Inventor · disambiguated record
Boon Yew Low
Also filed as: LOW BOON YEW
26 granted patents·5 pending applications·62 citations·filing 2007–2023
94Inventor score
Top patents by PatentIndex Score
31 records- 0194US11581241B2Circuit modules with front-side interposer terminals and through-module thermal dissipation structuresNXP USA INC·Filed 2020·Granted Feb 14, 2023·3 cites·19 claims
- 0289US8338236B1Vented substrate for semiconductor deviceLOW BOON YEW·Filed 2011·Granted Dec 25, 2012·12 cites·4 claims
- 0387US9034694B1Embedded die ball grid array packageKALANDAR NAVAS KHAN ORATTI·Filed 2014·Granted May 19, 2015·9 cites·12 claims
- 0479US9030000B2Mold cap for semiconductor deviceEU POH LENG·Filed 2013·Granted May 12, 2015·6 cites·8 claims
- 0579US7956471B2Mold and substrate for use with moldFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 7, 2011·4 cites·5 claims
- 0677US12415305B2Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processesNXP USA INC·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 0777US8198143B2Mold and substrate for use with moldEU POH LENG·Filed 2011·Granted Jun 12, 2012·3 cites·5 claims
- 0875US11056457B2Semiconductor device with bond wire reinforcement structureNXP USA INC·Filed 2018·Granted Jul 6, 2021·2 cites·15 claims
- 0974US9000570B2Semiconductor device with corner tie barsCHAN WENG HOONG·Filed 2013·Granted Apr 7, 2015·6 cites·8 claims
- 1073US9418929B1Integrated circuit with sewn interconnectsLOW BOON YEW·Filed 2015·Granted Aug 16, 2016·3 cites·18 claims
- 1172US8809078B1Solar powered IC chipLAU TECK BENG·Filed 2013·Granted Aug 19, 2014·4 cites·17 claims
- 1269US8237293B2Semiconductor package with protective tapeWONG TZU LING·Filed 2010·Granted Aug 7, 2012·4 cites·20 claims
- 1366US11787097B2Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processesNXP USA INC·Filed 2021·Granted Oct 17, 2023·0 cites·6 claims
- 1462US8698288B1Flexible substrate with crimping interconnectionLOW BOON YEW·Filed 2013·Granted Apr 15, 2014·2 cites·16 claims
- 1558US12446158B2Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modulesNXP USA INC·Filed 2023·Granted Oct 14, 2025·0 cites·16 claims
- 1656US8933547B1Lead frame with power bar for semiconductor deviceYAP JIA LIN·Filed 2013·Granted Jan 13, 2015·2 cites·19 claims
- 1749US8062424B2Method and apparatus for molding substrateMANIKAM VERMAL RAJA·Filed 2009·Granted Nov 22, 2011·2 cites·5 claims
- 1847US9299675B2Embedded die ball grid array packageKALANDAR NAVAS KHAN ORATTI·Filed 2015·Granted Mar 29, 2016·0 cites·7 claims
- 1944US8643189B1Packaged semiconductor die with power rail padsLOW BOON YEW·Filed 2012·Granted Feb 4, 2014·0 cites·20 claims
- 2043US9159682B2Copper pillar bump and flip chip package using sameFOONG CHEE SENG·Filed 2013·Granted Oct 13, 2015·0 cites·9 claims
- 2143US2008182398A1Varied Solder Mask Opening Diameters Within a Ball Grid Array SubstrateCARPENTER BURTON J·Filed 2007·Application pending·0 cites
- 2242US9165862B1Semiconductor device with plated through holesLOW BOON YEW·Filed 2014·Granted Oct 20, 2015·0 cites·16 claims
- 2342US8802508B2Semiconductor device packageCARPENTER BURTON J·Filed 2012·Granted Aug 12, 2014·0 cites·21 claims
- 2442US2015311143A1Lead frames having metal traces with metal stubsFOONG CHEE SENG·Filed 2014·Application pending·0 cites
- 2542US2014374891A1Semiconductor device with heat spreader and thermal sheetLOW BOON YEW·Filed 2013·Application pending·0 cites
- 2641US9190355B2Multi-use substrate for integrated circuitCHAN WENG HOONG·Filed 2014·Granted Nov 17, 2015·0 cites·18 claims
- 2740US9947614B2Packaged semiconductor device having bent leads and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Apr 17, 2018·0 cites·12 claims
- 2840US2015118802A1Dual corner top gate moldingLOW BOON YEW·Filed 2014·Application pending·0 cites
- 2939US8338828B2Semiconductor package and method of testing sameLOW BOON YEW·Filed 2010·Granted Dec 25, 2012·0 cites·10 claims
- 3037US2016071789A1Molded interposer for packaged semiconductor deviceTONG PEI FAN·Filed 2014·Application pending·0 cites
- 3134US9351407B1Method for forming multilayer device having solder filled via connectionLOW BOON YEW·Filed 2015·Granted May 24, 2016·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →