Inventor · disambiguated record
Chi Wah Cheng
Also filed as: CHENG CHI · CHENG CHI WAH
51 granted patents·9 pending applications·324 citations·filing 1996–2023
98Inventor score
Files withCHENG CHI WAH18ASM ASSEMBLY AUTOMATION LTD17ASM TECH SINGAPORE PTE LTD13ASMPT SINGAPORE PTE LTD4KWOK CHI HANG2
Top patents by PatentIndex Score
60 records- 0197US7495759B1Damage and wear detection for rotary cutting bladesASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Feb 24, 2009·42 cites·14 claims
- 0286US8251422B2Apparatus for transferring electronic components in stagesCHENG CHI WAH·Filed 2010·Granted Aug 28, 2012·10 cites·12 claims
- 0386US6386422B1Solder reflow ovenASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted May 14, 2002·54 cites·42 claims
- 0485US8037996B2Transfer apparatus for handling electronic componentsASM ASSEMBLY AUTOMATION LTD·Filed 2009·Granted Oct 18, 2011·12 cites·7 claims
- 0583US10996308B2Apparatus and method for authentication of electronic device test stationsASM TECH SINGAPORE PTE LTD·Filed 2018·Granted May 4, 2021·2 cites·17 claims
- 0683US9850074B2Electronic device separator for a feeding apparatusASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Dec 26, 2017·4 cites·10 claims
- 0782US10056278B2Apparatus and method for transferring electronic devicesASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Aug 21, 2018·4 cites·17 claims
- 0882US9218995B2Transfer apparatus for transferring electronic devices and changing their orientationsCHENG CHI WAH·Filed 2014·Granted Dec 22, 2015·6 cites·15 claims
- 0981US8967368B2Apparatus for processing electronic devicesCHENG CHI WAH·Filed 2013·Granted Mar 3, 2015·5 cites·13 claims
- 1081US7762449B2Bond head for heavy wire bonderASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Jul 27, 2010·12 cites·20 claims
- 1180US9465383B2Apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor componentsSIU HING SUEN·Filed 2014·Granted Oct 11, 2016·5 cites·16 claims
- 1279US8657181B2Wedge bonder and a method of cleaning a wedge bonderCHENG CHI WAH·Filed 2012·Granted Feb 25, 2014·6 cites·20 claims
- 1379US8434669B1Universal bond head for wire bondersCHENG CHI WAH·Filed 2012·Granted May 7, 2013·6 cites·8 claims
- 1477US8167524B2Handling system for inspecting and sorting electronic componentsCHENG CHI WAH·Filed 2007·Granted May 1, 2012·6 cites·11 claims
- 1577US8091762B1Wedge bonding method incorporating remote pattern recognition systemCHENG CHI WAH·Filed 2010·Granted Jan 10, 2012·6 cites·15 claims
- 1677US7258703B2Apparatus and method for aligning devices on carriersASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Aug 21, 2007·19 cites·16 claims
- 1775US7726540B2Apparatus and method for arranging devices for processingASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Jun 1, 2010·9 cites·11 claims
- 1873US9561914B1Apparatus and method for transferring electronic devicesASM TECH SINGAPORE PTE LTD·Filed 2015·Granted Feb 7, 2017·4 cites·13 claims
- 1972US8742288B2Laser apparatus for singulation, and a method of singulationKWOK CHI HANG·Filed 2011·Granted Jun 3, 2014·4 cites·19 claims
- 2072US8011058B2Singulation handler system for electronic packagesASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Sep 6, 2011·5 cites·19 claims
- 2171US9508570B2Singulation apparatus and methodCHENG CHI WAH·Filed 2013·Granted Nov 29, 2016·4 cites·5 claims
- 2270US6766938B2Apparatus and method of placing solder balls onto a substrateASM ASSEMBLY AUTOMATION LTD·Filed 2002·Granted Jul 27, 2004·21 cites·13 claims
- 2368US10473714B2Method and apparatus for aligning electronic componentsASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Nov 12, 2019·1 cites·11 claims
- 2464US10115620B2Apparatus and method for adjustment of a handling device for handling electronic componentsASM TECH SINGAPORE PTE LTD·Filed 2015·Granted Oct 30, 2018·1 cites·14 claims
- 2563US6607118B2Apparatus and method for ball releaseASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Aug 19, 2003·10 cites·7 claims
- 2662US8289388B2Alignment method for singulation systemCHENG CHI WAH·Filed 2009·Granted Oct 16, 2012·1 cites·8 claims
- 2760US11592477B2Test handler having multiple testing sectorsASMPT SINGAPORE PTE LTD·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 2860US9263352B2Singulation apparatus comprising an imaging deviceCHENG CHI WAH·Filed 2014·Granted Feb 16, 2016·1 cites·19 claims
- 2960US7849847B2Drainage apparatus for a singulation systemASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Dec 14, 2010·1 cites·19 claims
- 3058US8978673B2Megasonic cleaning systemCHENG CHI WAH·Filed 2007·Granted Mar 17, 2015·1 cites·17 claims
- 3158US7190446B2System for processing electronic devicesASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Mar 13, 2007·9 cites·18 claims
- 3257US6983872B2Substrate alignment method and apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Jan 10, 2006·8 cites·16 claims
- 3356US5897048ARadial wire bonder and selectable side view inspection systemASM ASSEMBLY AUTOMATION LTD·Filed 1996·Granted Apr 27, 1999·21 cites·1 claims
- 3451US2025071962A1Bond head having individually-displaceable bond armsASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 3550US2025031357A1Bonding tool incorporating decoupled motion axesASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 3649US6276598B1Method and apparatus for ball placementASM ASSEMBLY AUTOMATION LTD·Filed 1999·Granted Aug 21, 2001·16 cites·12 claims
- 3747US2008164646A1Workholder for supporting electronic devicesCHENG CHI WAH·Filed 2007·Application pending·0 cites
- 3846US9461013B2Wire spool system for a wire bonding apparatusCHENG CHI WAH·Filed 2014·Granted Oct 4, 2016·0 cites·6 claims
- 3945US8167523B2Singulation handler comprising vision systemCHENG CHI WAH·Filed 2007·Granted May 1, 2012·0 cites·9 claims
- 4045US2009148258A1Pick and place apparatus incorporating debris removal deviceCHENG CHI WAH·Filed 2007·Application pending·0 cites
- 4144US10741434B2Apparatus for packing ultra-small electronic devicesASM TECH SINGAPORE PTE LTD·Filed 2018·Granted Aug 11, 2020·0 cites·14 claims
- 4244US10338006B2Method and apparatus for aligning and inspecting electronic componentsASM TECH SINGAPORE PTE LTD·Filed 2017·Granted Jul 2, 2019·0 cites·18 claims
- 4344US8709916B2Laser processing method and apparatusKWOK CHI HANG·Filed 2012·Granted Apr 29, 2014·0 cites·3 claims
- 4443US11600516B2Die ejector height adjustmentASMPT SINGAPORE PTE LTD·Filed 2020·Granted Mar 7, 2023·0 cites·15 claims
- 4543US9261536B2Test contactor for electrical testing of electronic componentsSIU HING SUEN·Filed 2012·Granted Feb 16, 2016·0 cites·7 claims
- 4643US7147721B2Apparatus and method for cleaning electronic packagesASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Dec 12, 2006·1 cites·23 claims
- 4742US11343949B2Apparatus and method for dispensing a viscous adhesiveASM TECH SINGAPORE PTE LTD·Filed 2018·Granted May 24, 2022·0 cites·12 claims
- 4842US8538576B2Method of configuring a dicing device, and a dicing apparatus for dicing a workpieceCHENG CHI WAH·Filed 2011·Granted Sep 17, 2013·0 cites·18 claims
- 4941US11289445B2Die bonder incorporating rotatable adhesive dispenser headASM TECH SINGAPORE PTE LTD·Filed 2018·Granted Mar 29, 2022·0 cites·16 claims
- 5041US9016675B2Apparatus and method for supporting a workpiece during processingCHENG CHI WAH·Filed 2012·Granted Apr 28, 2015·0 cites·10 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →