Inventor · disambiguated record
Byoung Jun Ahn
Also filed as: AHN BYOUNG JUN
6 granted patents·1 pending application·20 citations·filing 2014–2024
77Inventor score
Top patents by PatentIndex Score
7 records- 0194US9859203B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 2, 2018·16 cites·18 claims
- 0293US11961797B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 16, 2024·2 cites·19 claims
- 0387US11121071B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 14, 2021·2 cites·17 claims
- 0485US12388005B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0559US10586761B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Mar 10, 2020·0 cites·10 claims
- 0654US11450644B2Semiconductor package having a reinforcement layerSK HYNIX INC·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 0744US2015303170A1Singulated unit substrate for a semicondcutor deviceAMKOR TECHNOLOGY INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →