Inventor · disambiguated record
Chyi Shyuan Chern
Also filed as: CHERN CHYI S · CHERN CHYI SHYUAN
57 granted patents·11 pending applications·441 citations·filing 2002–2024
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG15TAIWAN SEMICONDUCTOR MFG CO LTD15TSMC SOLID STATE LIGHTING LTD8CHERN CHYI-SHYUAN4HUANG KUO BIN3
Top patents by PatentIndex Score
68 records- 0197US8241932B1Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2011·Granted Aug 14, 2012·49 cites·20 claims
- 0294US8404572B2Multi-zone temperature control for semiconductor waferCHANG CHUN-LIN·Filed 2009·Granted Mar 26, 2013·40 cites·20 claims
- 0394US8088685B2Integration of bottom-up metal film depositionLIN SIMON SU-HORNG·Filed 2010·Granted Jan 3, 2012·23 cites·20 claims
- 0492US8119473B2High temperature anneal for aluminum surface protectionHUANG KUO BIN·Filed 2009·Granted Feb 21, 2012·30 cites·15 claims
- 0592US6650018B1High power, high luminous flux light emitting diode and method of making sameAXT INC·Filed 2002·Granted Nov 18, 2003·121 cites·45 claims
- 0691US7732344B1High selectivity etching process for metal gate N/P patterningTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jun 8, 2010·26 cites·20 claims
- 0790US10113233B2Multi-zone temperature control for semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 30, 2018·6 cites·14 claims
- 0890US7193245B2High power, high luminous flux light emitting diode and method of making sameLUMEI OPTOELECTRONICS CORP·Filed 2005·Granted Mar 20, 2007·25 cites·24 claims
- 0987US9024341B2Refractive index tuning of wafer level package LEDsLEE HSIAO-WEN·Filed 2010·Granted May 5, 2015·7 cites·20 claims
- 1087US7919335B2Formation of shallow trench isolation using chemical vapor etchTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Apr 5, 2011·12 cites·14 claims
- 1186US9864270B2Pellicle and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·3 cites·20 claims
- 1284US9349712B2Doubled substrate multi-junction light emitting diode array structureTSMC SOLID STATE LIGHTING LTD·Filed 2015·Granted May 24, 2016·4 cites·20 claims
- 1384US8598617B2Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2012·Granted Dec 3, 2013·6 cites·20 claims
- 1484US8277286B2Slurry dispenser for chemical mechanical polishing (CMP) apparatus and methodHUNG KUN-KU·Filed 2009·Granted Oct 2, 2012·17 cites·19 claims
- 1582US7642183B2High power, high luminous flux light emitting diode and method of making sameDALIAN MEIMING EPITAXY TECH CO LTD·Filed 2005·Granted Jan 5, 2010·13 cites·12 claims
- 1680US9324910B2Light emitting diodeTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Apr 26, 2016·3 cites·20 claims
- 1780US9023664B2Multi-zone temperature control for semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 5, 2015·3 cites·11 claims
- 1880US2024379447A1Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1979US9000455B2Shadow mask assemblyTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Apr 7, 2015·5 cites·20 claims
- 2079US7776757B2Method of fabricating high-k metal gate devicesTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Aug 17, 2010·8 cites·21 claims
- 2178US10509311B1Apparatus and method for generating an electromagnetic radiationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 2278US8466063B2Integration of bottom-up metal film depositionLIN SIMON SU-HORNG·Filed 2011·Granted Jun 18, 2013·3 cites·20 claims
- 2378US8349628B2Methods of fabricating light emitting diode devicesTSMC SOLID STATE LIGHTING LTD·Filed 2011·Granted Jan 8, 2013·5 cites·20 claims
- 2477US7368379B2Multi-layer interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 6, 2008·5 cites·20 claims
- 2575US8609446B2Method and apparatus for accurate die-to-wafer bondingCHERN CHYI SHYUAN·Filed 2011·Granted Dec 17, 2013·3 cites·20 claims
- 2674US10760896B2Ellipsometer and method for estimating thickness of filmTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·20 claims
- 2774US8415684B2LED device with improved thermal performanceHSIA HSING-KUO·Filed 2010·Granted Apr 9, 2013·3 cites·18 claims
- 2873US12317576B2Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 27, 2025·0 cites·20 claims
- 2972US8993447B2LED device with improved thermal performanceTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Mar 31, 2015·2 cites·20 claims
- 3068US2023378003A1Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3167US11255658B2Ellipsometer and method for estimating thickness of filmTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·20 claims
- 3267US11004746B2Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·0 cites·20 claims
- 3366US9214543B2Integration of bottom-up metal film depositionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 15, 2015·1 cites·20 claims
- 3465US8722436B2Method and apparatus for accurate die-to-wafer bondingTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted May 13, 2014·1 cites·20 claims
- 3565US8188447B2Field-by-field laser annealing and feed forward process controlYANG CHUNG-RU·Filed 2009·Granted May 29, 2012·3 cites·21 claims
- 3664US11199767B2Apparatus and method for generating an electromagnetic radiationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 3764US8716128B2Methods of forming through silicon via openingsCHERN CHYI SHYUAN·Filed 2011·Granted May 6, 2014·1 cites·9 claims
- 3864US8404561B2Method for fabricating an isolation structureLEE TZE-LIANG·Filed 2010·Granted Mar 26, 2013·2 cites·20 claims
- 3963US12062582B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 13, 2024·0 cites·20 claims
- 4063US8962358B2Double substrate multi-junction light emitting diode array structureYU CHIH-KUANG·Filed 2011·Granted Feb 24, 2015·1 cites·21 claims
- 4161US9099632B2Light emitting diode emitter substrate with highly reflective metal bondingCHERN CHYI SHYUAN·Filed 2012·Granted Aug 4, 2015·1 cites·20 claims
- 4261US8241924B2Method and system for controlling an implantation processCHENG NAI-HAN·Filed 2009·Granted Aug 14, 2012·1 cites·13 claims
- 4360US11517995B2Wet chemical heating system and a method of chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 6, 2022·0 cites·20 claims
- 4460US7837850B2Electroplating systems and methodsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 23, 2010·3 cites·11 claims
- 4557US9287478B2Method and apparatus for accurate die-to-wafer bondingTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Mar 15, 2016·0 cites·20 claims
- 4657US8674451B2N/P metal crystal orientation for high-K metal gate Vt modulationLIN SIMON SU-HORNG·Filed 2008·Granted Mar 18, 2014·1 cites·6 claims
- 4756US9224636B2Methods of forming through silicon via openingsTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Dec 29, 2015·0 cites·15 claims
- 4856US2024371816A1Radiant substrate heating for thermocompressive bonding and apparatus for implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4953US11153957B2Apparatus and method for generating an electromagnetic radiationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 5053US9379299B2LED device with improved thermal performanceEPISTAR CORP·Filed 2015·Granted Jun 28, 2016·0 cites·20 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →