Inventor · disambiguated record
Byung Tai Do
Also filed as: DO BYUNG T · DO BYUNG TAI
228 granted patents·19 pending applications·2,889 citations·filing 1995–2017
99Inventor score
Top patents by PatentIndex Score
247 records- 0199US8097490B1Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor diePAGAILA REZA A·Filed 2010·Granted Jan 17, 2012·155 cites·20 claims
- 0298US9893045B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2015·Granted Feb 13, 2018·33 cites·19 claims
- 0398US9406619B2Semiconductor device including pre-fabricated shielding frame disposed over semiconductor diePAGAILA REZA A·Filed 2012·Granted Aug 2, 2016·46 cites·24 claims
- 0498US8940636B2Through hole vias at saw streets including protrusions or recesses for interconnectionPAGAILA REZA A·Filed 2011·Granted Jan 27, 2015·39 cites·21 claims
- 0598US8742579B2Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer corePAGAILA REZA A·Filed 2012·Granted Jun 3, 2014·101 cites·25 claims
- 0698US8349735B2Semiconductor device and method of forming conductive TSV with insulating annular ringSTATS CHIPPAC LTD·Filed 2010·Granted Jan 8, 2013·44 cites·25 claims
- 0798US8283205B2Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor diePAGAILA REZA A·Filed 2012·Granted Oct 9, 2012·47 cites·19 claims
- 0898US8193034B2Semiconductor device and method of forming vertical interconnect structure using stud bumpsPAGAILA REZA A·Filed 2009·Granted Jun 5, 2012·72 cites·20 claims
- 0998US8133762B2Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer corePAGAILA REZA A·Filed 2009·Granted Mar 13, 2012·84 cites·22 claims
- 1098US7902644B2Integrated circuit package system for electromagnetic isolationSTATS CHIPPAC LTD·Filed 2007·Granted Mar 8, 2011·95 cites·18 claims
- 1198US7772046B2Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interferenceSTATS CHIPPAC LTD·Filed 2008·Granted Aug 10, 2010·81 cites·19 claims
- 1298US7741156B2Semiconductor device and method of forming through vias with reflowed conductive materialSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·59 cites·8 claims
- 1398US7618846B1Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the deviceSTATS CHIPPAC LTD·Filed 2008·Granted Nov 17, 2009·92 cites·19 claims
- 1497US8558392B2Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulantCHUA LINDA PEI EE·Filed 2010·Granted Oct 15, 2013·65 cites·45 claims
- 1597US8492201B2Semiconductor device and method of forming through vias with reflowed conductive materialPAGAILA REZA A·Filed 2010·Granted Jul 23, 2013·29 cites·32 claims
- 1697US8021907B2Method and apparatus for thermally enhanced semiconductor packageSTATS CHIPPAC LTD·Filed 2008·Granted Sep 20, 2011·43 cites·18 claims
- 1797US7666711B2Semiconductor device and method of forming double-sided through vias in saw streetsSTATS CHIPPAC LTD·Filed 2008·Granted Feb 23, 2010·53 cites·20 claims
- 1897US7648911B2Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole viasSTATS CHIPPAC LTD·Filed 2008·Granted Jan 19, 2010·44 cites·19 claims
- 1997US7585750B2Semiconductor package having through-hole via on saw streets formed with partial sawSTATS CHIPPAC LTD·Filed 2007·Granted Sep 8, 2009·48 cites·26 claims
- 2096US8633059B2Integrated circuit packaging system with interconnect and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Jan 21, 2014·23 cites·12 claims
- 2196US8378477B2Integrated circuit packaging system with film encapsulation and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 19, 2013·31 cites·20 claims
- 2296US8258010B2Making a semiconductor device having conductive through organic viasPAGAILA REZA A·Filed 2009·Granted Sep 4, 2012·41 cites·29 claims
- 2396US8168458B2Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devicesDO BYUNG TAI·Filed 2008·Granted May 1, 2012·37 cites·25 claims
- 2496US8101460B2Semiconductor device and method of shielding semiconductor die from inter-device interferencePAGAILA REZA A·Filed 2008·Granted Jan 24, 2012·44 cites·25 claims
- 2596US8097489B2Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor diePAGAILA REZA A·Filed 2009·Granted Jan 17, 2012·36 cites·20 claims
- 2696US7859085B2Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole viasSTATS CHIPPAC LTD·Filed 2009·Granted Dec 28, 2010·33 cites·24 claims
- 2796US7829998B2Semiconductor wafer having through-hole vias on saw streets with backside redistribution layerSTATS CHIPPAC LTD·Filed 2007·Granted Nov 9, 2010·35 cites·25 claims
- 2896US7786008B2Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 31, 2010·45 cites·20 claims
- 2996US7723159B2Package-on-package using through-hole via die on saw streetsSTATS CHIPPAC LTD·Filed 2007·Granted May 25, 2010·44 cites·19 claims
- 3096US7704796B2Semiconductor device and method of forming recessed conductive vias in saw streetsSTATS CHIPPAC LTD·Filed 2008·Granted Apr 27, 2010·40 cites·20 claims
- 3196US7659145B2Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the deviceSTATS CHIPPAC LTD·Filed 2008·Granted Feb 9, 2010·38 cites·20 claims
- 3296US7569421B2Through-hole via on saw streetsSTATS CHIPPAC LTD·Filed 2007·Granted Aug 4, 2009·43 cites·24 claims
- 3395US8169058B2Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillarsPAGAILA REZA A·Filed 2009·Granted May 1, 2012·29 cites·30 claims
- 3495US7880275B2Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the deviceSTATS CHIPPAC LTD·Filed 2009·Granted Feb 1, 2011·34 cites·25 claims
- 3595US7566650B2Integrated circuit solder bumping systemSTATS CHIPPAC LTD·Filed 2005·Granted Jul 28, 2009·42 cites·12 claims
- 3694US8247268B2Semiconductor wafer having through-hole vias on saw streets with backside redistribution layerDO BYUNG TAI·Filed 2010·Granted Aug 21, 2012·16 cites·34 claims
- 3794US7750452B2Same size die stacked package having through-hole vias formed in organic materialSTATS CHIPPAC LTD·Filed 2007·Granted Jul 6, 2010·25 cites·25 claims
- 3893US9443828B2Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipationSTATS CHIPPAC LTD·Filed 2015·Granted Sep 13, 2016·7 cites·25 claims
- 3993US7776655B2Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devicesSTATS CHIPPAC LTD·Filed 2008·Granted Aug 17, 2010·20 cites·22 claims
- 4093US7750455B2Triple tier package on package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jul 6, 2010·28 cites·20 claims
- 4192US9048211B2Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipationSTATS CHIPPAC LTD·Filed 2013·Granted Jun 2, 2015·9 cites·25 claims
- 4292US8269320B2Integrated circuit package system for electromagnetic isolation and method for manufacturing thereofHUANG RUI·Filed 2011·Granted Sep 18, 2012·12 cites·18 claims
- 4392US8076757B2Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interferencePAGAILA REZA A·Filed 2010·Granted Dec 13, 2011·13 cites·25 claims
- 4492US7989269B2Semiconductor package with penetrable encapsulant joining semiconductor die and method thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 2, 2011·20 cites·25 claims
- 4592US7902638B2Semiconductor die with through-hole via on saw streets and through-hole via in active area of dieSTATS CHIPPAC LTD·Filed 2007·Granted Mar 8, 2011·20 cites·15 claims
- 4691US8735224B2Integrated circuit packaging system with routed circuit lead array and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted May 27, 2014·10 cites·10 claims
- 4791US8716853B2Extended redistribution layers bumped waferDO BYUNG TAI·Filed 2010·Granted May 6, 2014·10 cites·28 claims
- 4891US8237252B2Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipationPAGAILA REZA A·Filed 2009·Granted Aug 7, 2012·14 cites·19 claims
- 4991US7977802B2Integrated circuit packaging system with stacked die and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jul 12, 2011·20 cites·20 claims
- 5090US9679881B2Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill materialSTATS CHIPPAC LTD·Filed 2013·Granted Jun 13, 2017·9 cites·20 claims
Showing the top 50 of 247 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →