Inventor · disambiguated record
Chiu-Ming Chou
Also filed as: CHOU CHIU-MING
53 granted patents·4 pending applications·882 citations·filing 2003–2024
99Inventor score
Top patents by PatentIndex Score
57 records- 0198US7465654B2Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structuresMEGICA CORP·Filed 2005·Granted Dec 16, 2008·60 cites·20 claims
- 0296US8004092B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2008·Granted Aug 23, 2011·42 cites·42 claims
- 0396US7582966B2Semiconductor chip and method for fabricating the sameMEGICA CORP·Filed 2007·Granted Sep 1, 2009·35 cites·20 claims
- 0496US7397121B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2005·Granted Jul 8, 2008·49 cites·20 claims
- 0595US7470927B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2006·Granted Dec 30, 2008·30 cites·20 claims
- 0694US8362588B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2011·Granted Jan 29, 2013·14 cites·30 claims
- 0794US7271489B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2004·Granted Sep 18, 2007·69 cites·58 claims
- 0892US7947978B2Semiconductor chip with bond areaMEGICA CORP·Filed 2006·Granted May 24, 2011·27 cites·20 claims
- 0992US7452803B2Method for fabricating chip structureMEGICA CORP·Filed 2005·Granted Nov 18, 2008·20 cites·21 claims
- 1091US7960269B2Method for forming a double embossing structureMEGICA CORP·Filed 2006·Granted Jun 14, 2011·21 cites·23 claims
- 1191US7547969B2Semiconductor chip with passivation layer comprising metal interconnect and contact padsMEGICA CORP·Filed 2005·Granted Jun 16, 2009·22 cites·20 claims
- 1290US8836146B2Chip package and method for fabricating the sameCHOU CHIEN-KANG·Filed 2007·Granted Sep 16, 2014·26 cites·48 claims
- 1390US8399989B2Metal pad or metal bump over pad exposed by passivation layerLIN MOU-SHIUNG·Filed 2006·Granted Mar 19, 2013·20 cites·40 claims
- 1490US8022544B2Chip structureMEGICA CORP·Filed 2005·Granted Sep 20, 2011·17 cites·39 claims
- 1590US7855461B2Chip structure with bumps and testing padsMEGICA CORP·Filed 2008·Granted Dec 21, 2010·19 cites·37 claims
- 1690US7372161B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2004·Granted May 13, 2008·58 cites·33 claims
- 1789US12176278B23D chip package based on vertical-through-via connectorICOMETRUE CO LTD·Filed 2022·Granted Dec 24, 2024·1 cites·27 claims
- 1889US7423346B2Post passivation interconnection process and structuresMEGICA CORP·Filed 2004·Granted Sep 9, 2008·48 cites·17 claims
- 1988US8319354B2Semiconductor chip with post-passivation scheme formed over passivation layerLIN MOU-SHIUNG·Filed 2011·Granted Nov 27, 2012·8 cites·33 claims
- 2086US7508059B2Stacked chip package with redistribution linesMEGICA CORP·Filed 2006·Granted Mar 24, 2009·12 cites·20 claims
- 2186US7416971B2Top layers of metal for integrated circuitsMEGICA CORP·Filed 2004·Granted Aug 26, 2008·36 cites·18 claims
- 2284US8148822B2Bonding pad on IC substrate and method for making the sameLIN MOU-SHIUNG·Filed 2006·Granted Apr 3, 2012·12 cites·32 claims
- 2384US7482268B2Top layers of metal for integrated circuitsMEGICA CORP·Filed 2007·Granted Jan 27, 2009·9 cites·17 claims
- 2484US7381642B2Top layers of metal for integrated circuitsMEGICA CORP·Filed 2004·Granted Jun 3, 2008·29 cites·48 claims
- 2584US7355282B2Post passivation interconnection process and structuresMEGICA CORP·Filed 2004·Granted Apr 8, 2008·31 cites·36 claims
- 2683US8426958B2Stacked chip package with redistribution linesLIN MOU-SHIUNG·Filed 2011·Granted Apr 23, 2013·5 cites·26 claims
- 2783US7964973B2Chip structureMEGICA CORP·Filed 2008·Granted Jun 21, 2011·8 cites·64 claims
- 2882US8592977B2Integrated circuit (IC) chip and method for fabricating the sameCHOU CHIU-MING·Filed 2007·Granted Nov 26, 2013·11 cites·22 claims
- 2982US8304907B2Top layers of metal for integrated circuitsLIN MOU-SHIUNG·Filed 2007·Granted Nov 6, 2012·8 cites·20 claims
- 3082US7985653B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2008·Granted Jul 26, 2011·8 cites·29 claims
- 3182US7462558B2Method for fabricating a circuit componentMEGICA CORP·Filed 2008·Granted Dec 9, 2008·7 cites·21 claims
- 3281US8304766B2Semiconductor chip with a bonding pad having contact and test areasLIN MOU-SHIUNG·Filed 2011·Granted Nov 6, 2012·5 cites·21 claims
- 3381US7973401B2Stacked chip package with redistribution linesMEGICA CORP·Filed 2008·Granted Jul 5, 2011·8 cites·23 claims
- 3479US8552559B2Very thick metal interconnection scheme in IC chipsLIN MOU-SHIUNG·Filed 2005·Granted Oct 8, 2013·9 cites·88 claims
- 3579US7521805B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2007·Granted Apr 21, 2009·7 cites·20 claims
- 3679US7394161B2Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested theretoMEGICA CORP·Filed 2003·Granted Jul 1, 2008·24 cites·43 claims
- 3778US8581404B2Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structuresCHOU CHIU-MING·Filed 2008·Granted Nov 12, 2013·7 cites·23 claims
- 3878US8242601B2Semiconductor chip with passivation layer comprising metal interconnect and contact padsCHOU CHIU-MING·Filed 2009·Granted Aug 14, 2012·7 cites·33 claims
- 3977US8159074B2Chip structureLIN MOU-SHIUNG·Filed 2011·Granted Apr 17, 2012·3 cites·32 claims
- 4077US2025125241A13d chip package based on vertical-through-via connectorICOMETRUE CO LTD·Filed 2024·Application pending·0 cites
- 4175US8198729B2Connection between a semiconductor chip and a circuit component with a large contact areaCHOU CHIU-MING·Filed 2005·Granted Jun 12, 2012·7 cites·29 claims
- 4274US8519552B2Chip structureLIN MOU-SHIUNG·Filed 2011·Granted Aug 27, 2013·3 cites·21 claims
- 4374US7977803B2Chip structure with bumps and testing padsMEGICA CORP·Filed 2010·Granted Jul 12, 2011·3 cites·20 claims
- 4473US8013449B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2008·Granted Sep 6, 2011·4 cites·20 claims
- 4573US7592205B2Over-passivation process of forming polymer layer over IC chipMEGICA CORP·Filed 2005·Granted Sep 22, 2009·4 cites·20 claims
- 4673US7417317B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2007·Granted Aug 26, 2008·4 cites·38 claims
- 4771US8018060B2Post passivation interconnection process and structuresMEGICA CORP·Filed 2008·Granted Sep 13, 2011·4 cites·40 claims
- 4868US8168527B2Semiconductor chip and method for fabricating the sameLIN MOU-SHIUNG·Filed 2009·Granted May 1, 2012·3 cites·40 claims
- 4968US8120181B2Post passivation interconnection process and structuresLIN MOU-SHIUNG·Filed 2008·Granted Feb 21, 2012·3 cites·10 claims
- 5062US8344524B2Wire bonding method for preventing polymer crackingMEGICA CORP·Filed 2006·Granted Jan 1, 2013·2 cites·20 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →