Inventor · disambiguated record
Carl E. D'Acosta
Also filed as: D ACOSTA CARL E · D'ACOSTA CARL EMIL · D'Acosta Carl
7 granted patents·3 pending applications·139 citations·filing 1992–2019
86Inventor score
Top patents by PatentIndex Score
10 records- 0197US10269678B1Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereofNXP USA INC·Filed 2017·Granted Apr 23, 2019·31 cites·16 claims
- 0294US9922894B1Air cavity packages and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Mar 20, 2018·15 cites·14 claims
- 0383US7868729B2Stacked device assembly with integrated coil and method of forming sameFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jan 11, 2011·13 cites·20 claims
- 0480US5851928AMethod of etching a semiconductor substrateMOTOROLA INC·Filed 1995·Granted Dec 22, 1998·64 cites·26 claims
- 0578US10861764B2Microelectronic components having integrated heat dissipation posts and systems including the sameNXP USA INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 0677US9466413B2Die-to-die inductive communication devices and methodsBRAUCHLER FRED T·Filed 2013·Granted Oct 11, 2016·5 cites·15 claims
- 0750US2014167247A1Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2014·Application pending·0 cites
- 0842US2015004902A1Die-to-die inductive communication devices and methodsPIGOTT JOHN M·Filed 2013·Application pending·0 cites
- 0941US5306920AIon implanter with beam resolving apparatus and method for implanting ionsMOTOROLA INC·Filed 1992·Granted Apr 26, 1994·9 cites·10 claims
- 1040US2008128901A1Micro-electro-mechanical systems device and integrated circuit device integrated in a three-dimensional semiconductor structureZURCHER PETER·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →