Inventor · disambiguated record
Christian Beyer
Also filed as: BEYER CHRISTIAN
53 granted patents·18 pending applications·543 citations·filing 1997–2025
98Inventor score
Files withSILTECTRA GMBH32LEYBOLD VAKUUM GMBH11BEYER CHRISTIAN4OERLIKON LEYBOLD VACUUM GMBH4INFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
71 records- 0197US11527441B2Method for producing a detachment area in a solid bodySILTECTRA GMBH·Filed 2021·Granted Dec 13, 2022·3 cites·11 claims
- 0294US11081393B2Method for splitting semiconductor wafersINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·7 cites·29 claims
- 0393US11014199B2Method of modifying a solid using laser lightSILTECTRA GMBH·Filed 2020·Granted May 25, 2021·2 cites·26 claims
- 0492US10593590B2Combined wafer production method with laser treatment and temperature-induced stressesSILTECTRA GMBH·Filed 2019·Granted Mar 17, 2020·2 cites·15 claims
- 0592US5944049AApparatus and method for regulating a pressure in a chamberAPPLIED MATERIALS INC·Filed 1997·Granted Aug 31, 1999·259 cites·43 claims
- 0691US11004723B2Wafer production methodSILTECTRA GMBH·Filed 2020·Granted May 11, 2021·2 cites·20 claims
- 0791US10661392B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2019·Granted May 26, 2020·2 cites·18 claims
- 0889US10978311B2Method for thinning solid body layers provided with componentsSILTECTRA GMBH·Filed 2017·Granted Apr 13, 2021·5 cites·20 claims
- 0989US6877963B2Vacuum pumpLEYBOLD VAKUUM GMBH·Filed 2001·Granted Apr 12, 2005·30 cites·12 claims
- 1082US12151314B2Device and method for applying pressure to stress-producing layers for improved guidance of a separation crackSILTECTRA GMBH·Filed 2018·Granted Nov 26, 2024·3 cites·18 claims
- 1182US10312135B2Combined wafer production method with laser treatment and temperature-induced stressesSILTECTRA GMBH·Filed 2014·Granted Jun 4, 2019·3 cites·15 claims
- 1282US2023307286A1Method for Producing a Layer of Solid MaterialSILTECTRA GMBH·Filed 2023·Application pending·0 cites
- 1381US7658900B2Reactor and process for the preparation of siliconJOINT SOLAR SILICON GMBH & CO·Filed 2006·Granted Feb 9, 2010·13 cites·26 claims
- 1481US2025280591A1Semiconductor wafer splitting methodINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1579US11869810B2Method for reducing the thickness of solid-state layers provided with componentsSILTECTRA GMBH·Filed 2018·Granted Jan 9, 2024·2 cites·18 claims
- 1679US10994442B2Method for forming a crack in the edge region of a donor substrate, using an inclined laser beamSILTECTRA GMBH·Filed 2016·Granted May 4, 2021·3 cites·8 claims
- 1779US8106354B2Mass spectrometer arrangementHENRY MARKUS·Filed 2008·Granted Jan 31, 2012·12 cites·7 claims
- 1877US12030216B2Method for separating wafers from donor substratesSILTECTRA GMBH·Filed 2023·Granted Jul 9, 2024·0 cites·18 claims
- 1977US11996331B2Method for separating a solid bodySILTECTRA GMBH·Filed 2022·Granted May 28, 2024·0 cites·7 claims
- 2076US6599084B1Rotor fixture for a friction vacuum pumpLEYBOLD VAKUUM GMBH·Filed 2000·Granted Jul 29, 2003·23 cites·13 claims
- 2176US2024058899A1Method for Producing a Detachment Region in a Solid-state BodySILTECTRA GMBH·Filed 2023·Application pending·0 cites
- 2275US11699616B2Method for producing a layer of solid materialSILTECTRA GMBH·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 2374US10898708B2System and method for applying pulsed electromagnetic fieldsNAT UNIV SINGAPORE·Filed 2016·Granted Jan 26, 2021·8 cites·13 claims
- 2474US10724889B2Liquid level detection in receptacles using a plenoptic camera to measure the surface topography of the liquidCSEM CENTRE SUISSE DELECTRONIQUE ET DE MICROTECHNIQUE SA—RECHERCHE ET DEV·Filed 2018·Granted Jul 28, 2020·2 cites·5 claims
- 2574US6457954B1Frictional vacuum pump with chassis, rotor, housing and device fitted with such a frictional vacuum pumpLEYBOLD VAKUUM GMBH·Filed 1999·Granted Oct 1, 2002·42 cites·20 claims
- 2673US6914361B2Magnetic bearingLEYBOLD VAKUUM GMBH·Filed 2003·Granted Jul 5, 2005·13 cites·12 claims
- 2772US12159805B2Method for producing wafers with modification lines of defined orientationSILTECTRA GMBH·Filed 2018·Granted Dec 3, 2024·1 cites·21 claims
- 2871US12356700B2Method for splitting semiconductor wafersINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 8, 2025·0 cites·15 claims
- 2971US11309191B2Method for modifying substrates based on crystal lattice dislocation densitySILTECTRA GMBH·Filed 2019·Granted Apr 19, 2022·1 cites·25 claims
- 3071US9841342B2Leak detection device and method for checking objects for fluid tightness by means of a leak detection deviceWALTER GERHARD WILHELM·Filed 2012·Granted Dec 12, 2017·5 cites·10 claims
- 3171US6833643B2Magnetic bearing with dampingLEYBOLD VAKUUM GMBH·Filed 2001·Granted Dec 21, 2004·13 cites·18 claims
- 3270US10676386B2Method for guiding a crack in the peripheral region of a donor substrateSILTECTRA GMBH·Filed 2019·Granted Jun 9, 2020·0 cites·17 claims
- 3369US11407066B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2015·Granted Aug 9, 2022·1 cites·23 claims
- 3468US10280107B2Method for guiding a crack in the peripheral region of a donor substrateSILTECTRA GMBH·Filed 2016·Granted May 7, 2019·1 cites·16 claims
- 3567US12211702B2Solid body and multi-component arrangementSILTECTRA GMBH·Filed 2021·Granted Jan 28, 2025·0 cites·16 claims
- 3667US2025092346A1Tissue culture vessel for preparation of compressed hydrogel skin grafts and related methods and systemsCUTISS AG·Filed 2024·Application pending·0 cites
- 3765US12097641B2Method for forming a crack in an edge region of a donor substrateSILTECTRA GMBH·Filed 2021·Granted Sep 24, 2024·0 cites·19 claims
- 3864US7544046B2Vacuum pumpOERLIKON LEYBOLD VACUUM GMBH·Filed 2003·Granted Jun 9, 2009·11 cites·11 claims
- 3964US6814550B1Vacuum pump with vibration absorberLEYBOLD VAKUUM GMBH·Filed 2000·Granted Nov 9, 2004·11 cites·10 claims
- 4063US12286611B2Tissue culture vessel for preparation of compressed hydrogel skin grafts and related methods and systemsCUTISS AG·Filed 2022·Granted Apr 29, 2025·0 cites·13 claims
- 4163US2018133834A1Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2015·Application pending·0 cites
- 4261US6435811B1Friction vacuum pump with a stator and a rotorLEYBOLD VAKUUM GMBH·Filed 1998·Granted Aug 20, 2002·26 cites·16 claims
- 4361US2021299910A1Method for separating a solid-state layer from a solid-state materialSILTECTRA GMBH·Filed 2021·Application pending·0 cites
- 4459US11833617B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2018·Granted Dec 5, 2023·0 cites·20 claims
- 4559US11787083B2Production facility for separating wafers from donor substratesSILTECTRA GMBH·Filed 2018·Granted Oct 17, 2023·0 cites·21 claims
- 4655US2025060327A1Computer-implemented method, system and computer program for thermal analysis of a sample of a substanceMETTLER TOLEDO GMBH·Filed 2023·Application pending·0 cites
- 4754US10930560B2Laser-based separation methodSILTECTRA GMBH·Filed 2015·Granted Feb 23, 2021·0 cites·21 claims
- 4854US8992162B2Multi-inlet vacuum pumpHENRY MARKUS·Filed 2010·Granted Mar 31, 2015·1 cites·11 claims
- 4953US6867521B2Vacuum conduitLEYBOLD VAKUUM GMBH·Filed 2002·Granted Mar 15, 2005·5 cites·14 claims
- 5051US11059202B2Method and device for producing planar modifications in solid bodiesSILTECTRA GMBH·Filed 2016·Granted Jul 13, 2021·0 cites·10 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →