Inventor · disambiguated record
Chih-Horng Chang
Also filed as: CHANG CHIH-HORNG
34 granted patents·3 pending applications·103 citations·filing 2007–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23TAIWAN SEMICONDUCTOR MFG8CHANG CHIH-HORNG4LEE SHENG-LONG1TSAI TSUNG-FU1
Top patents by PatentIndex Score
37 records- 0198US11508656B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·8 cites·20 claims
- 0294US8853853B2Bump structuresCHANG CHIH-HORNG·Filed 2011·Granted Oct 7, 2014·24 cites·20 claims
- 0394US8581420B2Under-bump metallization (UBM) structure and method of forming the sameTSAI TSUNG-FU·Filed 2011·Granted Nov 12, 2013·21 cites·20 claims
- 0493US9105533B2Bump structure having a single side recessTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 11, 2015·9 cites·20 claims
- 0592US10867892B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·11 cites·20 claims
- 0690US9520379B2Method of forming bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 13, 2016·5 cites·20 claims
- 0785US9318458B2Bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 19, 2016·3 cites·20 claims
- 0884US12500200B2Package structure with conductive patterns in a redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
- 0982US11049805B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·2 cites·19 claims
- 1082US10833033B2Bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·2 cites·20 claims
- 1182US10811338B2Surface treatment method and apparatus for semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·2 cites·20 claims
- 1282US2024297114A1Methods of forming semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1380US12374599B2Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 1480US2025309043A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1579US12087718B2Bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1679US12014979B2Methods of forming semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 1778US9425180B2Treating copper surfaces for packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·3 cites·20 claims
- 1876US10388622B2Bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 20, 2019·1 cites·20 claims
- 1972US10522444B2Surface treatment method and apparatus for semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 31, 2019·2 cites·20 claims
- 2072US8907479B2Treating copper surfaces for packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 9, 2014·2 cites·21 claims
- 2171US11631648B2Bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·20 claims
- 2270US11776880B2Surface treatment method and apparatus for semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
- 2368US11915994B2Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·15 claims
- 2468US8823170B2Apparatus and method for three dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 2, 2014·2 cites·20 claims
- 2567US9257385B2Landing areas of bonding structuresCHANG CHIH-HORNG·Filed 2011·Granted Feb 9, 2016·2 cites·19 claims
- 2666US10163801B2Structure and formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·1 cites·20 claims
- 2766US9059158B2Semiconductor device having under-bump metallization (UBM) structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 16, 2015·1 cites·20 claims
- 2866US9048333B2Isolation rings for packages and the method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 2, 2015·1 cites·20 claims
- 2965US8803338B2Semiconductor device having under-bump metallization (UBM) structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·1 cites·20 claims
- 3058US12100682B2Package structure with conductive patterns in a redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 24, 2024·0 cites·20 claims
- 3158US9824992B2Bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 21, 2017·0 cites·20 claims
- 3256US9929070B2Isolation rings for packages and the method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·0 cites·20 claims
- 3353US9548245B2Isolation rings for packages and the method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 17, 2017·0 cites·20 claims
- 3452US8710681B2Isolation rings for blocking the interface between package components and the respective molding compoundCHANG CHIH-HORNG·Filed 2012·Granted Apr 29, 2014·0 cites·20 claims
- 3550US9006909B2Solder mask shape for BOT laminate packagesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·0 cites·20 claims
- 3641US2008305354A1Filler Composition for Welding onto a SubstrateLEE SHENG-LONG·Filed 2007·Application pending·0 cites
- 3739US8308052B2Thermal gradient reflow for forming columnar grain structures for solder bumpsCHANG CHIH-HORNG·Filed 2010·Granted Nov 13, 2012·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Chih-Horng Chang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →