Inventor · disambiguated record
Christopher J. Berry
Also filed as: BERRY CHRISTOPHER · BERRY CHRISTOPHER J · BERRY CHRISTOPHER JOHN
38 granted patents·3 pending applications·1,488 citations·filing 1981–2024
98Inventor score
Files withAMKOR TECHNOLOGY INC21AMKOR TECH SINGAPORE HOLDING PTE LTD4BERRY CHRISTOPHER J3SAVANNAH RIVER NUCLEAR SOLUTIONS LLC3BERRY CHRISTOPHER JOHN2
Top patents by PatentIndex Score
41 records- 0199US7777351B1Thin stacked interposer packageAMKOR TECHNOLOGY INC·Filed 2007·Granted Aug 17, 2010·413 cites·24 claims
- 0299US7342303B1Semiconductor device having RF shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 11, 2008·144 cites·20 claims
- 0398US8319338B1Thin stacked interposer packageBERRY CHRISTOPHER J·Filed 2010·Granted Nov 27, 2012·144 cites·20 claims
- 0498US7745910B1Semiconductor device having RF shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2007·Granted Jun 29, 2010·115 cites·20 claims
- 0597US7898066B1Semiconductor device having EMI shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2007·Granted Mar 1, 2011·71 cites·11 claims
- 0697US7872343B1Dual laminate package structure with embedded elementsAMKOR TECHNOLOGY INC·Filed 2010·Granted Jan 18, 2011·36 cites·20 claims
- 0797US7687899B1Dual laminate package structure with embedded elementsAMKOR TECHNOLOGY INC·Filed 2007·Granted Mar 30, 2010·61 cites·20 claims
- 0896US8188584B1Direct-write wafer level chip scale packageBERRY CHRISTOPHER JOHN·Filed 2010·Granted May 29, 2012·41 cites·7 claims
- 0995US8283767B1Dual laminate package structure with embedded elementsBERRY CHRISTOPHER J·Filed 2010·Granted Oct 9, 2012·19 cites·23 claims
- 1095US7723210B2Direct-write wafer level chip scale packageAMKOR TECHNOLOGY INC·Filed 2007·Granted May 25, 2010·32 cites·14 claims
- 1194US9711485B1Thin bonded interposer packageAMKOR TECHNOLOGY INC·Filed 2014·Granted Jul 18, 2017·14 cites·15 claims
- 1294US9466545B1Semiconductor package in packageSCANLAN CHRISTOPHER M·Filed 2007·Granted Oct 11, 2016·29 cites·19 claims
- 1394US8501543B1Direct-write wafer level chip scale packageBERRY CHRISTOPHER JOHN·Filed 2012·Granted Aug 6, 2013·11 cites·20 claims
- 1494US7829990B1Stackable semiconductor package including laminate interposerAMKOR TECHNOLOGY INC·Filed 2007·Granted Nov 9, 2010·34 cites·19 claims
- 1594US7781852B1Membrane die attach circuit element package and method thereforAMKOR TECHNOLOGY INC·Filed 2006·Granted Aug 24, 2010·42 cites·20 claims
- 1694US7507603B1Etch singulated semiconductor packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Mar 24, 2009·40 cites·20 claims
- 1794US7472747B1Biological enhancement of hydrocarbon extractionSAVANNAH RIVER NUCLEAR SOLUTIO·Filed 2007·Granted Jan 6, 2009·38 cites·11 claims
- 1894US4512172AMethod of forming flanged containersMETAL BOX PLC·Filed 1981·Granted Apr 23, 1985·97 cites·15 claims
- 1987US12438110B2Fingerprint sensor and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Oct 7, 2025·0 cites·19 claims
- 2085US9768124B2Semiconductor package in packageAMKOR TECHNOLOGY INC·Filed 2016·Granted Sep 19, 2017·4 cites·20 claims
- 2184US7732899B1Etch singulated semiconductor packageAMKOR TECHNOLOGY INC·Filed 2009·Granted Jun 8, 2010·11 cites·20 claims
- 2283US9875980B2Copper pillar sidewall protectionAMKOR TECHNOLOGY INC·Filed 2014·Granted Jan 23, 2018·6 cites·15 claims
- 2382US10446455B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Oct 15, 2019·2 cites·14 claims
- 2482US8299610B1Semiconductor device having RF shielding and method thereforBERRY CHRISTOPHER J·Filed 2008·Granted Oct 30, 2012·9 cites·20 claims
- 2582US7859116B1Exposed metal bezel for use in sensor devices and method thereforAMKOR TECHNOLOGY INC·Filed 2006·Granted Dec 28, 2010·10 cites·20 claims
- 2681US8365611B1Bend test method and apparatus for flip chip devicesAMKOR TECHNOLOGY INC·Filed 2009·Granted Feb 5, 2013·9 cites·17 claims
- 2779US11990435B2Fingerprint sensor and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted May 21, 2024·0 cites·18 claims
- 2879US6277431B1Anticholesterolemic edible oilREDEEM INC·Filed 1999·Granted Aug 21, 2001·46 cites·13 claims
- 2976US10818637B2Thin bonded interposer packageAMKOR TECHNOLOGY INC·Filed 2019·Granted Oct 27, 2020·1 cites·19 claims
- 3072US7935516B2Surfactant biocatalyst for remediation of recalcitrant organics and heavy metalsSAVANNAH RIVER NUCLEAR SOLUTIONS LLC·Filed 2007·Granted May 3, 2011·4 cites·4 claims
- 3171US11621243B2Thin bonded interposer packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Apr 4, 2023·0 cites·19 claims
- 3271US10297515B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 21, 2019·1 cites·15 claims
- 3365US11393734B2Fingerprint sensor and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jul 19, 2022·0 cites·15 claims
- 3457US10242966B1Thin bonded interposer packageAMKOR TECHNOLOGY INC·Filed 2017·Granted Mar 26, 2019·0 cites·20 claims
- 3550US7473546B2Surfactant biocatalyst for remediation of recalcitrant organics and heavy metalsSAVANNAH RIVER NUCLEAR SOLUTIO·Filed 2003·Granted Jan 6, 2009·2 cites·3 claims
- 3648US7915027B2Surfactant biocatalyst for remediation of recalcitrant organics and heavy metalsSAVANNAH RIVER NUCLEAR SOLUTIONS LLC·Filed 2007·Granted Mar 29, 2011·2 cites·7 claims
- 3746US2001046548A1Anticholesterolemic edible oilFiled 2001·Application pending·0 cites
- 3844US8643177B2Wafers including patterned back side layers thereonRINNE GLENN A·Filed 2010·Granted Feb 4, 2014·0 cites·20 claims
- 3944US2015221570A1Thin sandwich embedded packageAMKOR TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 4037US2002192318A1Anticholesterolemic edible oilMLB ENTPR LLC·Filed 2002·Application pending·0 cites
- 4136US7906315B2Surfactant biocatalyst for remediation of recalcitrant organics and heavy metalsSAVANNAH RIVER NUCLEAR SOLUTIONS LLC·Filed 2007·Granted Mar 15, 2011·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →