Inventor · disambiguated record
Byung Hoon Ahn
Also filed as: AHN BYUNG H · AHN BYUNG HOON · AHN BYUNG MOO
14 granted patents·15 pending applications·312 citations·filing 1994–2025
93Inventor score
Files withSILICON BOX PTE LTD10ST ASSEMBLY TEST SERVICES LTD7AHN BYUNG HOON3AMKOR TECHNOLOGY INC2SILICON BOX LTD2
Top patents by PatentIndex Score
29 records- 0195US7005325B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·99 cites·10 claims
- 0288US7960816B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Jun 14, 2011·15 cites·12 claims
- 0388US7205651B2Thermally enhanced stacked die package and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Apr 17, 2007·45 cites·20 claims
- 0485US6858470B1Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereofST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Feb 22, 2005·36 cites·13 claims
- 0584US7042068B2Leadframe and semiconductor package made using the leadframeAMKOR TECHNOLOGY INC·Filed 2001·Granted May 9, 2006·32 cites·18 claims
- 0679US8410585B2Leadframe and semiconductor package made using the leadframeAHN BYUNG HOON·Filed 2006·Granted Apr 2, 2013·9 cites·20 claims
- 0779US7064420B2Integrated circuit leadframe with ground planeST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Jun 20, 2006·28 cites·20 claims
- 0872US7833840B2Integrated circuit package system with down-set die pad and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2006·Granted Nov 16, 2010·6 cites·20 claims
- 0964US2025219012A1Chip bonding apparatus for semiconductor packaging and semiconductor packaging method using the sameSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 1064US2025219003A1Redistribution layer structure, method of forming redistribution layer structure, semiconductor package device including redistribution layer structure, and method of manufacturing semiconductor package device including redistribution layer structureSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 1163US2025118589A1Die transfer method and apparatus for multi-chip moduleSILICON BOX LTD·Filed 2024·Application pending·0 cites
- 1263US2025105160A1Interconnection module substrate for semiconductor package, semiconductor package device including the same, and manufacturing methods thereofSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 1362US2025079204A1Die transfer method and apparatusSILICON BOX LTD·Filed 2024·Application pending·0 cites
- 1462US2025054867A1Fan-out package including bridge structure and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 1561US2024363550A1Method of manufacturing fan-out packaging device and fan-out packaging device manufactured therebySILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 1658US7135760B2Moisture resistant integrated circuit leadframe packageST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Nov 14, 2006·8 cites·18 claims
- 1758US2025385221A1Semiconductor package device having fan-out structure and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 1857US7091596B2Semiconductor packages and leadframe assembliesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·10 claims
- 1955US8536688B2Integrated circuit leadframe and fabrication method thereforAHN BYUNG HOON·Filed 2004·Granted Sep 17, 2013·7 cites·20 claims
- 2053US9362210B2Leadframe and semiconductor package made using the leadframeAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 7, 2016·0 cites·20 claims
- 2153US2025309038A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 2252US2025294682A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 2352US2025293171A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 2452US2025309173A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 2548US2007148821A1Thermally enhanced stacked die package and fabrication methodDO BYUNG TAI·Filed 2007·Application pending·0 cites
- 2642US5457750AMethod and device for reducing noises generated at an indoor unit of a separate type room air conditioner packageGOLD STAR CO·Filed 1994·Granted Oct 10, 1995·13 cites·6 claims
- 2740US2013144543A1Method for Detecting Breakage of Diesel Particulate FilterAHN BYUNG HOON·Filed 2012·Application pending·0 cites
- 2836US5505486AAir bag mounting deviceHYUNDAI MOTOR CO LTD·Filed 1995·Granted Apr 9, 1996·8 cites·8 claims
- 2930US2002163189A1Sewage pipe connector for intercepting bad smellFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →