Inventor · disambiguated record
Chin Hui Chong
Also filed as: CHONG CHIN HUI
87 granted patents·27 pending applications·1,090 citations·filing 2004–2025
99Inventor score
Top patents by PatentIndex Score
114 records- 0199US7692931B2Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 6, 2010·108 cites·38 claims
- 0298US8148807B2Packaged microelectronic devices and associated systemsLEE CHOON KUAN·Filed 2010·Granted Apr 3, 2012·69 cites·15 claims
- 0398US8106491B2Methods of forming stacked semiconductor devices with a leadframe and associated assembliesCORISIS DAVID J·Filed 2007·Granted Jan 31, 2012·66 cites·19 claims
- 0498US7671459B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesMICRON TECHNOLOGIES INC·Filed 2006·Granted Mar 2, 2010·161 cites·11 claims
- 0598US7504284B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 17, 2009·85 cites·35 claims
- 0697US11282811B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 22, 2022·5 cites·20 claims
- 0797US8450839B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesCORISIS DAVID J·Filed 2010·Granted May 28, 2013·36 cites·8 claims
- 0897US7745920B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 29, 2010·48 cites·16 claims
- 0997US7557443B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 7, 2009·66 cites·42 claims
- 1097US7425758B2Metal core foldover package structuresMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·61 cites·53 claims
- 1197US7083425B2Slanted vias for electrical circuits on circuit boards and other substratesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 1, 2006·89 cites·39 claims
- 1295US7888185B2Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 15, 2011·43 cites·22 claims
- 1395US7767913B2Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 3, 2010·33 cites·28 claims
- 1495US7485969B2Stacked microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·37 cites·41 claims
- 1593US12237301B2Through stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 25, 2025·2 cites·20 claims
- 1693US8823159B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 2, 2014·12 cites·19 claims
- 1793US8115112B2Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substratesCORISIS DAVID J·Filed 2008·Granted Feb 14, 2012·22 cites·30 claims
- 1892US8940581B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesLEE CHOON KUAN·Filed 2011·Granted Jan 27, 2015·10 cites·13 claims
- 1991US8519523B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesYE SENG KIM DALSON·Filed 2011·Granted Aug 27, 2013·10 cites·24 claims
- 2091US8426743B2Electronic device assemblies including conductive vias having two or more conductive elementsCORISIS DAVID J·Filed 2010·Granted Apr 23, 2013·10 cites·17 claims
- 2190US9640458B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted May 2, 2017·7 cites·14 claims
- 2290US8030748B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2009·Granted Oct 4, 2011·12 cites·13 claims
- 2388US11929351B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 12, 2024·1 cites·20 claims
- 2488US8203213B2Methods for packaging microelectronic devices and microelectronic devices formed using such methodsLEE CHOON KUAN·Filed 2010·Granted Jun 19, 2012·8 cites·21 claims
- 2587US12148736B2Three-dimensional bonding scheme and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 19, 2024·1 cites·20 claims
- 2687US8138021B2Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor componentsCORISIS DAVID J·Filed 2010·Granted Mar 20, 2012·9 cites·21 claims
- 2784US11527459B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 13, 2022·1 cites·9 claims
- 2884US8507318B2Method for manufacturing microelectronic devicesYE SENG KIM DALSON·Filed 2009·Granted Aug 13, 2013·9 cites·21 claims
- 2982US8754537B2Build-up package for integrated circuit devices, and methods of making sameNG HONG WAN·Filed 2011·Granted Jun 17, 2014·4 cites·4 claims
- 3082US7759785B2Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 20, 2010·10 cites·18 claims
- 3181US7291900B2Lead frame-based semiconductor device packages incorporating at least one land grid array packageMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 6, 2007·9 cites·24 claims
- 3280US12315769B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2022·Granted May 27, 2025·0 cites·19 claims
- 3380US12243807B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 3479US12293992B2Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2023·Granted May 6, 2025·0 cites·19 claims
- 3578US2025259972A1Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3677US8322031B2Method of manufacturing an interposerCHONG CHIN HUI·Filed 2008·Granted Dec 4, 2012·7 cites·19 claims
- 3777US2025349656A1Apparatus including direct-contact heat paths and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3876US11894289B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 3976US8637987B2Semiconductor assemblies with multi-level substrates and associated methods of manufacturingCHONG CHIN HUI·Filed 2011·Granted Jan 28, 2014·4 cites·17 claims
- 4076US7435913B2Slanted vias for electrical circuits on circuit boards and other substratesMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 14, 2008·6 cites·14 claims
- 4176US2025336796A1Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4275US2025079405A1Three-dimensional bonding scheme and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4374US10431513B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 1, 2019·1 cites·14 claims
- 4474US2025309194A1Cross stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4573US11367667B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 21, 2022·0 cites·17 claims
- 4673US10593607B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2016·Granted Mar 17, 2020·1 cites·13 claims
- 4773US9583476B2Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2016·Granted Feb 28, 2017·1 cites·16 claims
- 4872US8445997B2Stacked packaged integrated circuit devicesCORISIS DAVID J·Filed 2012·Granted May 21, 2013·2 cites·10 claims
- 4972US7749808B2Stacked microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Jul 6, 2010·4 cites·21 claims
- 5071US7465607B2Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array packageMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 16, 2008·4 cites·17 claims
Showing the top 50 of 114 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →