Inventor · disambiguated record
Chun-Chih Chuang
Also filed as: CHUANG CHUN-CHIH
17 granted patents·8 pending applications·71 citations·filing 2009–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13APPLIED MATERIALS INC5TAIWAN SEMICONDUCTOR MFG3CHENG JUNG-WEI2IND TECH RES INST1
Top patents by PatentIndex Score
25 records- 0196US9564416B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·25 cites·20 claims
- 0293US8704354B2Package on package structures and methods for forming the sameCHENG JUNG WEI·Filed 2012·Granted Apr 22, 2014·14 cites·20 claims
- 0391US11894312B2Semiconductor packages and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·1 cites·20 claims
- 0490US9006032B2Package on package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 14, 2015·9 cites·20 claims
- 0587US8658464B2Mold chase design for package-on-package applicationsCHENG JUNG WEI·Filed 2011·Granted Feb 25, 2014·10 cites·18 claims
- 0685US9691723B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·3 cites·20 claims
- 0782US2025309130A1Three-dimensional (3d) packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0881US12424562B2Three-dimensional (3D) packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 0981US9837292B2Underfill dispensing with controlled fillet profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 5, 2017·3 cites·20 claims
- 1080US11688693B2Semiconductor packages and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 27, 2023·1 cites·18 claims
- 1177US9859267B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·2 cites·20 claims
- 1275US2022359436A1Connector Formation Methods and Packaged Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1371US9177835B1Underfill dispensing with controlled fillet profileTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 3, 2015·2 cites·19 claims
- 1471US2025390026A1Lithography processes for dual damascene structuresAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1570US2025068082A1Gray tone uniformity control over substrate topographyAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1668US2025334888A1Digital lithography overlay metrologyAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1766US11424199B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 1865US9318465B2Methods for forming a semiconductor device packageTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 19, 2016·1 cites·20 claims
- 1964US12140871B2Gray tone uniformity control over substrate topographyAPPLIED MATERIALS INC·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 2063US12189299B2Digital lithography scan sequencingAPPLIED MATERIALS INC·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 2162US2025362450A1Semiconductor device and forming metho of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2259US10522486B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·20 claims
- 2355US2024178102A1Package including backside connector and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2445US2010207266A1Chip package structureIND TECH RES INST·Filed 2009·Application pending·0 cites
- 2524US10091892B2Laser direct imaging system and method for solder mask exposureSHUZ TUNG MACHINERY IND CO LTD·Filed 2016·Granted Oct 2, 2018·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →