Inventor · disambiguated record
Bill Hsu
Also filed as: HSU BILL · HSU BILL Y B
8 granted patents·4 pending applications·294 citations·filing 1993–2014
89Inventor score
Top patents by PatentIndex Score
12 records- 0191US5393701ALayout design to eliminate process antenna effectUNITED MICROELECTRONICS CORP·Filed 1993·Granted Feb 28, 1995·129 cites·11 claims
- 0282US5703408ABonding pad structure and method thereofUNITED MICROELECTRONICS CORP·Filed 1995·Granted Dec 30, 1997·73 cites·20 claims
- 0362US5834365AMethod of forming a bonding padUNITED MICROELECTRONICS CORP·Filed 1997·Granted Nov 10, 1998·31 cites·20 claims
- 0459US5994225AMethod of etching metal with increased etching selectivityUNITED MICROELECTRONICS CORP·Filed 1996·Granted Nov 30, 1999·24 cites·13 claims
- 0557US5514623AMethod of making layout design to eliminate process antenna effectUNITED MICROELECTRONICS CORP·Filed 1995·Granted May 7, 1996·20 cites·8 claims
- 0651USD479376SIce and snow removerFiled 2003·Granted Sep 2, 2003·8 cites·1 claims
- 0743US2004148810A1Ice and snow removerFiled 2003·Application pending·0 cites
- 0842US6214722B1Method for improving wafer topography to provide more accurate transfer of interconnect patternsUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 10, 2001·9 cites·8 claims
- 0940US2004163199A1Steam cleanerFiled 2003·Application pending·0 cites
- 1038US9074940B2Miniature light sensing assemblyASENSETEK INC·Filed 2014·Granted Jul 7, 2015·0 cites·12 claims
- 1136US2001018265A1Method of manufacturing interconnectFiled 2001·Application pending·0 cites
- 1228US2002016063A1Method of fabricating a metal plug of a semiconductor device using a novel tin barrier layerFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →