Inventor · disambiguated record
Charlotte Emnet
Also filed as: EMNET CHARLOTTE
15 granted patents·16 pending applications·17 citations·filing 2008–2022
86Inventor score
Files withBASF SE18ROEGER-GOEPFERT CORNELIA10ADVANCED MICRO DEVICES INC1PREUSSE AXEL1SIEMER MICHAEL1
Top patents by PatentIndex Score
31 records- 0189US9758885B2Composition for metal electroplating comprising leveling agentBASF SE·Filed 2013·Granted Sep 12, 2017·6 cites·16 claims
- 0276US9869029B2Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Granted Jan 16, 2018·4 cites·22 claims
- 0375US9631292B2Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect featuresROEGER-GOEPFERT CORNELIA·Filed 2012·Granted Apr 25, 2017·4 cites·20 claims
- 0472US11486049B2Composition for metal electroplating comprising leveling agentBASF SE·Filed 2019·Granted Nov 1, 2022·0 cites·16 claims
- 0571US2022298664A1Composition for Cobalt Electroplating Comprising Leveling AgentBASF SE·Filed 2022·Application pending·0 cites
- 0666US11926918B2Composition for metal plating comprising suppressing agent for void free filingBASF SE·Filed 2017·Granted Mar 12, 2024·1 cites·17 claims
- 0766US11377748B2Composition for cobalt electroplating comprising leveling agentBASF SE·Filed 2018·Granted Jul 5, 2022·0 cites·12 claims
- 0865US9011666B2Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2009·Granted Apr 21, 2015·2 cites·20 claims
- 0965US2020173029A1Composition for metal plating comprising suppressing agent for void free submicron feature fillingBASF SE·Filed 2020·Application pending·0 cites
- 1061US2021317582A1Composition for metal plating comprising suppressing agent for void free submicron feature fillingBASF SE·Filed 2021·Application pending·0 cites
- 1158US2021040635A1Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2020·Application pending·0 cites
- 1256US9834677B2Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2011·Granted Dec 5, 2017·0 cites·28 claims
- 1355US2025051949A1Alkaline composition for copper electroplating comprising a grain refinerBASF SE·Filed 2022·Application pending·0 cites
- 1454US7981793B2Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambientADVANCED MICRO DEVICES INC·Filed 2008·Granted Jul 19, 2011·0 cites·22 claims
- 1551US2013264213A1Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2011·Application pending·0 cites
- 1650US12098473B2Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2019·Granted Sep 24, 2024·0 cites·19 claims
- 1750US2023203694A1Alkaline composition for copper electroplating comprising a grain refinerBASF SE·Filed 2021·Application pending·0 cites
- 1849US2022356592A1Composition for copper bump electrodeposition comprising a leveling agentBASF SE·Filed 2020·Application pending·0 cites
- 1948US9683302B2Composition for metal electroplating comprising leveling agentSIEMER MICHAEL·Filed 2011·Granted Jun 20, 2017·0 cites·19 claims
- 2048US2019226107A1Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2017·Application pending·0 cites
- 2147US2009061629A1Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambientPREUSSE AXEL·Filed 2008·Application pending·0 cites
- 2247US2025051950A1Alkaline composition for copper electroplating comprising a defect reduction agentBASF SE·Filed 2022·Application pending·0 cites
- 2345US12134834B2Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agentBASF SE·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 2443US2012018310A1Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Application pending·0 cites
- 2543US2023203695A1Alkaline Composition For Copper Electroplating Comprising A Defect Reduction AgentBASF SE·Filed 2021·Application pending·0 cites
- 2643US2012024711A1Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Application pending·0 cites
- 2741US2023265576A1Composition For Copper Electroplating On A Cobalt SeedBASF SE·Filed 2021·Application pending·0 cites
- 2839US11387108B2Composition for metal electroplating comprising leveling agentBASF SE·Filed 2018·Granted Jul 12, 2022·0 cites·17 claims
- 2939US9617647B2Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Granted Apr 11, 2017·0 cites·20 claims
- 3037US9598540B2Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2010·Granted Mar 21, 2017·0 cites·21 claims
- 3134US2012027948A1Composition for metal plating comprising suppressing agent for void free submicron feature fillingROEGER-GOEPFERT CORNELIA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →