Inventor · disambiguated record
Bioh Kim
Also filed as: KIM BIOH
7 granted patents·15 pending applications·37 citations·filing 2003–2019
82Inventor score
Top patents by PatentIndex Score
22 records- 0185US7135404B2Method for applying metal features onto barrier layers using electrochemical depositionSEMITOOL INC·Filed 2003·Granted Nov 14, 2006·24 cites·22 claims
- 0284US9359683B2Method of forming metal and metal alloy featuresKIM BIOH·Filed 2007·Granted Jun 7, 2016·6 cites·46 claims
- 0384US8961771B2Electrolytic process using cation permeable barrierBASKARAN RAJESH·Filed 2012·Granted Feb 24, 2015·2 cites·15 claims
- 0484US8236159B2Electrolytic process using cation permeable barrierBASKARAN RAJESH·Filed 2006·Granted Aug 7, 2012·3 cites·38 claims
- 0569US2019345624A1Systems and methods for removing contaminants in electroplating systemsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 0668US2014209472A1Electrolytic process using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 0767US9234293B2Electrolytic copper process using anion permeable barrierAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·1 cites·12 claims
- 0864US2016355941A1Method of forming metal and metal alloy featuresAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 0962US2008041727A1Method and system for depositing alloy compositionSEMITOOL INC·Filed 2006·Application pending·0 cites
- 1061US8123926B2Electrolytic copper process using anion permeable barrierBASKARAN RAJESH·Filed 2006·Granted Feb 28, 2012·1 cites·48 claims
- 1151US2006079085A1Method for applying metal features onto metallized layers using electrochemical depositionSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1251US2006079083A1Method for applying metal features onto metallized layers using electrochemical deposition using acid treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1351US2006079084A1Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1451US2006084264A1Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1550US2006163072A1Electrolytic process using anion permeable barrierSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1648US8852417B2Electrolytic process using anion permeable barrierBASKARAN RAJESH·Filed 2012·Granted Oct 7, 2014·0 cites·25 claims
- 1748US2006157355A1Electrolytic process using anion permeable barrierSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1843US2014246324A1Methods for electrochemical deposition of multi-component solder using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1942US2006260946A1Copper electrolytic process using cation permeable barrierSEMITOOL INC·Filed 2006·Application pending·0 cites
- 2042US2006189129A1Method for applying metal features onto barrier layers using ion permeable barriersSEMITOOL INC·Filed 2006·Application pending·0 cites
- 2137US2005092611A1Bath and method for high rate copper depositionSEMITOOL INC·Filed 2003·Application pending·0 cites
- 2234US2005085062A1Processes and tools for forming lead-free alloy solder precursorsSEMITOOL INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →