Inventor · disambiguated record
Bor-Ping Jang
Also filed as: JANG BOR-PING
42 granted patents·3 pending applications·196 citations·filing 1997–2020
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26TAIWAN SEMICONDUCTOR MFG11JANG BOR-PING2CHEN MENG-TSE1HSIAO YI-LI1
Top patents by PatentIndex Score
45 records- 0197US9093337B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·27 cites·20 claims
- 0297US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 0397US8381965B2Thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 26, 2013·30 cites·14 claims
- 0495US10157881B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·9 cites·20 claims
- 0591US9484226B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·5 cites·20 claims
- 0690US10510712B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·3 cites·20 claims
- 0790US10056285B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·4 cites·20 claims
- 0887US9768142B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·7 cites·20 claims
- 0986US8951037B2Wafer-level underfill and over-moldingJANG BOR-PING·Filed 2012·Granted Feb 10, 2015·5 cites·20 claims
- 1082US9659891B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 23, 2017·4 cites·20 claims
- 1181US9082636B2Packaging methods and structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 14, 2015·4 cites·20 claims
- 1279US8556158B2Thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 15, 2013·4 cites·20 claims
- 1377US11390000B2Wafer level transfer molding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 1477US9893044B2Wafer-level underfill and over-moldingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·1 cites·20 claims
- 1574US10020211B2Wafer-level molding chase designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 10, 2018·3 cites·20 claims
- 1673US9812346B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·1 cites·20 claims
- 1771US10276531B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
- 1870US11721555B2Method and system for thinning wafer thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 1970US5843831AProcess independent alignment systemTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Dec 1, 1998·41 cites·17 claims
- 2069US11139177B2Method of fabricating semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 2169US10513070B2Wafer level transfer molding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·17 claims
- 2269US9700950B2Innovative multi-purpose dipping plateJANG BOR-PING·Filed 2012·Granted Jul 11, 2017·2 cites·19 claims
- 2369US8616433B2Forming low stress joints using thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 31, 2013·2 cites·13 claims
- 2468US11094561B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 2568US10985135B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 2663US10770331B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 2763US9802349B2Wafer level transfer molding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·0 cites·19 claims
- 2862US11233032B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 25, 2022·0 cites·20 claims
- 2962US8360303B2Forming low stress joints using thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·1 cites·7 claims
- 3061US10804234B2Semiconductor device having a boundary structure, a package on package structure, and a method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·20 claims
- 3159US9236351B2Semiconductor wafer deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·0 cites·20 claims
- 3258US11024618B2Wafer-level underfill and over-moldingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 1, 2021·0 cites·20 claims
- 3357US9129899B2Method and system for thinning wafer thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·16 claims
- 3455US10727074B2Method and system for thinning wafer thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 28, 2020·0 cites·20 claims
- 3555US10504870B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·0 cites·19 claims
- 3654US10134703B2Package on-package process for applying molding compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 20, 2018·0 cites·20 claims
- 3753US10679866B2Interconnect structure for semiconductor package and method of fabricating the interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 9, 2020·0 cites·19 claims
- 3850US7005236B2Maintaining photoresist planarity at hole edgesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 28, 2006·3 cites·33 claims
- 3949US8927391B2Package-on-package process for applying molding compoundCHEN MENG-TSE·Filed 2011·Granted Jan 6, 2015·0 cites·18 claims
- 4048US9085049B2Method and system for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 21, 2015·0 cites·20 claims
- 4143US8702871B2Package assembly cleaning process using vaporized solventHSIAO YI-LI·Filed 2011·Granted Apr 22, 2014·0 cites·17 claims
- 4240US2013273717A1Apparatus and Method for the Singulation of a Semiconductor WaferHWANG CHIEN LING·Filed 2012·Application pending·0 cites
- 4340US2013146647A1Integrated Reflow and Cleaning Process and Apparatus for Performing the SameLIU CHUNG-SHI·Filed 2011·Application pending·0 cites
- 4438US6778266B2Semiconductor wafer tilt monitoring on semiconductor fabrication equipment plateTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 17, 2004·4 cites·13 claims
- 4537US2012267423A1Methods and Apparatus for Thin Die ProcessingHUANG KUEI-WEI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →