Inventor · disambiguated record
Charles C. Garretson
Also filed as: GARRETSON CHARLES C
38 granted patents·6 pending applications·350 citations·filing 1998–2025
97Inventor score
Top patents by PatentIndex Score
44 records- 0198US11260500B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·4 cites·9 claims
- 0296US10766117B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2018·Granted Sep 8, 2020·5 cites·3 claims
- 0396US8066551B2Retaining ring with shaped surfaceCHEN HUNG CHIH·Filed 2011·Granted Nov 29, 2011·14 cites·19 claims
- 0495US11931853B2Control of processing parameters for substrate polishing with angularly distributed zones using cost functionAPPLIED MATERIALS INC·Filed 2022·Granted Mar 19, 2024·2 cites·19 claims
- 0595US9138860B2Closed-loop control for improved polishing pad profilesDHANDAPANI SIVAKUMAR·Filed 2011·Granted Sep 22, 2015·23 cites·20 claims
- 0695US9017138B2Retaining ring monitoring and control of pressureAPPLIED MATERIALS INC·Filed 2013·Granted Apr 28, 2015·14 cites·18 claims
- 0794US8585468B2Retaining ring with shaped surfaceCHEN HUNG CHIH·Filed 2011·Granted Nov 19, 2013·8 cites·5 claims
- 0894US7344434B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2004·Granted Mar 18, 2008·33 cites·15 claims
- 0993US8190285B2Feedback for polishing rate correction in chemical mechanical polishingQIAN JUN·Filed 2010·Granted May 29, 2012·10 cites·20 claims
- 1093US6572446B1Chemical mechanical polishing pad conditioning element with discrete points and compliant membraneAPPLIED MATERIALS INC·Filed 2000·Granted Jun 3, 2003·46 cites·42 claims
- 1191US11400560B2Retaining ring designAPPLIED MATERIALS INC·Filed 2018·Granted Aug 2, 2022·6 cites·20 claims
- 1290US7927190B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2008·Granted Apr 19, 2011·9 cites·19 claims
- 1390US6551176B1Pad conditioning diskAPPLIED MATERIALS INC·Filed 2000·Granted Apr 22, 2003·53 cites·23 claims
- 1489US9242337B2Dynamic residue clearing control with in-situ profile control (ISPC)APPLIED MATERIALS INC·Filed 2014·Granted Jan 26, 2016·8 cites·20 claims
- 1588US10589399B2Textured small pad for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Mar 17, 2020·3 cites·5 claims
- 1688US9937601B2Retaining ring with Shaped SurfaceAPPLIED MATERIALS INC·Filed 2015·Granted Apr 10, 2018·4 cites·13 claims
- 1788US6855043B1Carrier head with a modified flexible membraneAPPLIED MATERIALS INC·Filed 2000·Granted Feb 15, 2005·33 cites·4 claims
- 1887US11850703B2Method of forming retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2023·Granted Dec 26, 2023·0 cites·20 claims
- 1987US6913518B2Profile control platenAPPLIED MATERIALS INC·Filed 2003·Granted Jul 5, 2005·25 cites·15 claims
- 2084US2025319568A1Control of processing parameters for substrate polishing with substrate precessionAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2183US11577361B2Retaining ring with shaped surface and method of formingAPPLIED MATERIALS INC·Filed 2022·Granted Feb 14, 2023·0 cites·4 claims
- 2278US10256111B2Chemical mechanical polishing automated recipe generationAPPLIED MATERIALS INC·Filed 2017·Granted Apr 9, 2019·3 cites·18 claims
- 2377US9186773B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2013·Granted Nov 17, 2015·2 cites·13 claims
- 2476US12251788B2Polishing head with local wafer pressureAPPLIED MATERIALS INC·Filed 2024·Granted Mar 18, 2025·0 cites·20 claims
- 2575US11282755B2Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2019·Granted Mar 22, 2022·1 cites·14 claims
- 2675US2024087965A1Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2773US12343840B2Control of processing parameters for substrate polishing with substrate precessionAPPLIED MATERIALS INC·Filed 2022·Granted Jul 1, 2025·0 cites·17 claims
- 2873US6220941B1Method of post CMP defect stability improvementAPPLIED MATERIALS INC·Filed 1998·Granted Apr 24, 2001·35 cites·21 claims
- 2972US11869815B2Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2022·Granted Jan 9, 2024·0 cites·13 claims
- 3071US8758085B2Method for compensation of variability in chemical mechanical polishing consumablesDHANDAPANI SIVAKUMAR·Filed 2011·Granted Jun 24, 2014·3 cites·13 claims
- 3170US8337279B2Closed-loop control for effective pad conditioningDHANDAPANI SIVAKUMAR·Filed 2009·Granted Dec 25, 2012·4 cites·20 claims
- 3267US8467896B2Feedback for polishing rate correction in chemical mechanical polishingQIAN JUN·Filed 2012·Granted Jun 18, 2013·1 cites·21 claims
- 3367US2022339755A1Retaining ring designAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3465US11986923B2Polishing head with local wafer pressureAPPLIED MATERIALS INC·Filed 2021·Granted May 21, 2024·0 cites·11 claims
- 3564US11241769B2Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processesAPPLIED MATERIALS INC·Filed 2018·Granted Feb 8, 2022·0 cites·15 claims
- 3658US10252397B2Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processesAPPLIED MATERIALS INC·Filed 2015·Granted Apr 9, 2019·0 cites·9 claims
- 3758US8755927B2Feedback for polishing rate correction in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2013·Granted Jun 17, 2014·0 cites·20 claims
- 3858US2020282506A1Spiral and concentric movement designed for cmp location specific polish (lsp)APPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3955US10434623B2Local area polishing system and polishing pad assemblies for a polishing systemAPPLIED MATERIALS INC·Filed 2017·Granted Oct 8, 2019·0 cites·19 claims
- 4051US2018250788A1Spiral and concentric movement designed for cmp location specific polish (lsp)APPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 4148US7115024B2Profile control platenAPPLIED MATERIALS INC·Filed 2005·Granted Oct 3, 2006·0 cites·17 claims
- 4239US2013122783A1Pad conditioning force modeling to achieve constant removal rateMENK GREGORY E·Filed 2011·Application pending·0 cites
- 4338US10610994B2Polishing system with local area rate control and oscillation modeAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·0 cites·20 claims
- 4438US6855031B2Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducerAPPLIED MATERIALS INC·Filed 2003·Granted Feb 15, 2005·1 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →