Inventor · disambiguated record
Ching-Hua Hsieh
Also filed as: HSIEH CHING-HUA
211 granted patents·95 pending applications·1,285 citations·filing 2001–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD257TAIWAN SEMICONDUCTOR MFG34METAL IND RES & DEV CT3CHANG CHUNG-LIANG2LU HSIAO-TZU2
Top patents by PatentIndex Score
306 records- 0199US7235482B2Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technologyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 26, 2007·532 cites·23 claims
- 0298US9818729B1Package-on-package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·35 cites·20 claims
- 0397US12057359B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0497US11417698B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0597US11251141B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0697US10014260B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·14 cites·20 claims
- 0796US11688725B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 27, 2023·2 cites·20 claims
- 0896US11177156B2Semiconductor package, manufacturing method of semiconductor device and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·10 cites·20 claims
- 0996US10566261B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·20 claims
- 1096US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 1196US8361900B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·36 cites·23 claims
- 1295US11862577B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 1395US10636715B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·5 cites·20 claims
- 1495US10276536B2Structure and formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·8 cites·20 claims
- 1595US9984960B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·14 cites·20 claims
- 1695US8940635B1Structure and method for forming interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·21 cites·20 claims
- 1795US7193327B2Barrier structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 20, 2007·43 cites·17 claims
- 1894US10867932B2Method for manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·3 cites·20 claims
- 1994US9614052B2Copper contact plugs with barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·9 cites·17 claims
- 2094US7700479B2Cleaning processes in the formation of integrated circuit interconnect structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 20, 2010·33 cites·12 claims
- 2193US11088124B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 10, 2021·7 cites·20 claims
- 2293US10366966B1Method of manufacturing integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 30, 2019·8 cites·20 claims
- 2392US11756872B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 2492US11217555B2Aligning bumps in fan-out packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 4, 2022·7 cites·20 claims
- 2592US11211341B2Package structure and method of fabrcating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·6 cites·20 claims
- 2692US10157862B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·7 cites·20 claims
- 2792US8629058B2Methods for via structure with improved reliabilitySHUE SHAU-LIN·Filed 2012·Granted Jan 14, 2014·13 cites·20 claims
- 2891US12368086B2Package structure having thermoelectric coolerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·20 claims
- 2991US11764127B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 3091US11705409B2Semiconductor device having antenna on chip package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 3191US11171090B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·6 cites·20 claims
- 3291US10879192B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·10 cites·13 claims
- 3391US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 3491US10128193B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·8 cites·20 claims
- 3591US9887072B2Systems and methods for integrated resputtering in a physical vapor deposition chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 6, 2018·4 cites·20 claims
- 3691US6806192B2Method of barrier-less integration with copper alloyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 19, 2004·45 cites·32 claims
- 3790US11456226B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·2 cites·20 claims
- 3890US10515900B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 3990US7704886B2Multi-step Cu seed layer formation for improving sidewall coverageTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 27, 2010·16 cites·19 claims
- 4090US2025349808A1Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4188US10283377B1Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·6 cites·13 claims
- 4288US10157846B2Method for forming chip package involving cutting processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
- 4388US6492269B1Methods for edge alignment mark protection during damascene electrochemical plating of copperTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 10, 2002·50 cites·31 claims
- 4487US12358194B2Molded semiconductor device and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 4587US11404381B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·20 claims
- 4687US10535609B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·3 cites·20 claims
- 4787US2025303621A1Molding apparatus and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4887US2025357422A1Method and apparatus for bonding semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4986US12444719B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 5086US12431446B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
Showing the top 50 of 306 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →