Inventor · disambiguated record
Brian M. Erwin
Also filed as: ERWIN BRIAN M · ERWIN BRIAN MICHAEL
31 granted patents·10 pending applications·107 citations·filing 2010–2020
95Inventor score
Files withIBM33GLOBALFOUNDRIES INC3SUSS MICROTEC PHOTONIC SYSTEMS INC2DAUBENSPECK TIMOTHY H1ERWIN BRIAN M1
Top patents by PatentIndex Score
41 records- 0197US9997424B2Method of forming a temporary test structure for device fabricationIBM·Filed 2017·Granted Jun 12, 2018·18 cites·11 claims
- 0297US9401336B2Dual layer stack for contact formationIBM·Filed 2014·Granted Jul 26, 2016·48 cites·17 claims
- 0387US9735071B2Method of forming a temporary test structure for device fabricationIBM·Filed 2015·Granted Aug 15, 2017·4 cites·11 claims
- 0484US9565777B1Security mesh and method of makingIBM·Filed 2015·Granted Feb 7, 2017·4 cites·15 claims
- 0583US9601423B1Under die surface mounted electrical elementsIBM·Filed 2015·Granted Mar 21, 2017·4 cites·15 claims
- 0683US9466547B1Passivation layer topographyGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·4 cites·17 claims
- 0781US9324669B2Use of electrolytic plating to control solder wettingIBM·Filed 2014·Granted Apr 26, 2016·5 cites·16 claims
- 0880US10756041B1Finned contactIBM·Filed 2019·Granted Aug 25, 2020·3 cites·20 claims
- 0976US8563416B2Coaxial solder bump support structureERWIN BRIAN MICHAEL·Filed 2011·Granted Oct 22, 2013·5 cites·10 claims
- 1073US8710656B2Redistribution layer (RDL) with variable offset bumpsDAUBENSPECK TIMOTHY H·Filed 2012·Granted Apr 29, 2014·3 cites·19 claims
- 1172US10566275B2Element place on laminatesIBM·Filed 2019·Granted Feb 18, 2020·1 cites·8 claims
- 1272US10043723B2Method of forming a temporary test structure for device fabricationIBM·Filed 2017·Granted Aug 7, 2018·1 cites·1 claims
- 1370US11009545B2Integrated circuit tester probe contact linerIBM·Filed 2020·Granted May 18, 2021·0 cites·20 claims
- 1469US10670653B2Integrated circuit tester probe contact linerIBM·Filed 2018·Granted Jun 2, 2020·0 cites·16 claims
- 1568US9190376B1Organic coating to inhibit solder wetting on pillar sidewallsIBM·Filed 2014·Granted Nov 17, 2015·2 cites·14 claims
- 1666US10224269B2Element place on laminatesIBM·Filed 2015·Granted Mar 5, 2019·1 cites·8 claims
- 1766US8686749B2Thermal interface material, test structure and method of useERWIN BRIAN M·Filed 2010·Granted Apr 1, 2014·3 cites·24 claims
- 1865US9640492B1Laminate warpage controlIBM·Filed 2015·Granted May 2, 2017·1 cites·14 claims
- 1959US10892249B2Carrier and integrated memoryIBM·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 2057US10840214B2Carrier and integrated memoryIBM·Filed 2019·Granted Nov 17, 2020·0 cites·5 claims
- 2157US9899280B2Method of forming a temporary test structure for device fabricationIBM·Filed 2017·Granted Feb 20, 2018·0 cites·20 claims
- 2254US10515929B2Carrier and integrated memoryIBM·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 2354US9728440B2Non-transparent microelectronic grade glass as a substrate, temporary carrier or waferIBM·Filed 2014·Granted Aug 8, 2017·0 cites·9 claims
- 2453US10431563B1Carrier and integrated memoryIBM·Filed 2018·Granted Oct 1, 2019·0 cites·20 claims
- 2553US9214385B2Semiconductor device including passivation layer encapsulantIBM·Filed 2014·Granted Dec 15, 2015·0 cites·11 claims
- 2652US9754823B2Substrate including selectively formed barrier layerIBM·Filed 2014·Granted Sep 5, 2017·0 cites·10 claims
- 2751US2015311161A1Selective plating without photoresistIBM·Filed 2014·Application pending·0 cites
- 2850US9431359B2Coaxial solder bump support structureIBM·Filed 2013·Granted Aug 30, 2016·0 cites·18 claims
- 2950US2018082965A1Maskless selective retention of a cap upon a conductor from a nonconductive capping layerIBM·Filed 2017·Application pending·0 cites
- 3050US2018076160A1Maskless selective retention of a cap upon a conductor from a nonconductive capping layerIBM·Filed 2017·Application pending·0 cites
- 3149US9961765B2Security mesh and method of makingIBM·Filed 2016·Granted May 1, 2018·0 cites·9 claims
- 3249US9343420B2Universal solder joints for 3D packagingGLOBALFOUNDRIES INC·Filed 2014·Granted May 17, 2016·0 cites·12 claims
- 3347US9748135B2Substrate including selectively formed barrier layerIBM·Filed 2015·Granted Aug 29, 2017·0 cites·3 claims
- 3447US2016184926A1Laser ablation system including variable energy beam to minimize etch-stop material damageSUSS MICROTEC PHOTONIC SYSTEMS INC·Filed 2014·Application pending·0 cites
- 3546US2017117241A1Maskless selective retention of a cap upon a conductor from a nonconductive capping layerIBM·Filed 2015·Application pending·0 cites
- 3645US2016035641A1Semiconductor device including passivation layer encapsulantGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
- 3745US2015348910A1Selective plating without photoresistIBM·Filed 2015·Application pending·0 cites
- 3845US2016204028A1Substrate including selectively formed barrier layerIBM·Filed 2016·Application pending·0 cites
- 3944US11168400B2Formation of terminal metallurgy on laminates and boardsIBM·Filed 2018·Granted Nov 9, 2021·0 cites·12 claims
- 4042US2016074968A1Laser etching system including mask reticle for multi-depth etchingSUSS MICROTEC PHOTONIC SYSTEMS INC·Filed 2014·Application pending·0 cites
- 4135US2017179042A1Protection of elements on a laminate surfaceIBM·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →