Inventor · disambiguated record
Chin-Lung Chu
Also filed as: Chu Chin-Lung
15 granted patents·6 pending applications·24 citations·filing 2017–2018
88Inventor score
Files withNANYA TECHNOLOGY CORP21
Top patents by PatentIndex Score
21 records- 0193US9935071B1Semiconductor package with lateral bump structureNANYA TECHNOLOGY CORP·Filed 2017·Granted Apr 3, 2018·9 cites·10 claims
- 0288US9893037B1Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereofNANYA TECHNOLOGY CORP·Filed 2017·Granted Feb 13, 2018·6 cites·20 claims
- 0385US10068865B1Combing bump structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2017·Granted Sep 4, 2018·4 cites·3 claims
- 0477US10825794B2Method for preparing a semiconductor apparatusNANYA TECHNOLOGY CORP·Filed 2018·Granted Nov 3, 2020·1 cites·4 claims
- 0576US10170432B2Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2017·Granted Jan 1, 2019·2 cites·15 claims
- 0668US9966363B1Semiconductor apparatus and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2017·Granted May 8, 2018·1 cites·18 claims
- 0767US10050021B1Die device, semiconductor device and method for making the sameNANYA TECHNOLOGY CORP·Filed 2017·Granted Aug 14, 2018·1 cites·15 claims
- 0863US10923455B2Semiconductor apparatus and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2018·Granted Feb 16, 2021·0 cites·4 claims
- 0958US2018233480A1Semiconductor apparatus and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 1057US10607858B2Semiconductor method for forming semiconductor structure having bump on tilting upper corner surfaceNANYA TECHNOLOGY CORP·Filed 2018·Granted Mar 31, 2020·0 cites·3 claims
- 1156US10566294B2Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2018·Granted Feb 18, 2020·0 cites·16 claims
- 1256US2018233479A1Semiconductor apparatus and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 1352US10446514B2Combing bump structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2018·Granted Oct 15, 2019·0 cites·4 claims
- 1452US10192853B2Method for preparing a semiconductor apparatusNANYA TECHNOLOGY CORP·Filed 2017·Granted Jan 29, 2019·0 cites·2 claims
- 1551US10290512B2Semiconductor structure having bump on tilting upper corner surfaceNANYA TECHNOLOGY CORP·Filed 2017·Granted May 14, 2019·0 cites·8 claims
- 1649US2018204814A1Method for preparing a semiconductor packageNANYA TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 1746US9905549B1Semiconductor apparatus and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2017·Granted Feb 27, 2018·0 cites·17 claims
- 1843US10373932B2Stacked semiconductor structureNANYA TECHNOLOGY CORP·Filed 2017·Granted Aug 6, 2019·0 cites·18 claims
- 1937US2018233485A1Semiconductor structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 2037US2018233484A1Semiconductor structure and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 2137US2018315725A1Package structure having bump with protective anti-oxidation coatingNANYA TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →