·Filed 2014·Granted Jun 23, 2015·7 cites·12 claims
- 2184US11251179B2Long channel and short channel vertical FET co-integration for vertical FET VTFETIBM·Filed 2016·Granted Feb 15, 2022·3 cites·20 claims
- 2284US10468491B1Low resistance contact for transistorsIBM·Filed 2018·Granted Nov 5, 2019·3 cites·10 claims
- 2384US9489482B1Reliability-optimized selective voltage binningIBM·Filed 2015·Granted Nov 8, 2016·4 cites·20 claims
- 2483US10539611B2Integrated circuit chip reliability qualification using a sample-specific expected fail rateIBM·Filed 2017·Granted Jan 21, 2020·2 cites·20 claims
- 2583US9224640B2Method to improve fine Cu line reliability in an integrated circuit deviceBURKE CHAD M·Filed 2012·Granted Dec 29, 2015·9 cites·25 claims
- 2683US8779491B23D via capacitor with a floating conductive plate for improved reliabilityIBM·Filed 2013·Granted Jul 15, 2014·5 cites·14 claims
- 2782US11276748B2Switchable metal insulator metal capacitorIBM·Filed 2019·Granted Mar 15, 2022·3 cites·21 claims
- 2882US11031457B2Low resistance high capacitance density MIM capacitorIBM·Filed 2017·Granted Jun 8, 2021·3 cites·17 claims
- 2981US8609504B23D via capacitor with a floating conductive plate for improved reliabilityIBM·Filed 2013·Granted Dec 17, 2013·4 cites·15 claims
- 3081US6992390B2Liner with improved electromigration redundancy for damascene interconnectsIBM·Filed 2003·Granted Jan 31, 2006·30 cites·15 claims
- 3180US11877458B2RRAM structures in the BEOLIBM·Filed 2020·Granted Jan 16, 2024·1 cites·9 claims
- 3280US10460990B2Semiconductor via structure with lower electrical resistanceIBM·Filed 2017·Granted Oct 29, 2019·2 cites·12 claims
- 3380US9639645B2Integrated circuit chip reliability using reliability-optimized failure mechanism targetingGLOBALFOUNDRIES INC·Filed 2015·Granted May 2, 2017·3 cites·20 claims
- 3480US9548270B2Electrical fuse with metal line migrationIBM·Filed 2015·Granted Jan 17, 2017·2 cites·6 claims
- 3580US9312203B2Dual damascene structure with linerIBM·Filed 2013·Granted Apr 12, 2016·4 cites·21 claims
- 3680US9287185B1Determining appropriateness of sampling integrated circuit test data in the presence of manufacturing variationsIBM·Filed 2015·Granted Mar 15, 2016·3 cites·20 claims
- 3780US8839180B1Dielectric reliability assessment for advanced semiconductorsIBM·Filed 2013·Granted Sep 16, 2014·4 cites·15 claims
- 3879US7830019B2Via bottom contact and method of manufacturing sameIBM·Filed 2009·Granted Nov 9, 2010·7 cites·20 claims
- 3978US8943444B2Semiconductor device reliability model and methodologies for use thereofIBM·Filed 2013·Granted Jan 27, 2015·4 cites·8 claims
- 4078US8726201B2Method and system to predict a number of electromigration critical elementsBICKFORD JEANNE P·Filed 2010·Granted May 13, 2014·6 cites·21 claims
- 4177US11489118B2Reliable resistive random access memoryIBM·Filed 2019·Granted Nov 1, 2022·2 cites·15 claims
- 4277US10847458B1BEOL electrical fuse and method of forming the sameIBM·Filed 2019·Granted Nov 24, 2020·2 cites·20 claims
- 4377US9026981B2Dielectric reliability assessment for advanced semiconductorsIBM·Filed 2014·Granted May 5, 2015·3 cites·9 claims
- 4476US9129964B2Programmable electrical fuseIBM·Filed 2013·Granted Sep 8, 2015·5 cites·20 claims
- 4576US8114768B2Electromigration resistant via-to-line interconnectLI BAOZHEN·Filed 2008·Granted Feb 14, 2012·6 cites·20 claims
- 4675US10741441B2Collar formation for chamfer-less and chamfered viasIBM·Filed 2018·Granted Aug 11, 2020·2 cites·2 claims
- 4775US8901738B2Method of manufacturing an enhanced electromigration performance hetero-junction bipolar transistorIBM·Filed 2012·Granted Dec 2, 2014·3 cites·19 claims
- 4875US8656325B2Integrated circuit design method and systemBARWIN JOHN E·Filed 2012·Granted Feb 18, 2014·5 cites·14 claims
- 4974US11875987B2Contacts having a geometry to reduce resistanceIBM·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 5073US8952486B2Electrical fuse and method of making the sameYANG CHIH-CHAO·Filed 2011·Granted Feb 10, 2015·4 cites·38 claims
Showing the top 50 of 184 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Baozhen Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →