Inventor · disambiguated record
Chien-Wei Chang
Also filed as: CHANG CHIEN WEI
38 granted patents·45 pending applications·155 citations·filing 2002–2025
96Inventor score
Files withCHANG CHIEN-WEI25KINSUS INTERCONNECT TECH CORP12TAIWAN SEMICONDUCTOR MFG CO LTD6ADVANCED SEMICONDUCTOR ENG5KINGPAK TECH INC4
Top patents by PatentIndex Score
83 records- 0195US8173401B2Method for direct amplification from crude nucleic acid samplesCHANG CHIEN-WEI·Filed 2009·Granted May 8, 2012·43 cites·11 claims
- 0293US8460934B2Method for direct amplification from crude nucleic acid samplesCHANG CHIEN-WEI·Filed 2012·Granted Jun 11, 2013·13 cites·5 claims
- 0384US7598580B1Image sensor module package structure with supporting elementKINGPAK TECH INC·Filed 2008·Granted Oct 6, 2009·14 cites·15 claims
- 0481US11851325B2Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 26, 2023·2 cites·20 claims
- 0581US8409806B2Allelic ladder lociGREEN ROBERT·Filed 2010·Granted Apr 2, 2013·2 cites·24 claims
- 0681US8153401B2Method for direct amplification from crude nucleic acid samplesCHANG CHIEN-WEI·Filed 2007·Granted Apr 10, 2012·2 cites·21 claims
- 0780US12234145B2Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0880US6759318B1Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing processKINSUS INTERCONNECT TECH CORP·Filed 2003·Granted Jul 6, 2004·32 cites·4 claims
- 0976US9088761B2Image recording system, image recorder, and data accessing methodVIVOTEK INC·Filed 2013·Granted Jul 21, 2015·3 cites·12 claims
- 1076US8051558B2Manufacturing method of the embedded passive deviceKINSUS INTERCONNECT TECH CORP·Filed 2008·Granted Nov 8, 2011·5 cites·6 claims
- 1176US7875809B2Method of fabricating board having high density core layer and structure thereofKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Jan 25, 2011·8 cites·1 claims
- 1273US2024021650A1Packaging structure and method of a photosensitive moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1372US12040312B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 16, 2024·0 cites·6 claims
- 1472US8377815B2Manufacturing method of a semiconductor load boardKINSUS INTERCONNECT TECH CORP·Filed 2011·Granted Feb 19, 2013·4 cites·12 claims
- 1572US8083954B2Method for fabricating component-embedded printed circuit boardCHANG CHIEN-WEI·Filed 2008·Granted Dec 27, 2011·5 cites·8 claims
- 1671US9057110B2Method for direct amplification from crude nucleic acid samplesLIFE TECHNOLOGIES CORP·Filed 2013·Granted Jun 16, 2015·0 cites·5 claims
- 1770US2025154000A1Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1870US2024021649A1Through-substrate-via in photosensitive moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1969US11850702B2Chemical mechanical planarization membraneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2068US2009311709A1Compositions, Methods, and Kits for (MIS)Ligating OligonucleotidesLIFE TECHNOLOGIES CORP·Filed 2009·Application pending·0 cites
- 2168US2024387312A1Silicon fragment defect reduction in grinding processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2266US7871892B2Method for fabricating buried capacitor structureKINSUS INTERCONNECT TECH CORP·Filed 2009·Granted Jan 18, 2011·3 cites·3 claims
- 2364US9518302B2Method for direct amplification from crude nucleic acid samplesLIFE TECHNOLOGIES CORP·Filed 2015·Granted Dec 13, 2016·0 cites·3 claims
- 2464US9411690B2Security surveillance apparatus with networking and video recording functions and failure detecting and repairing method for storage device thereofVIVOTEK INC·Filed 2014·Granted Aug 9, 2016·1 cites·18 claims
- 2564US9389696B2Multimedia playing deviceDIGILIFE TECHNOLOGIES CO LTD·Filed 2014·Granted Jul 12, 2016·1 cites·16 claims
- 2663US2014162258A1Compositions, methods, and kits for (mis)ligating oligonucleotidesAPPLIED BIOSYSTEMS LLC·Filed 2013·Application pending·0 cites
- 2762US2025056911A1Chip package and manufacturing method thereofXINTEC INC·Filed 2024·Application pending·0 cites
- 2862US2025393119A1Anti-warpage carrierKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 2962US2014248692A1Systems and methods for nucleic acid-based identificationLAGACE ROBERT·Filed 2012·Application pending·0 cites
- 3062US2025393123A1Impact-resistant reinforced carrierKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 3162US2025389754A1Test fixtureKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 3261US2005282195A1Compositions, methods, and kits for (MIS)ligating oligonucleotidesAPPLERA CORP·Filed 2005·Application pending·0 cites
- 3361US2025372584A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 3460US8312624B1Method for manufacturing a heat dissipation structure of a printed circuit boardCHANG CHIEN-WEI·Filed 2011·Granted Nov 20, 2012·1 cites·4 claims
- 3560US6969674B2Structure and method for fine pitch flip chip substrateKINSUS INTERCONNECT TECH CORP·Filed 2004·Granted Nov 29, 2005·12 cites·14 claims
- 3660US2025247954A1Micro circuit structure and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 3760US2025079333A1Anti-warpage reinforced carrierKINSUS INTERCONNECT TECH CORP·Filed 2023·Application pending·0 cites
- 3859US9184331B2Method for reducing tilt of optical unit during manufacture of image sensorKINGPAK TECH INC·Filed 2013·Granted Nov 10, 2015·1 cites·20 claims
- 3959US2025374429A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 4057US8004602B2Image sensor structure and integrated lens module thereofKINGPAK TECH INC·Filed 2008·Granted Aug 23, 2011·1 cites·15 claims
- 4157US7573721B2Embedded passive device structure and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Aug 11, 2009·1 cites·7 claims
- 4256US2025372502A1Chip packageXINTEC INC·Filed 2025·Application pending·0 cites
- 4356US2012082979A1Compositions, methods, and kits for (mis)ligating oligonucleotidesKARGER ACHIM E·Filed 2011·Application pending·0 cites
- 4456US2018018422A1Systems and methods for nucleic acid-based identificationLIFE TECHNOLOGIES CORP·Filed 2017·Application pending·0 cites
- 4555US7525242B2Lamp clamping and electrically connecting deviceAU OPTRONICS CORP·Filed 2005·Granted Apr 28, 2009·1 cites·26 claims
- 4655US2009111213A1High-Density Fine Line Structure And Method Of Manufacturing The SameCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 4754US11424212B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 23, 2022·0 cites·5 claims
- 4854USRE45298EMultimedia playing deviceCHANG CHIEN-WEI·Filed 2013·Granted Dec 23, 2014·0 cites·15 claims
- 4954US8471375B2High-density fine line structure and method of manufacturing the sameCHANG CHIEN-WEI·Filed 2007·Granted Jun 25, 2013·0 cites·5 claims
- 5053US8305345B2Multimedia playing deviceCHANG CHIEN-WEI·Filed 2008·Granted Nov 6, 2012·0 cites·14 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →