Inventor · disambiguated record
Bor-Shiun Lee
Also filed as: LEE BOR-SHIUN
11 granted patents·9 pending applications·11 citations·filing 2002–2024
81Inventor score
Top patents by PatentIndex Score
20 records- 0184US12191219B2Gas-permeable package lid of chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2022·Granted Jan 7, 2025·1 cites·18 claims
- 0284US10843919B2Microelectromechanical system apparatus with heaterIND TECH RES INST·Filed 2019·Granted Nov 24, 2020·2 cites·14 claims
- 0382US11359970B2Microelectromechanical infrared sensing apparatus having stoppersIND TECH RES INST·Filed 2020·Granted Jun 14, 2022·1 cites·32 claims
- 0464US11656128B2Microelectromechanical infrared sensing device and fabrication method thereofIND TECH RES INST·Filed 2022·Granted May 23, 2023·0 cites·21 claims
- 0563US12345571B2Microelectromechanical infrared sensing device and fabrication method thereofIND TECH RES INST·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 0663US2025305870A1Acoustic wave receiving apparatusIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0760US11366015B1Microelectromechanical infrared sensing deviceIND TECH RES INST·Filed 2021·Granted Jun 21, 2022·0 cites·19 claims
- 0859US2025128935A1Microelectromechanical sensing device and manufacturing method thereofIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0958US11965852B2Microelectromechanical sensor and sensing module thereofIND TECH RES INST·Filed 2022·Granted Apr 23, 2024·0 cites·19 claims
- 1054US6644795B2Pressure control device for an inkjet penIND TECH RES INST·Filed 2002·Granted Nov 11, 2003·7 cites·38 claims
- 1154US2024363456A1Gas-permeable package lid of chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2023·Application pending·0 cites
- 1251US2024230413A1Infrared sensor and its reference element and manufacturing method of the reference elementIND TECH RES INST·Filed 2023·Application pending·0 cites
- 1350US11820650B2Microelectromechanical apparatus having hermitic chamberIND TECH RES INST·Filed 2020·Granted Nov 21, 2023·0 cites·21 claims
- 1449US11543297B2Sensing devicesIND TECH RES INST·Filed 2020·Granted Jan 3, 2023·0 cites·13 claims
- 1549US2022267143A1Microelectromechanical heating deviceIND TECH RES INST·Filed 2021·Application pending·0 cites
- 1639US2011248814A1Shielded-type inductorLEE BOR-SHIUN·Filed 2007·Application pending·0 cites
- 1738US9715102B2Electromechanical systems device with hinges for reducing tilt instabilitySNAPTRACK INC·Filed 2015·Granted Jul 25, 2017·0 cites·18 claims
- 1838US2013169109A1Comb electrode structureCHEN MING-FA·Filed 2012·Application pending·0 cites
- 1937US2012086086A1Mems device and composite substrate for an mems deviceLIN HUNG-YI·Filed 2011·Application pending·0 cites
- 2034US2016349497A1System and method to achieve a desired white point in display devices by combining complementary tinted native white colorsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →