Inventor · disambiguated record
Belgacem Haba
Also filed as: HABA BELGACEM
643 granted patents·169 pending applications·14,003 citations·filing 1990–2025
99Inventor score
Files withTESSERA INC263INVENSAS CORP162ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC135HABA BELGACEM67RAMBUS INC28
Top patents by PatentIndex Score
812 records- 0199US12046482B2Microelectronic assembliesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jul 23, 2024·7 cites·26 claims
- 0299US12046569B2Integrated device packages with integrated device die and dummy elementADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jul 23, 2024·6 cites·34 claims
- 0399US11916054B2Stacked devices and methods of fabricationADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 27, 2024·6 cites·18 claims
- 0499US11842894B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Dec 12, 2023·14 cites·33 claims
- 0599US11817409B2Directly bonded structures without intervening adhesive and methods for forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Nov 14, 2023·13 cites·30 claims
- 0699US11764177B2Bonded structure with interconnect structureADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 19, 2023·22 cites·19 claims
- 0799US11762200B2Bonded optical devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Sep 19, 2023·11 cites·32 claims
- 0899US11728273B2Bonded structure with interconnect structureADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 15, 2023·24 cites·23 claims
- 0999US11631647B2Integrated device packages with integrated device die and dummy elementADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Apr 18, 2023·24 cites·31 claims
- 1099US11538781B2Integrated device packages including bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Dec 27, 2022·14 cites·30 claims
- 1199US11476213B2Bonded structures without intervening adhesiveINVENSAS BONDING TECH INC·Filed 2020·Granted Oct 18, 2022·50 cites·22 claims
- 1299US11462419B2Microelectronic assembliesINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 4, 2022·52 cites·19 claims
- 1399US11387202B2Nanowire bonding interconnect for fine-pitch microelectronicsINVENSAS LLC·Filed 2020·Granted Jul 12, 2022·57 cites·15 claims
- 1499US11348898B2Systems and methods for releveled bump planes for chipletsXCELSIS CORP·Filed 2020·Granted May 31, 2022·144 cites·17 claims
- 1599US11276676B2Stacked devices and methods of fabricationINVENSAS BONDING TECH INC·Filed 2019·Granted Mar 15, 2022·156 cites·15 claims
- 1699US11264357B1Mixed exposure for large dieINVENSAS CORP·Filed 2020·Granted Mar 1, 2022·145 cites·22 claims
- 1799US11256004B2Direct-bonded lamination for improved image clarity in optical devicesINVENSAS BONDING TECH INC·Filed 2018·Granted Feb 22, 2022·157 cites·19 claims
- 1899US9570382B2Stackable molded microelectronic packagesTESSERA INC·Filed 2015·Granted Feb 14, 2017·41 cites·20 claims
- 1999US9123664B2Stackable molded microelectronic packagesTESSERA INC·Filed 2014·Granted Sep 1, 2015·68 cites·15 claims
- 2099US8907466B2Stackable molded microelectronic packagesTESSERA INC·Filed 2013·Granted Dec 9, 2014·59 cites·19 claims
- 2199US8878353B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2012·Granted Nov 4, 2014·137 cites·71 claims
- 2299US8728865B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted May 20, 2014·88 cites·16 claims
- 2399US8670261B2Stub minimization using duplicate sets of signal terminalsINVENSAS CORP·Filed 2013·Granted Mar 11, 2014·78 cites·28 claims
- 2499US8659164B2Microelectronic package with terminals on dielectric massTESSERA INC·Filed 2012·Granted Feb 25, 2014·84 cites·30 claims
- 2599US8482111B2Stackable molded microelectronic packagesHABA BELGACEM·Filed 2010·Granted Jul 9, 2013·121 cites·15 claims
- 2699US8405207B1Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Mar 26, 2013·42 cites·30 claims
- 2799US8345441B1Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2011·Granted Jan 1, 2013·70 cites·30 claims
- 2899US8093697B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2010·Granted Jan 10, 2012·117 cites·16 claims
- 2999US8076788B2Off-chip vias in stacked chipsHABA BELGACEM·Filed 2010·Granted Dec 13, 2011·74 cites·17 claims
- 3099US8058101B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2005·Granted Nov 15, 2011·87 cites·16 claims
- 3199US7901989B2Reconstituted wafer level stackingTESSERA INC·Filed 2008·Granted Mar 8, 2011·128 cites·16 claims
- 3299US6376904B1Redistributed bond pads in stacked integrated circuit die packageRAMBUS INC·Filed 2000·Granted Apr 23, 2002·339 cites·17 claims
- 3398US12266640B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·4 cites·35 claims
- 3498US12218107B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Feb 4, 2025·3 cites·20 claims
- 3598US12046583B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jul 23, 2024·4 cites·21 claims
- 3698US11955463B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·6 cites·55 claims
- 3798US11955445B2Metal pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·5 cites·23 claims
- 3898US11876076B2Apparatus for non-volatile random access memory stacksADEIA SEMICONDUCTOR TECH LLC·Filed 2020·Granted Jan 16, 2024·7 cites·31 claims
- 3998US11848284B2Protective elements for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 19, 2023·7 cites·16 claims
- 4098US11837582B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·14 cites·33 claims
- 4198US11764189B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 19, 2023·17 cites·30 claims
- 4298US11721653B2Circuitry for electrical redundancy in bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Aug 8, 2023·12 cites·21 claims
- 4398US11610846B2Protective elements for bonded structures including an obstructive elementADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Mar 21, 2023·9 cites·18 claims
- 4498US11600542B2Cavity packagesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Mar 7, 2023·6 cites·23 claims
- 4598US11515291B2Integrated voltage regulator and passive componentsADEIA SEMICONDUCTOR INC·Filed 2019·Granted Nov 29, 2022·38 cites·18 claims
- 4698US11393779B2Large metal pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 19, 2022·58 cites·15 claims
- 4798US11385278B2Security circuitry for bonded structuresINVENSAS BONDING TECH INC·Filed 2020·Granted Jul 12, 2022·60 cites·27 claims
- 4898US11373963B2Protective elements for bonded structuresINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 28, 2022·52 cites·27 claims
- 4998US11296053B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 5, 2022·41 cites·18 claims
- 5098US11171117B2Interlayer connection of stacked microelectronic componentsINVENSAS BONDING TECH INC·Filed 2019·Granted Nov 9, 2021·155 cites·14 claims
Showing the top 50 of 812 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Belgacem Haba files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →