Inventor · disambiguated record
Byungkyu Jang
Also filed as: JANG BYUNGKYU
7 granted patents·2 pending applications·1 citations·filing 2020–2024
70Inventor score
Files withABSOLICS INC9
Top patents by PatentIndex Score
9 records- 0177US12198994B2Packaging substrate and method for manufacturing sameABSOLICS INC·Filed 2020·Granted Jan 14, 2025·1 cites·9 claims
- 0274US2025096055A1Packaging substrate and method for manufacturing sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 0370US12288742B2Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2023·Granted Apr 29, 2025·0 cites·5 claims
- 0467US12456672B2Packaging substrate having element group in cavity unit and semiconductor device comprising the sameABSOLICS INC·Filed 2023·Granted Oct 28, 2025·0 cites·12 claims
- 0557US11652039B2Packaging substrate with core layer and cavity structure and semiconductor device comprising the sameABSOLICS INC·Filed 2020·Granted May 16, 2023·0 cites·9 claims
- 0656US2022165650A1Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2020·Application pending·0 cites
- 0750US12165979B2Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2021·Granted Dec 10, 2024·0 cites·10 claims
- 0849US11981501B2Loading cassette for substrate including glass and substrate loading method to which same is appliedABSOLICS INC·Filed 2020·Granted May 14, 2024·0 cites·10 claims
- 0947US11967542B2Packaging substrate, and semiconductor device comprising sameABSOLICS INC·Filed 2020·Granted Apr 23, 2024·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →