Method for separating a solid-state layer from a solid-state material

Abstract

A method for separating a solid-state layer from a solid-state material includes: moving the solid-state material relative to a laser processing system; successively emitting a plurality of laser beams from the laser processing system to the solid-state material to create modifications within the solid-state material; adjusting the laser processing system for defined focusing of the plurality of laser beams and/or for continuous adjustment of energy of the plurality of laser beams as a function of at least one parameter; and detaching the solid-state layer from the solid-state material in a region of the modifications.

What is claimed is: 
     
         1 . A method for separating a solid-state layer from a solid-state material, the method comprising:
 moving the solid-state material relative to a laser processing system;   successively emitting a plurality of laser beams from the laser processing system to the solid-state material to create modifications within the solid-state material;   adjusting the laser processing system for defined focusing of the plurality of laser beams and/or for continuous adjustment of energy of the plurality of laser beams as a function of at least one parameter; and   detaching the solid-state layer from the solid-state material in a region of the modifications.   
     
     
         2 . The method of  claim 1 , wherein detaching the solid-state layer from the solid-state material in the region of the modifications comprises:
 providing a receiving layer on the solid-state material, the receiving layer comprising a polymer material;   applying a thermal treatment to the receiving layer such that the polymer material undergoes a glass transition which imparts mechanical stresses in the solid-state material, the mechanical stresses causing a crack to propagate in the solid-state material along a crack guidance region defined by the modifications; and   detaching the solid-state layer from the solid-state material along the crack guidance region.   
     
     
         3 . The method of  claim 2 , wherein the polymer material is polydimethylsiloxane (PDMS) or an elastomer or an epoxy resin or a combination thereof. 
     
     
         4 . The method of  claim 2 , wherein the receiving layer comprises a polymer-hybrid material which forms a polymer matrix, and wherein a filler is in the polymer matrix. 
     
     
         5 . The method of  claim 4 , wherein the polymer matrix is a polydimethylsiloxane matrix, and wherein an amount by weight of the polymer matrix in the polymer-hybrid material is between 80% to 99%. 
     
     
         6 . The method of  claim 1 , wherein the adjusting of the laser processing system is implemented based on differentiating tilting of the solid-state material due to placement errors. 
     
     
         7 . The method of  claim 6 , wherein the tilting is differentiated with response to machine holders that hold the solid-state material. 
     
     
         8 . The method of  claim 1 , wherein the solid-state material is a semiconductor ingot, and wherein the adjusting of the laser processing system is implemented based on planarity errors in the semiconductor ingot. 
     
     
         9 . The method of  claim 1 , wherein the laser processing system is adjusted by a refractive index determination sensor and a topography determination sensor.