Inventor · disambiguated record
Bing Dang
Also filed as: DANG BING
140 granted patents·21 pending applications·701 citations·filing 2007–2023
99Inventor score
Top patents by PatentIndex Score
161 records- 0199US9537199B2Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chipsIBM·Filed 2015·Granted Jan 3, 2017·33 cites·15 claims
- 0298US10217637B1Chip handling and electronic component integrationIBM·Filed 2017·Granted Feb 26, 2019·35 cites·13 claims
- 0398US8917210B2Package structures to improve on-chip antenna performanceIBM·Filed 2012·Granted Dec 23, 2014·189 cites·30 claims
- 0497US10038232B2Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit diesIBM·Filed 2016·Granted Jul 31, 2018·17 cites·17 claims
- 0596US10002856B1Micro-LED array transferIBM·Filed 2017·Granted Jun 19, 2018·13 cites·16 claims
- 0695US10381255B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2018·Granted Aug 13, 2019·7 cites·11 claims
- 0795US10032973B1Magnetically guided chiplet displacementIBM·Filed 2017·Granted Jul 24, 2018·10 cites·13 claims
- 0895US9531052B2Semiconductor wafer having an integrated waveguide configured to communicate between first and second integrated circuit diesIBM·Filed 2015·Granted Dec 27, 2016·10 cites·17 claims
- 0995US9472789B2Thin, flexible microsystem with integrated energy sourceIBM·Filed 2014·Granted Oct 18, 2016·9 cites·19 claims
- 1095US9269561B2Wafer debonding using long-wavelength infrared radiation ablationGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 23, 2016·16 cites·11 claims
- 1195US7750459B2Integrated module for data processing systemIBM·Filed 2008·Granted Jul 6, 2010·29 cites·17 claims
- 1295US7474540B1Silicon carrier including an integrated heater for die rework and wafer probeIBM·Filed 2008·Granted Jan 6, 2009·35 cites·4 claims
- 1394US10224229B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2016·Granted Mar 5, 2019·8 cites·8 claims
- 1494US9472859B2Integration of area efficient antennas for phased array or wafer scale array antenna applicationsIBM·Filed 2014·Granted Oct 18, 2016·16 cites·12 claims
- 1594US7928563B23-D ICs with microfluidic interconnects and methods of constructing sameGEORGIA TECH RES INST·Filed 2008·Granted Apr 19, 2011·41 cites·20 claims
- 1693US10297479B2Wafer debonding using mid-wavelength infrared radiation ablationIBM·Filed 2017·Granted May 21, 2019·8 cites·18 claims
- 1792US12014816B2Multi-sensor platform for health monitoringIBM·Filed 2020·Granted Jun 18, 2024·3 cites·20 claims
- 1892US9070586B1Method of forming surface protrusions on an article and the article with the protrusions attachedIBM·Filed 2014·Granted Jun 30, 2015·12 cites·16 claims
- 1991US11696683B2Medical device systemIBM·Filed 2021·Granted Jul 11, 2023·2 cites·12 claims
- 2091US10103450B2Integration of area efficient antennas for phased array or wafer scale array antenna applicationsIBM·Filed 2016·Granted Oct 16, 2018·7 cites·20 claims
- 2191US9391040B2Planarity-tolerant reworkable interconnect with integrated testingIBM·Filed 2014·Granted Jul 12, 2016·10 cites·10 claims
- 2290US8290008B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2009·Granted Oct 16, 2012·18 cites·12 claims
- 2389US10490525B1High speed handling of ultra-small chips by selective laser bonding and debondingIBM·Filed 2018·Granted Nov 26, 2019·5 cites·16 claims
- 2489US8419895B2Laser ablation for integrated circuit fabricationDANG BING·Filed 2010·Granted Apr 16, 2013·11 cites·20 claims
- 2588US10032943B2Device layer thin-film transfer to thermally conductive substrateIBM·Filed 2015·Granted Jul 24, 2018·3 cites·8 claims
- 2688US8752283B2Assembly of electronic and optical devicesBARWICZ TYMON·Filed 2012·Granted Jun 17, 2014·8 cites·11 claims
- 2787US9947570B2Handler bonding and debonding for semiconductor diesIBM·Filed 2016·Granted Apr 17, 2018·3 cites·16 claims
- 2887US9636782B2Wafer debonding using mid-wavelength infrared radiation ablationIBM·Filed 2014·Granted May 2, 2017·6 cites·14 claims
- 2987US8518829B2Self-sealed fluidic channels for nanopore arrayDANG BING·Filed 2011·Granted Aug 27, 2013·16 cites·17 claims
- 3086US10658182B2Chip handling and electronic component integrationIBM·Filed 2019·Granted May 19, 2020·1 cites·20 claims
- 3186US8912045B2Three dimensional flip chip system and methodDANG BING·Filed 2012·Granted Dec 16, 2014·7 cites·1 claims
- 3286US8559474B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2012·Granted Oct 15, 2013·9 cites·6 claims
- 3385US9364925B2Assembly of electronic and optical devicesBARWICZ TYMON·Filed 2012·Granted Jun 14, 2016·7 cites·8 claims
- 3485US7799613B2Integrated module for data processing systemIBM·Filed 2009·Granted Sep 21, 2010·10 cites·19 claims
- 3584US10325785B2Handler bonding and debonding for semiconductor diesIBM·Filed 2017·Granted Jun 18, 2019·2 cites·9 claims
- 3684US9200883B2Transferable probe tipsANDRY PAUL S·Filed 2011·Granted Dec 1, 2015·5 cites·22 claims
- 3784US8679280B2Laser ablation of adhesive for integrated circuit fabricationDANG BING·Filed 2010·Granted Mar 25, 2014·7 cites·19 claims
- 3883US10833296B2Thin film solid-state microbattery packagingIBM·Filed 2017·Granted Nov 10, 2020·1 cites·6 claims
- 3983US9867932B2Drug delivery device having a cavity sealed by a pressurized membraneIBM·Filed 2015·Granted Jan 16, 2018·4 cites·13 claims
- 4082US10224219B2Handler bonding and debonding for semiconductor diesIBM·Filed 2015·Granted Mar 5, 2019·2 cites·14 claims
- 4182US8689437B2Method for forming integrated circuit assemblyDANG BING·Filed 2009·Granted Apr 8, 2014·11 cites·20 claims
- 4281US10395929B2Chip handling and electronic component integrationIBM·Filed 2017·Granted Aug 27, 2019·2 cites·14 claims
- 4381US10033081B2Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application boardIBM·Filed 2016·Granted Jul 24, 2018·2 cites·20 claims
- 4480US11101513B2Thin film battery packagingIBM·Filed 2018·Granted Aug 24, 2021·1 cites·18 claims
- 4580US10881788B2Delivery device including reactive material for programmable discrete delivery of a substanceIBM·Filed 2015·Granted Jan 5, 2021·4 cites·14 claims
- 4680US8525168B2Integrated circuit (IC) test probeDANG BING·Filed 2011·Granted Sep 3, 2013·5 cites·25 claims
- 4779US10319893B2Magnetically guided chiplet displacementIBM·Filed 2018·Granted Jun 11, 2019·2 cites·23 claims
- 4879US9586291B2Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation releaseGLOBALFOUNDRIES INC·Filed 2014·Granted Mar 7, 2017·3 cites·13 claims
- 4978US10314970B2Drug delivery device having a cavity sealed by a pressurized membraneIBM·Filed 2017·Granted Jun 11, 2019·2 cites·8 claims
- 5077US10630592B2Routing method, related device, and systemHUAWEI TECH CO LTD·Filed 2017·Granted Apr 21, 2020·3 cites·15 claims
Showing the top 50 of 161 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →