Inventor · disambiguated record
Bu-Won Kim
Also filed as: KIM BU-WON
2 granted patents·3 pending applications·3 citations·filing 2012–2024
47Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0175US10714416B2Semiconductor package having a circuit patternSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 14, 2020·2 cites·20 claims
- 0267US10304766B2Semiconductor package having a circuit patternSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 28, 2019·1 cites·20 claims
- 0355US2025210580A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0452US2025070088A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0529US2012315726A1Method of manufacturing a semiconductor chip packageBYUN HAK-KYOON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →