Inventor · disambiguated record
Chi Ming Chong
Also filed as: CHONG CHI MING
9 granted patents·2 pending applications·124 citations·filing 2003–2014
89Inventor score
Top patents by PatentIndex Score
11 records- 0184US8470130B2Universal die detachment apparatusCHONG CHI MING·Filed 2010·Granted Jun 25, 2013·15 cites·18 claims
- 0284US8092645B2Control and monitoring system for thin die detachment and pick-upYIP SIU PING·Filed 2010·Granted Jan 10, 2012·17 cites·13 claims
- 0383US8141612B2Device for thin die detachment and pick-upCHAN MAN WAI·Filed 2009·Granted Mar 27, 2012·12 cites·16 claims
- 0482US8387851B1Apparatus for aligning a bonding tool of a die bonderYUNG CHUNG SHEUNG·Filed 2012·Granted Mar 5, 2013·9 cites·15 claims
- 0581US7240422B2Apparatus for semiconductor chip detachmentASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Jul 10, 2007·30 cites·16 claims
- 0680US9318362B2Die bonder and a method of cleaning a bond colletLEUNG MEI PO·Filed 2014·Granted Apr 19, 2016·15 cites·16 claims
- 0772US8875979B2Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuckYUNG CHUNG SHEUNG·Filed 2012·Granted Nov 4, 2014·4 cites·10 claims
- 0870US7182118B2Pick and place assembly for transporting a film of materialASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Feb 27, 2007·18 cites·12 claims
- 0946US8026126B2Apparatus and method for thin die detachmentASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Sep 27, 2011·4 cites·8 claims
- 1036US2005274457A1Peeling device for chip detachmentASM ASSEMBLY AUTOMATION LTD·Filed 2004·Application pending·0 cites
- 1132US2005034577A1Apparatus and method for indexing and severing filmASM ASSEMBLY AUTOMATION LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →