Inventor · disambiguated record
Bo Qi
Also filed as: QI BO
29 granted patents·8 pending applications·21 citations·filing 2005–2025
93Inventor score
Top patents by PatentIndex Score
37 records- 0194US10886140B23D NAND etchAPPLIED MATERIALS INC·Filed 2019·Granted Jan 5, 2021·9 cites·19 claims
- 0293US11545354B2Molecular layer deposition method and systemAPPLIED MATERIALS INC·Filed 2020·Granted Jan 3, 2023·3 cites·20 claims
- 0387US10870701B2Multispecific fab fusion proteins and use thereofGENERON SHANGHAI CORP LTD·Filed 2017·Granted Dec 22, 2020·5 cites·20 claims
- 0480US12482646B2Processes for depositing SiB filmsAPPLIED MATERIALS INC·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 0577US12198936B2Defect free germanium oxide gap fillAPPLIED MATERIALS INC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 0674US2024321589A1Processes to deposit amorphous-silicon etch protection linerAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0771US10795651B2Method and apparatus for compiling source code object, and computerHUAWEI TECH CO LTD·Filed 2019·Granted Oct 6, 2020·1 cites·8 claims
- 0867US12033848B2Processes for depositing sib filmsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 0967US12027374B2Processes to deposit amorphous-silicon etch protection linerAPPLIED MATERIALS INC·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 1067US11781218B2Defect free germanium oxide gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Oct 10, 2023·0 cites·20 claims
- 1167US11515170B23D NAND etchAPPLIED MATERIALS INC·Filed 2020·Granted Nov 29, 2022·0 cites·18 claims
- 1266US8414747B2High-throughput HDP-CVD processes for advanced gapfill applicationsQI BO·Filed 2007·Granted Apr 9, 2013·3 cites·11 claims
- 1365US2022319841A1Deposition of low-stress carbon-containing layersAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1464US11404263B2Deposition of low-stress carbon-containing layersAPPLIED MATERIALS INC·Filed 2020·Granted Aug 2, 2022·0 cites·17 claims
- 1562US11732352B2Hydrogen free silicon dioxideAPPLIED MATERIALS INC·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 1662US11281441B2Method and apparatus for compiling source code object, and computerHUAWEI TECH CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·8 claims
- 1758US2025357137A1Deposition film tuning and temperature tuning for etch uniformityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1857US11658026B2Conformal silicon oxide film depositionAPPLIED MATERIALS INC·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 1956US11830729B2Low-k boron carbonitride filmsAPPLIED MATERIALS INC·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 2056US11655537B2HDP sacrificial carbon gapfillAPPLIED MATERIALS INC·Filed 2020·Granted May 23, 2023·0 cites·19 claims
- 2156US11626278B2Catalytic formation of boron and carbon filmsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 11, 2023·0 cites·18 claims
- 2256US11355354B1Thermal deposition of doped silicon oxideAPPLIED MATERIALS INC·Filed 2021·Granted Jun 7, 2022·0 cites·20 claims
- 2356US9719983B2Method for stabilizing quantum-dotsFIO CORP·Filed 2013·Granted Aug 1, 2017·0 cites·9 claims
- 2455US11791155B2Diffusion barriers for germaniumAPPLIED MATERIALS INC·Filed 2020·Granted Oct 17, 2023·0 cites·19 claims
- 2555US2019330736A1Low Temperature Atomic Layer Deposition Of Silicon NitrideAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2654US12018364B2Super-conformal germanium oxide filmsAPPLIED MATERIALS INC·Filed 2020·Granted Jun 25, 2024·0 cites·15 claims
- 2754US11495454B2Deposition of low-stress boron-containing layersAPPLIED MATERIALS INC·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 2854US11276573B2Methods of forming high boron-content hard mask materialsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 15, 2022·0 cites·17 claims
- 2953US11682554B2Catalytic thermal deposition of carbon-containing materialsAPPLIED MATERIALS INC·Filed 2021·Granted Jun 20, 2023·0 cites·15 claims
- 3052US11676813B2Doping semiconductor filmsAPPLIED MATERIALS INC·Filed 2020·Granted Jun 13, 2023·0 cites·18 claims
- 3151US11702751B2Non-conformal high selectivity film for etch critical dimension controlAPPLIED MATERIALS INC·Filed 2020·Granted Jul 18, 2023·0 cites·20 claims
- 3250US11791068B2Post insulator and direct current power transmission deviceSTATE GRID CORP CHINA·Filed 2020·Granted Oct 17, 2023·0 cites·16 claims
- 3349US11859278B2Molecular layer deposition of amorphous carbon filmsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 2, 2024·0 cites·16 claims
- 3447US2006154494A1High-throughput HDP-CVD processes for advanced gapfill applicationsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3547US2021327891A1Stack for 3d-nand memory cellAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 3643US2020381623A1Methods of forming silicon nitride encapsulation layersAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3741US2017139667A1Audio play method and deviceZTE CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →