Inventor · disambiguated record
Boo Yang Jung
Also filed as: JUNG BOO YANG
11 granted patents·3 pending applications·40 citations·filing 2004–2023
85Inventor score
Files withGLOBALFOUNDRIES SG PTE LTD5AMKOR TECH SINGAPORE HOLDING PTE LTD2AGENCY SCIENCE TECH & RES1AMKOR TECHNOLOGY INC1JUNG BOO YANG1
Top patents by PatentIndex Score
14 records- 0194US8294276B1Semiconductor device and fabricating method thereofKIM SANG WON·Filed 2010·Granted Oct 23, 2012·27 cites·18 claims
- 0289US10361162B1Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted Jul 23, 2019·4 cites·15 claims
- 0380US2024243084A1Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 0477US10290678B2Magnetic shielding package structure for MRAM device and method for producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2017·Granted May 14, 2019·2 cites·13 claims
- 0571US11855023B2Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 0671US10686008B2Magnetic shielding package structure for MRAM device and method for producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2019·Granted Jun 16, 2020·1 cites·20 claims
- 0761US11018093B2Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2019·Granted May 25, 2021·0 cites·18 claims
- 0859US9748154B1Wafer level fan out semiconductor device and manufacturing method thereofJUNG BOO YANG·Filed 2010·Granted Aug 29, 2017·1 cites·14 claims
- 0956US10903181B2Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 26, 2021·0 cites·20 claims
- 1049US7129719B2Apparatus for detecting defect in circuit pattern and defect detecting system having the sameSAMSUNG TECHWIN CO LTD·Filed 2004·Granted Oct 31, 2006·5 cites·19 claims
- 1141US2013168144A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1237US8785789B2Printed circuit board and method for manufacturing the sameOH HUENG JAE·Filed 2012·Granted Jul 22, 2014·0 cites·10 claims
- 1337US2019304917A1High density fan-out wafer level package and method of making the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Application pending·0 cites
- 1426US10727207B2Semiconductor packaging structure and method of forming the sameAGENCY SCIENCE TECH & RES·Filed 2017·Granted Jul 28, 2020·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Boo Yang Jung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →