Inventor · disambiguated record
Christopher R. Fairley
Also filed as: FAIRLEY CHRISTOPHER R
17 granted patents·1,267 citations·filing 1989–2008
96Inventor score
Top patents by PatentIndex Score
17 records- 0198US5479252ALaser imaging system for inspection and analysis of sub-micron particlesULTRAPOINTE CORP·Filed 1993·Granted Dec 26, 1995·343 cites·29 claims
- 0297US6288780B1High throughput brightfield/darkfield wafer inspection system using advanced optical techniquesKLA TENCOR TECH CORP·Filed 1997·Granted Sep 11, 2001·207 cites·26 claims
- 0397US5963314ALaser imaging system for inspection and analysis of sub-micron particlesULTRAPOINTE CORP·Filed 1996·Granted Oct 5, 1999·258 cites·51 claims
- 0495US6816249B2High throughput brightfield/darkfield wafer inspection system using advanced optical techniquesKLA TENCOR CORP·Filed 2001·Granted Nov 9, 2004·49 cites·35 claims
- 0595US5672861AMethod and apparatus for automatic focusing of a confocal laser microscopeULTRAPOINTE CORP·Filed 1995·Granted Sep 30, 1997·163 cites·30 claims
- 0692US7554655B2High throughput brightfield/darkfield water inspection system using advanced optical techniquesKLA TENCOR CORP·Filed 2008·Granted Jun 30, 2009·16 cites·21 claims
- 0792US6867406B1Confocal wafer inspection method and apparatus using fly lens arrangementKLA TENCOR CORP·Filed 2000·Granted Mar 15, 2005·43 cites·32 claims
- 0890US5783814AMethod and apparatus for automatically focusing a microscopeULTRAPOINTE CORP·Filed 1996·Granted Jul 21, 1998·86 cites·22 claims
- 0989US7858911B2Confocal wafer inspection system and methodKLA TENCOR CORP·Filed 2008·Granted Dec 28, 2010·15 cites·19 claims
- 1089US7109458B2Confocal wafer depth scanning inspection methodKLA TENCOR CORP·Filed 2005·Granted Sep 19, 2006·15 cites·20 claims
- 1186US7164475B2High throughput brightfield/darkfield wafer inspection system using advanced optical techniquesKLA TENCOR TECH CORP·Filed 2004·Granted Jan 16, 2007·17 cites·32 claims
- 1278US7399950B2Confocal wafer inspection method and apparatus using fly lens arrangementKLA TENCOR CORP·Filed 2006·Granted Jul 15, 2008·6 cites·19 claims
- 1377US7379173B2High throughput brightfield/darkfield wafer inspection system using advanced optical techniquesKLA TENCOR CORP·Filed 2004·Granted May 27, 2008·9 cites·25 claims
- 1474US7259844B2High throughput darkfield/brightfield wafer inspection system using advanced optical techniquesKLA TENCOR CORP·Filed 2007·Granted Aug 21, 2007·2 cites·20 claims
- 1574US5019786APhase measurement system using a dithered clockUS ENERGY·Filed 1989·Granted May 28, 1991·28 cites·20 claims
- 1670US7522275B2High throughput darkfield/brightfield wafer inspection system using advanced optical techniquesKLA TENCOR CORP·Filed 2007·Granted Apr 21, 2009·1 cites·20 claims
- 1736US5557113AMethod and structure for generating a surface image of a three dimensional targetULTRAPOINTE CORP·Filed 1994·Granted Sep 17, 1996·9 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →