Inventor · disambiguated record
Boun Yoon
Also filed as: YOON BOUN
48 granted patents·26 pending applications·355 citations·filing 2009–2025
97Inventor score
Top patents by PatentIndex Score
74 records- 0195US8076198B2Method of fabricating nonvolatile memory deviceLEE HYOSAN·Filed 2010·Granted Dec 13, 2011·199 cites·11 claims
- 0292US10177160B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 8, 2019·16 cites·20 claims
- 0391US8859371B2Method for manufacturing semiconductor device having dual gate dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 14, 2014·16 cites·23 claims
- 0489US9997412B1Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 12, 2018·7 cites·20 claims
- 0588US8252675B2Methods of forming CMOS transistors with high conductivity gate electrodesLEE JONGWON·Filed 2010·Granted Aug 28, 2012·15 cites·15 claims
- 0686US9117692B2Semiconductor device having dual metal silicide layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 25, 2015·7 cites·12 claims
- 0785US9960241B2Semiconductor device for manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 1, 2018·5 cites·20 claims
- 0885US8790988B2Semiconductor devices having passive element in recessed portion of device isolation pattern and methods of fabricating the sameCHOI SUKHUN·Filed 2013·Granted Jul 29, 2014·8 cites·7 claims
- 0984US10716755B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 21, 2020·4 cites·20 claims
- 1084US10388537B2Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 20, 2019·3 cites·21 claims
- 1184US9006067B2Semiconductor device and method of fabricationg the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 14, 2015·7 cites·15 claims
- 1283US8841769B2Semiconductor device having metal plug and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 23, 2014·7 cites·20 claims
- 1382US12207457B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jan 21, 2025·0 cites·20 claims
- 1482US10916554B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 9, 2021·2 cites·20 claims
- 1582US9748234B2Semiconductor devices and methods of fabricating the sameKWON KEE SANG·Filed 2015·Granted Aug 29, 2017·6 cites·18 claims
- 1681US11424133B2Metal structure and method of manufacturing the same and metal wire and semiconductor device and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·1 cites·9 claims
- 1781US9716162B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 25, 2017·3 cites·20 claims
- 1881US2025294730A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1980US8946026B2Methods of fabricating a semiconductor device including metal gate electrodesCHOI SUKHUN·Filed 2011·Granted Feb 3, 2015·6 cites·28 claims
- 2080US8120089B2Non-volatile memory device and method for fabricating non-volatile memory deviceKIM YOUNG-HOO·Filed 2009·Granted Feb 21, 2012·11 cites·5 claims
- 2179US10128336B2Semiconductor devices and methods for manufacturing the samePARK SANGJINE·Filed 2016·Granted Nov 13, 2018·3 cites·22 claims
- 2279US10096618B2Methods of fabricating three-dimensional semiconductor devicesKIM KI WOONG·Filed 2017·Granted Oct 9, 2018·3 cites·20 claims
- 2379US9966432B2Semiconductor devices including an etch stop pattern and a sacrificial pattern with coplanar upper surfaces and a gate and a gap fill pattern with coplanar upper surfacesPARK SANGJINE·Filed 2016·Granted May 8, 2018·3 cites·28 claims
- 2479US8889552B2Semiconductor device having dual metal silicide layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·6 cites·12 claims
- 2578US11094586B2Semiconductor device including interconnections having different structures and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·20 claims
- 2674US11222897B2Semiconductor device and a fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 11, 2022·1 cites·20 claims
- 2773US11910594B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 2872US2023162970A1Cleaning liquid nozzle, cleaning apparatus, and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2970US10714472B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 14, 2020·1 cites·18 claims
- 3070US10535533B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 3169US8735239B2Semiconductor devices including compressive stress patterns and methods of fabricating the samePARK SANGJINE·Filed 2011·Granted May 27, 2014·3 cites·13 claims
- 3269US2025025982A1Chemical mechanical polishing (cmp) apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3369US2024359286A1Chemical mechanical polishing apparatus and a method of polishing a substrate using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3469US2025043149A1Slurry composition for chemical mechanical polishing and chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3568US12328870B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·18 claims
- 3668US2022165562A1Cleaning liquid nozzle, cleaning apparatus, and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3767US10566338B2Three-dimensional semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 18, 2020·1 cites·20 claims
- 3867US10504960B2Semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·1 cites·19 claims
- 3965US11411004B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 4065US8796127B2Methods of fabricating semiconductor devices and semiconductor devices formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 5, 2014·2 cites·14 claims
- 4165US2024100647A1Substrate processing apparatus and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4264US2023332015A1Slurry composition for polishing metal and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4363US2021098261A1Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4463US2024051079A1Chemical mechanical polishing apparatus and chemical mechanical polishing system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4562US8766232B2Semiconductor memory devices having variable resistor and methods of fabricating the sameCHOI SUKHUN·Filed 2011·Granted Jul 1, 2014·2 cites·13 claims
- 4656US8228089B2Wafer test method and wafer test apparatusKIM YOUNGOK·Filed 2010·Granted Jul 24, 2012·1 cites·5 claims
- 4756US2025022713A1Offset data correction method and semiconductor device manufacturing method including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4856US2024014068A1Semiconductor device including interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4956US2019348277A1Cleaning liquid nozzle, cleaning apparatus, and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 5055US12501685B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →