Inventor · disambiguated record
Chris Auth
Also filed as: AUTH CHRIS
7 granted patents·5 pending applications·391 citations·filing 2003–2021
89Inventor score
Top patents by PatentIndex Score
12 records- 0197US8258057B2Copper-filled trench contact for transistor performance improvementKUHN KELIN J·Filed 2006·Granted Sep 4, 2012·53 cites·13 claims
- 0296US7335959B2Device with stepped source/drain region profileINTEL CORP·Filed 2005·Granted Feb 26, 2008·92 cites·24 claims
- 0395US7045407B2Amorphous etch stop for the anisotropic etching of substratesINTEL CORP·Filed 2003·Granted May 16, 2006·159 cites·7 claims
- 0494US8766372B2Copper-filled trench contact for transistor performance improvementKUHN KELIN J·Filed 2012·Granted Jul 1, 2014·15 cites·18 claims
- 0589US7358547B2Selective deposition to improve selectivity and structures formed therebyINTEL CORP·Filed 2005·Granted Apr 15, 2008·17 cites·4 claims
- 0683US7045408B2Integrated circuit with improved channel stress properties and a method for making itINTEL CORP·Filed 2003·Granted May 16, 2006·32 cites·12 claims
- 0780US7129139B2Methods for selective deposition to improve selectivityINTEL CORP·Filed 2003·Granted Oct 31, 2006·23 cites·9 claims
- 0874US2022115505A1Copper-filled trench contact for transistor performance improvementINTEL CORP·Filed 2021·Application pending·0 cites
- 0957US2017263721A1Copper-filled trench contact for transistor performance improvementINTEL CORP·Filed 2017·Application pending·0 cites
- 1057US2014264879A1Copper-filled trench contact for transistor performance improvementKUHN KELIN J·Filed 2014·Application pending·0 cites
- 1143US2006057809A1Methods for selective deposition to improve selectivityMURTHY ANAND·Filed 2005·Application pending·0 cites
- 1240US2011147855A1Dual silicide flow for cmosJOSHI SUBHASH M·Filed 2009·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chris Auth files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →