Inventor · disambiguated record
Bai-Yao Lou
Also filed as: LOU BAI-YAO
15 granted patents·4 pending applications·43 citations·filing 2004–2016
90Inventor score
Top patents by PatentIndex Score
19 records- 0187US8710680B2Electronic device package and fabrication method thereofCHANG SHU-MING·Filed 2011·Granted Apr 29, 2014·8 cites·13 claims
- 0286US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 0379US8207615B2Chip package and method for fabricating the sameLOU BAI-YAO·Filed 2011·Granted Jun 26, 2012·6 cites·20 claims
- 0475US8742564B2Chip package and method for forming the sameLOU BAI-YAO·Filed 2012·Granted Jun 3, 2014·4 cites·18 claims
- 0574US8791768B2Capacitive coupler packaging structureYIU HO-YIN·Filed 2012·Granted Jul 29, 2014·4 cites·20 claims
- 0671US9088206B2Power module and the method of packaging the sameYIU HO-YIN·Filed 2012·Granted Jul 21, 2015·3 cites·20 claims
- 0770US9293394B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Mar 22, 2016·2 cites·28 claims
- 0866US7888236B2Semiconductor device and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 15, 2011·3 cites·10 claims
- 0965US8431946B2Chip package and method for forming the sameCHIU HSIN-CHIH·Filed 2011·Granted Apr 30, 2013·2 cites·20 claims
- 1058US8604578B2Chip packageCHIU HSIN-CHIH·Filed 2011·Granted Dec 10, 2013·1 cites·19 claims
- 1157US8384174B2Chip packageCHIU HSIN-CHIH·Filed 2011·Granted Feb 26, 2013·1 cites·20 claims
- 1253US8778798B1Electronic device package and fabrication method thereofXINTEC INC·Filed 2014·Granted Jul 15, 2014·0 cites·10 claims
- 1351US2014191350A1Image sensor chip package and fabricating method thereofXINTEC INC·Filed 2014·Application pending·0 cites
- 1447US2016380024A1Image sensor chip package and fabricating method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 1546US9449897B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Sep 20, 2016·0 cites·22 claims
- 1645US9023676B2Wafer packaging methodXINTEC INC·Filed 2014·Granted May 5, 2015·0 cites·14 claims
- 1739US2006125059A1Semiconductor wafer with protection structure against damage during a die separation processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1834US2017179058A1Bump structure having first portion of copper and second portion of pure tin covering the first portion, and interconnect structure using the sameLITE-ON SEMICONDUCTOR CORP·Filed 2015·Application pending·0 cites
- 1933US9761555B2Passive component structure and manufacturing method thereofXINTEC INC·Filed 2015·Granted Sep 12, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →