Inventor · disambiguated record
Chin-Huang Chang
Also filed as: CHANG CHIN-HUANG
20 granted patents·24 pending applications·233 citations·filing 2000–2016
95Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD36CHANG CHIN-HUANG3CHIANG CHENG-CHIA1GRAND MATE CO LTD1INST INFORMATION IND1
Top patents by PatentIndex Score
44 records- 0188US6919627B2Multichip moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jul 19, 2005·49 cites·14 claims
- 0285US6864434B2Warpage-preventive circuit board and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Mar 8, 2005·36 cites·4 claims
- 0382USD498760SDigital memory cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Nov 23, 2004·28 cites·1 claims
- 0481US7266888B2Method for fabricating a warpage-preventive circuit boardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Sep 11, 2007·9 cites·6 claims
- 0578US7193309B2Semiconductor package with stacked chips and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 20, 2007·24 cites·8 claims
- 0676US6835897B2Warpage preventing substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 28, 2004·29 cites·10 claims
- 0770US8896130B2Multi-chip stack structure and method for fabricating the sameLIU CHUNG-LUN·Filed 2008·Granted Nov 25, 2014·6 cites·13 claims
- 0869US8304891B2Semiconductor package device, semiconductor package structure, and fabrication methods thereofCHIANG CHENG-CHIA·Filed 2008·Granted Nov 6, 2012·5 cites·11 claims
- 0968US6720270B1Method for reducing size of semiconductor unit in packaging processSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Apr 13, 2004·12 cites·20 claims
- 1064US9754927B2Method for fabricating multi-chip stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Sep 5, 2017·1 cites·13 claims
- 1163US8802507B2Fabrication method of semiconductor package device, and fabrication method of semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Aug 12, 2014·1 cites·13 claims
- 1261US7768106B2Multi-chip stack structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Aug 3, 2010·2 cites·7 claims
- 1360US6963135B2Semiconductor package for memory chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Nov 8, 2005·11 cites·7 claims
- 1459US6737737B1Semiconductor package with chip supporting memberSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted May 18, 2004·9 cites·20 claims
- 1554US2010136266A1Ornament Assembly that is Assembled and Disassembled Easily and ConvenientlyCHANG CHIN-HUANG·Filed 2008·Application pending·0 cites
- 1653US7339199B2Semiconductor package including light emitter and ICSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 4, 2008·1 cites·20 claims
- 1752USD493799SDigital memory cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Aug 3, 2004·8 cites·1 claims
- 1850US2008174030A1Multichip stacking structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1950US2009032928A1Multi-chip stack structure having through silicon via and method for fabrication the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2049US7205485B2Printed circuit board and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Apr 17, 2007·2 cites·20 claims
- 2149US2008176358A1Fabrication method of multichip stacking structureSILICON PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 2248US7655503B2Method for fabricating semiconductor package with stacked chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Feb 2, 2010·0 cites·8 claims
- 2346US2009261476A1Semiconductor device and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2446US2008251937A1Stackable semiconductor device and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2546US2009057799A1Sensor semiconductor device and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2646US2008283971A1Semiconductor Device and Its Fabrication MethodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2746US2009166831A1Sensor semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2846US2008230913A1Stackable semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2946US2009039527A1Sensor-type package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 3046US2011227226A1Multi-chip stack structure having through silicon viaSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 3145US7981729B2Fabrication method of multi-chip stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted Jul 19, 2011·0 cites·16 claims
- 3245US2008283982A1Multi-chip semiconductor device having leads and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 3345US2008283994A1Stacked package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 3445US2008303134A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 3545US2009014860A1Multi-chip stack structure and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 3645US2008258306A1Semiconductor Device and Method for Fabricating the SameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 3743US2007164411A1Semiconductor package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 3843US2007164403A1Semiconductor package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 3941US10080179B2Method for verifying operation in wireless control systemGRAND MATE CO LTD·Filed 2016·Granted Sep 18, 2018·0 cites·16 claims
- 4041US2006223216A1Sensor module structure and method for fabricating the sameCHANG CHIN-HUANG·Filed 2005·Application pending·0 cites
- 4141US2006145362A1Semiconductor package and fabrication method of the sameCHANG CHIN-HUANG·Filed 2005·Application pending·0 cites
- 4240US2005006785A1Manufacturing method for multichip moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Application pending·0 cites
- 4338US2017113369A1Tool measurement device, tool measurement method and non-transitory computer readable medium for operating tool measurement methodINST INFORMATION IND·Filed 2015·Application pending·0 cites
- 4436US2002058357A1Die attaching methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →