Inventor · disambiguated record
Bok Eng Cheah
Also filed as: CHEAH BOK ENG
138 granted patents·46 pending applications·497 citations·filing 2006–2025
99Inventor score
Top patents by PatentIndex Score
184 records- 0197US10978434B2Systems in packages including wide-band phased-array antennas and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 13, 2021·5 cites·20 claims
- 0297US8198716B2Die backside wire bond technology for single or stacked die packagePERIAMAN SHANGGAR·Filed 2007·Granted Jun 12, 2012·92 cites·19 claims
- 0396US11652026B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2022·Granted May 16, 2023·2 cites·20 claims
- 0496US11282780B2Integrated bridge for die-to-die interconnectsINTEL CORP·Filed 2020·Granted Mar 22, 2022·3 cites·12 claims
- 0596US8987896B2High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming sameCHEAH BOK ENG·Filed 2010·Granted Mar 24, 2015·31 cites·3 claims
- 0696US7692278B2Stacked-die packages with silicon vias and surface activated bondingINTEL CORP·Filed 2006·Granted Apr 6, 2010·46 cites·9 claims
- 0795US10903142B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2019·Granted Jan 26, 2021·8 cites·22 claims
- 0894US11375617B2Three dimensional foldable substrate with vertical side interfaceINTEL CORP·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0994US10580761B2Systems in packages including wide-band phased-array antennas and methods of assembling sameINTEL CORP·Filed 2018·Granted Mar 3, 2020·9 cites·21 claims
- 1094US9136251B2Method to enable controlled side chip interconnection for 3D integrated packaging systemCHEAH BOK ENG·Filed 2012·Granted Sep 15, 2015·16 cites·30 claims
- 1193US10651127B2Ring-in-ring configurable-capacitance stiffeners and methods of assembling sameINTEL CORP·Filed 2017·Granted May 12, 2020·10 cites·7 claims
- 1293US10503211B2Multi-orientation display deviceINTEL CORP·Filed 2015·Granted Dec 10, 2019·10 cites·19 claims
- 1392US11121074B2Packaged die stacks with stacked capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Sep 14, 2021·3 cites·7 claims
- 1492US10014710B2Foldable fabric-based packaging solutionINTEL CORP·Filed 2015·Granted Jul 3, 2018·5 cites·17 claims
- 1591US10041282B2Micro-hinge for an electronic deviceINTEL CORP·Filed 2015·Granted Aug 7, 2018·7 cites·19 claims
- 1691US10036187B2Micro-hinge for an electronic deviceINTEL CORP·Filed 2016·Granted Jul 31, 2018·7 cites·21 claims
- 1791US8044497B2Stacked die packageINTEL CORP·Filed 2007·Granted Oct 25, 2011·18 cites·20 claims
- 1890US11527479B2Stepped interposer for stacked chip packageINTEL CORP·Filed 2020·Granted Dec 13, 2022·2 cites·16 claims
- 1990US11367673B2Semiconductor package with hybrid through-silicon-viasINTEL CORP·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 2090US10085342B2Microelectronic device having an air core inductorINTEL CORP·Filed 2016·Granted Sep 25, 2018·6 cites·23 claims
- 2190US9812425B2Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for sameINTEL CORP·Filed 2016·Granted Nov 7, 2017·5 cites·18 claims
- 2290US9455218B2Embedded die-down package-on-package deviceOOI TOONG ERH·Filed 2013·Granted Sep 27, 2016·37 cites·9 claims
- 2390US2025385161A1Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2025·Application pending·0 cites
- 2489US11527463B2Hybrid ball grid array package for high speed interconnectsINTEL CORP·Filed 2020·Granted Dec 13, 2022·2 cites·18 claims
- 2589US9478524B2Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for sameINTEL CORP·Filed 2015·Granted Oct 25, 2016·5 cites·7 claims
- 2689US8697495B2Stacked die packageCHEAH BOK ENG·Filed 2011·Granted Apr 15, 2014·9 cites·12 claims
- 2788US8281229B2Firmware verification using system memory error check logicCHEW YEN HSIANG·Filed 2008·Granted Oct 2, 2012·19 cites·20 claims
- 2888US2024429131A1Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2024·Application pending·0 cites
- 2987US10593618B2Packaged die stacks with stacked capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Mar 17, 2020·3 cites·7 claims
- 3085US10964677B2Electronic packages with stacked sitffeners and methods of assembling sameINTEL CORP·Filed 2017·Granted Mar 30, 2021·4 cites·16 claims
- 3185US9360896B2Low-profile hinge for an electronic deviceINTEL CORP·Filed 2014·Granted Jun 7, 2016·8 cites·25 claims
- 3284US12112997B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 3384US10957649B2Overpass dice stacks and methods of using sameINTEL CORP·Filed 2016·Granted Mar 23, 2021·4 cites·27 claims
- 3484US10633898B2Micro-hinge for an electronic deviceINTEL CORP·Filed 2018·Granted Apr 28, 2020·2 cites·20 claims
- 3583US12080628B2Micro through-silicon via for transistor density scalingINTEL CORP·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 3683US11521932B2Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Dec 6, 2022·1 cites·21 claims
- 3783US10998261B2Over-molded IC package with in-mold capacitorINTEL CORP·Filed 2018·Granted May 4, 2021·4 cites·8 claims
- 3883US10910325B2Integrated circuit packages with conductive element having cavities housing electrically connected embedded componentsINTEL CORP·Filed 2018·Granted Feb 2, 2021·3 cites·24 claims
- 3982US11574877B2Semiconductor miniaturization through component placement on stepped stiffenerINTEL CORP·Filed 2020·Granted Feb 7, 2023·1 cites·14 claims
- 4081US11398415B2Stacked through-silicon vias for multi-device packagesINTEL CORP·Filed 2019·Granted Jul 26, 2022·3 cites·18 claims
- 4181US11393758B2Power delivery for embedded interconnect bridge devices and methodsINTEL CORP·Filed 2019·Granted Jul 19, 2022·3 cites·13 claims
- 4281US7400033B1Package on package design to improve functionality and efficiencyINTEL CORP·Filed 2006·Granted Jul 15, 2008·10 cites·15 claims
- 4380US10840177B2Interposer with flexible portionINTEL CORP·Filed 2019·Granted Nov 17, 2020·2 cites·20 claims
- 4480US10319698B2Microelectronic device package having alternately stacked dieINTEL CORP·Filed 2016·Granted Jun 11, 2019·3 cites·15 claims
- 4580US9778688B2Flexible system-in-package solutions for wearable devicesINTEL CORP·Filed 2014·Granted Oct 3, 2017·5 cites·24 claims
- 4680US8110930B2Die backside metallization and surface activated bonding for stacked die packagesPERIAMAN SHANGGAR·Filed 2007·Granted Feb 7, 2012·10 cites·19 claims
- 4779US2024395722A1Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 4878US12142570B2Composite bridge die-to-die interconnects for integrated-circuit packagesINTEL CORP·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 4978US11164827B2Substrate with gradiated dielectric for reducing impedance mismatchINTEL CORP·Filed 2017·Granted Nov 2, 2021·2 cites·17 claims
- 5078US10950552B2Ring-in-ring configurable-capacitance stiffeners and methods of assembling sameINTEL CORP·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
Showing the top 50 of 184 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →