Inventor · disambiguated record
Brett P. Wilkerson
Also filed as: WILKERSON BRETT · WILKERSON BRETT P
27 granted patents·10 pending applications·103 citations·filing 2005–2024
95Inventor score
Files withADVANCED MICRO DEVICES INC30UEHLING TRENT S3FREESCALE SEMICONDUCTOR INC2AGARWAL RAHUL1WUU JOHN1
Top patents by PatentIndex Score
37 records- 0196US11911839B2Low temperature hybrid bondingADVANCED MICRO DEVICES INC·Filed 2021·Granted Feb 27, 2024·5 cites·20 claims
- 0296US11855061B2Offset-aligned three-dimensional integrated circuitADVANCED MICRO DEVICES INC·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0395US10312221B1Stacked dies and dummy components for improved thermal performanceAGARWAL RAHUL·Filed 2017·Granted Jun 4, 2019·31 cites·22 claims
- 0491US7276435B1Die level metal density gradient for improved flip chip package reliabilityFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 2, 2007·27 cites·20 claims
- 0590US11804479B2Scheme for enabling die reuse in 3D stacked productsADVANCED MICRO DEVICES INC·Filed 2019·Granted Oct 31, 2023·5 cites·20 claims
- 0690US11676940B2Hybrid bonded interconnect bridgingADVANCED MICRO DEVICES INC·Filed 2020·Granted Jun 13, 2023·2 cites·24 claims
- 0789US12249519B2Molded chip package with anchor structuresADVANCED MICRO DEVICES INC·Filed 2022·Granted Mar 11, 2025·1 cites·19 claims
- 0887US12165981B23D semiconductor package with die-mounted voltage regulatorADVANCED MICRO DEVICES INC·Filed 2021·Granted Dec 10, 2024·1 cites·23 claims
- 0986US10431517B2Arrangement and thermal management of 3D stacked diesWUU JOHN·Filed 2017·Granted Oct 1, 2019·6 cites·14 claims
- 1083US7247552B2Integrated circuit having structural support for a flip-chip interconnect pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 24, 2007·12 cites·20 claims
- 1180US2025022847A1Hybrid bonded interconnect bridgingADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1279US12107075B2Hybrid bonded interconnect bridgingADVANCED MICRO DEVICES INC·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 1378US11367628B2Molded chip package with anchor structuresADVANCED MICRO DEVICES INC·Filed 2019·Granted Jun 21, 2022·2 cites·17 claims
- 1475US2025070031A13d semiconductor package with die-mounted voltage regulatorADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1574US12266585B2Arrangement and thermal management of 3D stacked diesADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 1672US8766453B2Packaged integrated circuit having large solder pads and method for formingUEHLING TRENT S·Filed 2012·Granted Jul 1, 2014·3 cites·20 claims
- 1771US10573630B2Offset-aligned three-dimensional integrated circuitADVANCED MICRO DEVICES INC·Filed 2018·Granted Feb 25, 2020·1 cites·13 claims
- 1871US2024063206A1Scheme for enabling die reuse in 3d stacked productsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1970US11742301B2Fan-out package with reinforcing rivetsADVANCED MICRO DEVICES INC·Filed 2019·Granted Aug 29, 2023·1 cites·20 claims
- 2069US12276850B2Fanout module integrating a photonic integrated circuitADVANCED MICRO DEVICES INC·Filed 2023·Granted Apr 15, 2025·0 cites·16 claims
- 2167US11437359B2Offset-aligned three-dimensional integrated circuitADVANCED MICRO DEVICES INC·Filed 2020·Granted Sep 6, 2022·0 cites·18 claims
- 2267US8704370B2Semiconductor package structure having an air gap and method for formingUEHLING TRENT S·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 2362US11189540B2Arrangement and thermal management of 3D stacked diesADVANCED MICRO DEVICES INC·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 2462US11164807B2Arrangement and thermal management of 3D stacked diesADVANCED MICRO DEVICES INC·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
- 2562US9324667B2Semiconductor devices with compliant interconnectsUEHLING TRENT S·Filed 2012·Granted Apr 26, 2016·2 cites·11 claims
- 2662US2025118719A1Chip package with multiple hbm stacksADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 2760US2024371714A1Chip package with a glass interposerADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 2858US11709327B2Fanout module integrating a photonic integrated circuitADVANCED MICRO DEVICES INC·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 2957US2025079276A1Stiffener with integrated connectorsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3056US12374645B2Electronic device including dies and an interconnect coupled to the dies and processes of forming the sameADVANCED MICRO DEVICES INC·Filed 2022·Granted Jul 29, 2025·0 cites·16 claims
- 3155US12424560B2Semiconductor chip deviceADVANCED MICRO DEVICES INC·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 3251US12278150B2Semiconductor package with annular package lid structureADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 15, 2025·0 cites·24 claims
- 3351US2023207544A1Semiconductor device with an embedded active deviceADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
- 3451US2024047228A1Methods for constructing package substrates with high densityADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 3549US12266611B2Mixed density interconnect architectures using hybrid fan-outADVANCED MICRO DEVICES INC·Filed 2020·Granted Apr 1, 2025·0 cites·19 claims
- 3649US2022199429A1Structural thermal interfacing for lidded semiconductor packagesADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
- 3746US2022206221A1Optical die-last wafer-level fanout package with fiber attach capabilityADVANCED MICRO DEVICES INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →