Inventor · disambiguated record
Ralf Rieske
Also filed as: RIESKE RALF
18 granted patents·4 pending applications·16 citations·filing 2012–2024
89Inventor score
Top patents by PatentIndex Score
22 records- 0189US10978311B2Method for thinning solid body layers provided with componentsSILTECTRA GMBH·Filed 2017·Granted Apr 13, 2021·5 cites·20 claims
- 0282US12151314B2Device and method for applying pressure to stress-producing layers for improved guidance of a separation crackSILTECTRA GMBH·Filed 2018·Granted Nov 26, 2024·3 cites·18 claims
- 0379US11869810B2Method for reducing the thickness of solid-state layers provided with componentsSILTECTRA GMBH·Filed 2018·Granted Jan 9, 2024·2 cites·18 claims
- 0477US12030216B2Method for separating wafers from donor substratesSILTECTRA GMBH·Filed 2023·Granted Jul 9, 2024·0 cites·18 claims
- 0576US2024058899A1Method for Producing a Detachment Region in a Solid-state BodySILTECTRA GMBH·Filed 2023·Application pending·0 cites
- 0675US2024413023A1Method and apparatus for producing at least one modification in a solid bodyINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0772US12159805B2Method for producing wafers with modification lines of defined orientationSILTECTRA GMBH·Filed 2018·Granted Dec 3, 2024·1 cites·21 claims
- 0872US12107017B2Method and apparatus for producing at least one modification in a solid bodyINFINEON TECHNOLOGIES AG·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 0971US11309191B2Method for modifying substrates based on crystal lattice dislocation densitySILTECTRA GMBH·Filed 2019·Granted Apr 19, 2022·1 cites·25 claims
- 1069US11407066B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2015·Granted Aug 9, 2022·1 cites·23 claims
- 1167US12211702B2Solid body and multi-component arrangementSILTECTRA GMBH·Filed 2021·Granted Jan 28, 2025·0 cites·16 claims
- 1267US2023330769A1Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1363US11712749B2Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 1, 2023·0 cites·26 claims
- 1462US11551981B2Method and apparatus for producing at least one modification in a solid bodyINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 10, 2023·0 cites·18 claims
- 1561US9239042B2System for monitoring the condition of rotor blades at wind turbinesFRANKENSTEIN BERND·Filed 2012·Granted Jan 19, 2016·3 cites·20 claims
- 1661US2021299910A1Method for separating a solid-state layer from a solid-state materialSILTECTRA GMBH·Filed 2021·Application pending·0 cites
- 1759US11833617B2Splitting of a solid using conversion of materialSILTECTRA GMBH·Filed 2018·Granted Dec 5, 2023·0 cites·20 claims
- 1859US11787083B2Production facility for separating wafers from donor substratesSILTECTRA GMBH·Filed 2018·Granted Oct 17, 2023·0 cites·21 claims
- 1951US11059202B2Method and device for producing planar modifications in solid bodiesSILTECTRA GMBH·Filed 2016·Granted Jul 13, 2021·0 cites·10 claims
- 2041US11664277B2Method for thinning solid-body layers provided with componentsSILTECTRA GMBH·Filed 2018·Granted May 30, 2023·0 cites·19 claims
- 2140US11822307B2Laser conditioning of solid bodies using prior knowledge from previous machining stepsSILTECTRA GMBH·Filed 2017·Granted Nov 21, 2023·0 cites·14 claims
- 2240US11130200B2Combined laser treatment of a solid body to be splitSILTECTRA GMBH·Filed 2017·Granted Sep 28, 2021·0 cites·22 claims
Join the waitlist — get patent alerts
Get an alert when Ralf Rieske files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →